Abstract: An organic electroluminescence display device includes: a substrate; a first electrode including a first sub-electrode and a second sub-electrode spaced apart from each other and on the substrate; a first light emitting unit on the first electrode; a charge generation unit on the first light emitting unit; a second light emitting unit on the charge generation unit; and a second electrode on the second light emitting unit, wherein the first light emitting unit comprises a first light emitting layer correspondingly on the first sub-electrode; and a second light emitting layer correspondingly on the second sub-electrode, wherein the second light emitting unit comprises a third light emitting layer correspondingly on the first light emitting layer; and a fourth light emitting layer correspondingly on the second light emitting layer.

Abstract: An apparatus for processing a substrate may include a wet chamber, a dry chamber, a first transfer robot and a shared shutter. The wet chamber may be configured to process the substrate using a chemical. The dry chamber may be adjacent the wet chamber and configured to dry the substrate processed by the wet chamber. The first transfer robot may be configured to transfer the substrate between the wet chamber and the dry chamber. The shared shutter may be between the wet chamber and the dry chamber. A connection opening through which the substrate may be transferred may be formed between the wet chamber and the dry chamber. The shared shutter may be configured to open and close the connection opening.

Abstract: An electronic device package includes: a board including first surface and a second surface facing away from each other, and including a first layer adjacent to the first surface and a second layer adjacent to the second surface, wherein a step portion is formed on a side surface between the first layer and the second layer; an electronic device mounted on the first surface; an antenna layer formed in the second layer or on the second surface; a molded portion formed to cover the electronic device on the first surface; and a conductive film formed to cover a surface of the molded portion and a side surface of the first layer, and including an end portion positioned at the step portion.

Abstract: An electronic device package includes: a board including first surface and a second surface facing away from each other, and including a first layer adjacent to the first surface and a second layer adjacent to the second surface, wherein a step portion is formed on a side surface between the first layer and the second layer; an electronic device mounted on the first surface; an antenna layer formed in the second layer or on the second surface; a molded portion formed to cover the electronic device on the first surface; and a conductive film formed to cover a surface of the molded portion and a side surface of the first layer, and including an end portion positioned at the step portion.