Patents by Inventor Seok-Bonk Kim

Seok-Bonk Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110049686
    Abstract: A semiconductor package is provided. The semiconductor package includes a carrier, a die, a metal sheet and a molding compound. The die is disposed on the carrier. The metal sheet has a first portion and a second portion, wherein a receiving space is defined by the first portion and the second portion, and the second portion is electrically connected to the carrier. The molding compound covers the die and the receiving space is filled by at least part of the molding compound.
    Type: Application
    Filed: September 3, 2009
    Publication date: March 3, 2011
    Inventors: Yeon-Sun YUN, Seok-Bonk Kim