Abstract: A substrate processing apparatus includes a process chamber having a space in which a substrate is disposed and processed in the process chamber, a supporter disposed in the process chamber and configured to support and rotate the substrate, a heater disposed in the process chamber and configured to heat a first surface of the substrate, where the heater includes one or more irradiation modules for generating light pulses and directing the light pulses to the first surface of the substrate, a controller configured to control an intensity of the light pulse generated by each of the one or more irradiation modules of the heater, and a fluid supplier configured to supply fluid to the first surface of the substrate.

Abstract: Provided are a wafer cleaning device and a method of optimizing the same. The wafer cleaning device includes an upper nozzle configured to spray a cleaning solution onto a front surface of a wafer, a spin chuck provided below the wafer to rotate the wafer and configured to heat a central region of the wafer, and a plurality of lower nozzles provided below the wafer to spray a temperature control liquid having a higher temperature than the cleaning solution onto a rear surface of the wafer, the plurality of lower nozzles configured to heat an outer region of the wafer that surrounds the central region of the wafer. A temperature gradient formed by the spin chuck and the plurality of lower nozzles causes a cleaning solution to flow in a cleaning solution layer on the front surface of the wafer.

Abstract: The present disclosure relates a refrigerator including cabinet forming a storage space; and a door configured to open and close the storage space; in which the door includes an outer plate forming a front surface of the door and having an opening; a panel assembly mounted to the opening; a door liner forming a rear surface of the door; and a support frame configured to support a rear surface of the panel assembly; in which the panel assembly includes a front panel forming a front surface; an adiabatic panel disposed at the rear spaced apart from the front panel; a rear panel forming a rear surface; and an interstitial rod disposed between the front panel and the adiabatic panel, and in which the support frame includes a panel support portion formed along the circumference of the front panel; a heater accommodation groove recessed from a front surface to a rear surface of the panel support portion to accommodate a heater configured to heat the front panel; and a heater restraint portion protruding from one su

Abstract: A substrate processing method, comprising: using an exposure apparatus to process a substrate; and cleaning an extreme ultraviolet (EUV) source of the exposure apparatus, wherein cleaning an extreme ultraviolet (EUV) source comprising: spraying a cleaning solution on an inner surface of a housing of an EUV source; cleaning the inner surface of the housing; and aspirating a material produced from the cleaning of the inner surface of the housing, wherein the housing includes an internal space defined by the inner surface of the housing, wherein the internal space becoming narrower in a first direction, and wherein the cleaning solution includes sodium hydroxide (NaOH).

Abstract: An AC power output device includes a switching component connected to each of a plurality of batteries and configured to turn ON or OFF an electrical connection between a corresponding battery and another battery depending on an operational state, a filter component configured to receive an output voltage from the plurality of batteries, to adjust a polarity of the output voltage from the plurality of batteries according to an operational state, and to output the voltage of the adjusted polarity, and a controller configured to control the operational states of the switching component and the filter component so that the AC power is output from the plurality of batteries.

Abstract: A substrate supporting member and a substrate processing apparatus including the same are provided. The substrate supporting member includes a plate having at least one heating zone. A heating member is on a first surface of the plate and located in the at least one heating zone. The heating member extends along a circumferential direction of the plate and is configured to heat a substrate supported by the plate. A first electrode is on the first surface of the plate and is connected to an inner side surface of the heating member. A second electrode is on the first surface of the plate and is connected to an outer side surface of the heating member. The heating member has a stair-step configuration such that a thickness of the heating member increases from the second electrode toward the first electrode.

Abstract: The present invention relates to a test handler for graphics chip including a loading unit performing a loading process of loading a graphics chip which is to be tested, an unloading unit performing an unloading process of unloading a tested graphics chip, a test unit testing the graphics chip which is to be tested, a buffer unit transferring a graphics chip between the loading unit and the test unit and transferring a graphics chip between the unloading unit and the test unit, wherein the test unit includes a commercial graphics card which is the same as a practically used graphics card and a contact unit connecting the commercial graphics card to the graphics chip which is to be tested.

Abstract: A substrate processing method includes: performing a first post-exposure baking process on a photoresist layer that was previously exposed to for extreme ultraviolet (EUV) exposed to EUV; developing the photoresist layer using a first developing solution having a first temperature; performing a second post-exposure baking process on the photoresist layer; developing the photoresist layer using a second developing solution having a second temperature, higher than the first temperature; and forming a photoresist pattern by performing a hard baking process on the photoresist layer.

