Patents by Inventor Seoh Hian Teh

Seoh Hian Teh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE WITH INTERIOR LEADS
    Publication number: 20150206829
    Abstract: A packaged semiconductor device has a lead frame, a semiconductor die, and bond wires. The lead frame has a two-dimensional array of leads with a subset of interior leads located in the interior of the array that do not extend to the perimeter of the array. The bond wires are connected to the semiconductor die and respective ones of the leads of the array.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 23, 2015
    Inventors: Yin Kheng Au, Seoh Hian Teh, Jia Lin Yap, Pey Fang Hiew, Ly Hoon Khoo
  • ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE AND AN ELECTRICAL CONDUCTOR WITHIN A VIA AND A PROCESS OF FORMING THE SAME
    Publication number: 20110115069
    Abstract: An electronic device can include a packaging substrate that including an organic material and a hole extending into the packaging substrate. An electrically conductive member can include a via within the hole, and a lead lying along a major surface of the packaging substrate and electrically connected to the via. In an embodiment, the electrically conductive material can be plated, printed, or otherwise formed within and over the organic material, and a leadframe and a corresponding formation of a molding compound around the leadframe are not necessary.
    Type: Application
    Filed: January 29, 2010
    Publication date: May 19, 2011
    Inventors: Serene Seoh Hian Teh, Won Yun Sung, Atapol Prajuckamol