Patents by Inventor Seok Ahn

Seok Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070254930
    Abstract: The present invention relates to an oral preparation of N-hydroxy-4-{5-[4-(5-isopropyl-2-methyl-1,3-thiazol-4-yl) phenoxy]pentoxyl-benzamidine having improved bioavailability. More particularly, the present invention relates to an oral preparation comprising: N-hydroxy-4-{5-[4-(5-isopropyl-2-methyl-1,3-thiazol-4-yl) phenoxy]pentoxy}-benzamidine or pharmaceutically acceptable salt thereof; and one or more carbonates selected from the group consisting of alkalimetal carbonate, alkalimetal bicarbonate and alkaline earth metal carbonate, and/or one or more disintegrants selected from the group consisting of sodium starch glycolate, carmellose calcium and croscarmellose sodium. The oral preparation according to the present invention inhibits gelation of N-hydroxy-4-{5-[4-(5-isopropyl-2-methyl-1,3-thiazol-4-yl) phenoxy]pentoxy}-benzamidine or pharmaceutically acceptable salt thereof in the early stage of release, which increases dissolution rate and remarkably raises bioavailability.
    Type: Application
    Filed: November 22, 2005
    Publication date: November 1, 2007
    Applicant: DONG WHA PHARM. IND. CO., LTD.
    Inventors: Jei Ryu, Soon Cho, Se Jung, Seung-Kyoo Seong, Eun Cho, Seok Ahn, Yun-Jung Kim
  • Publication number: 20060121255
    Abstract: Disclosed is a parallel multilayer printed circuit board (MLB), in which conductivity is provided to a through hole, formed through an interlayer connection layer, using a pair of via posts formed on circuit layers, and a method of fabricating the same. The parallel MLB comprises insulating layers through which a plurality of through holes is formed. A pair of circuit layers is laminated on the insulating layers. The via posts, made of a conductive material, protrude from the circuit layers such that the via posts correspond in position to the through holes of the insulating layers, and are in contact with each other to provide interlayer connection.
    Type: Application
    Filed: March 21, 2005
    Publication date: June 8, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Nam, Seung Kim, Seok Ahn