Abstract: The disclosed technology generally relates to forming a titanium nitride-based thin films, and more particularly to a conformal and smooth titanium nitride-based thin films and methods of forming the same. In one aspect, a method of forming a thin film comprising one or both of TiSiN or TiAlN comprises exposing a semiconductor substrate to one or more vapor deposition cycles at a pressure in a reaction chamber greater than 1 torr, wherein a plurality of the vapor deposition cycles comprises an exposure to a titanium (Ti) precursor, an exposure to a nitrogen (N) precursor and an exposure to one or both of a silicon (Si) precursor or an aluminum (Al) precursor.

Abstract: Provided is an apparatus for battery diagnosis and module state change device capable of receiving power from a battery module through a connector connection with a battery module and operating, changing a diagnosis reference value for diagnosing, by a battery management system (BMS), a battery, and changing a setting value of the BMS to change a use of the battery module.

Abstract: A substrate processing system includes a cluster module having substrate processing devices, a load port through which a substrate is loaded, and a substrate cleaning device between the cluster module and the load port, the substrate cleaning device being configured to clean the substrate processed in the substrate processing devices, and the substrate cleaning device including a substrate cleaner having a cleaning chuck to support the substrate, and a cleaning nozzle configured to spray a fluid toward the cleaning chuck.

Abstract: A photolithography apparatus according to an embodiment includes an exposure portion performing an exposure process, a plurality of track portions each performing a coating process and a developing process, and an interface portion connecting the exposure portion and the plurality of track portions to transfer a substrate on which a photolithography process is performed between the exposure portion and the plurality of track portions.

Abstract: A printed circuit board with an embedded bridge includes: a first connection structure including a first insulating film; a bridge disposed on the first connection structure and having one surface, in contact with the first insulating film; and a second connection structure disposed on the first connection structure, and including a second insulating film. The second insulating film covers at least a portion of the other surface of the bridge.

Abstract: The disclosed technology generally relates to a barrier layer comprising titanium silicon nitride, and more particularly to a barrier layer for nonvolatile memory devices, and methods of forming the same. In one aspect, a method of forming an electrode for a phase change memory device comprises forming over a semiconductor substrate an electrode comprising titanium silicon nitride (TiSiN) on a phase change storage element configured to store a memory state. Forming the electrode comprises exposing a semiconductor substrate to one or more cyclical vapor deposition cycles, wherein a plurality of the cyclical vapor deposition cycles comprises an exposure to a Ti precursor, an exposure to a N precursor and an exposure to a Si precursor.

Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.

Abstract: A liquefied gas storage tank includes a corner block disposed on a corner portion, wherein the corner block includes a lower block, an upper block and an upper connecting block, the upper block includes a first inner fixing unit and a second inner fixing unit respectively provided inside a first surface and a second surface, bonded and connected to a secondary barrier, and each having a structure in which a primary inner plywood, a primary corner insulating material, and a primary outer plywood are stacked, and an inner bent portion installed at a corner spatial portion between the first inner fixing unit and the second inner fixing unit, and both side surfaces of the inner bent portion that are perpendicular to the secondary barrier each have a height reduced from a total height of each of the first and second inner fixing units.

Abstract: Disclosed is a device and method for monitoring a common mode voltage. There is provided the device for monitoring a common mode voltage including an input end connected to a node between an energy storage device and a power conversion device, a voltage divider that divides a voltage applied to the input end, a comparator that compares an output of the voltage divider and a reference voltage, and a controller that detects an abnormality in a voltage applied from the power conversion device to the energy storage device based on an output of the comparator.

Abstract: A post baking apparatus comprising a baking chamber configured to receive a substrate with an exposed photoresist film, a lower heater in the baking chamber under the substrate to heat the exposed photoresist film, an applier applying an electric field or a magnetic field to the exposed photoresist film along a vertical direction, which is substantially perpendicular to an upper surface of the exposed photoresist film, to control diffusions of an acid or a secondary electron, which are generated from the exposed photoresist film, along a horizontal direction, and a controller configured to control an operation of the applier.

Abstract: A liquefied gas storage tank includes a corner block disposed on a corner portion, wherein the corner block includes a lower block, an upper block and an upper connecting block, the upper block includes a first inner fixing unit and a second inner fixing unit respectively provided inside a first surface and a second surface, bonded and connected to a secondary barrier, and each having a structure in which a primary inner plywood, a primary corner insulating material, and a primary outer plywood are stacked, and an inner bent portion installed at a corner spatial portion between the first inner fixing unit and the second inner fixing unit, and both side surfaces of the inner bent portion that are perpendicular to the secondary barrier each have a height reduced from a total height of each of the first and second inner fixing units.