Abstract: The present disclosure discloses a fluoroalkyl glycerin derivative usable as an excellent surfactant by having functional groups and the number of carbon atoms controlled in the molecular structure, and its use as a surfactant. A fluoroalkyl glycerin derivative according to the present disclosure is used as a fluorine-based nonionic surfactant, and replaces existing fluoro compounds as well as having excellent surfactant properties compared to existing surfactants having a linear alkyl group.

Abstract: The present disclosure discloses a method for preparing a hybrid-type fluorine-based nonionic surfactant capable of producing a high purity material in a high yield. By preparing a hybrid-type fluorine-based nonionic surfactant according to the present disclosure, the surfactant is mass-produced in a high yield through controlling reaction conditions including a solvent.

Abstract: The present disclosure relates to an apparatus for preparing super-absorbent polymer (SAP) and a method for preparing SAP using the same. The apparatus for preparing SAP includes, a belt formed between two or more rotary shafts and traveling in a predetermined direction upon the rotation of the rotary shafts; and a feeding unit feeding a monomer composition to the belt, wherein the belt includes recess patterns at a bottom thereof.

Abstract: The present invention relates to an apparatus for cutting a super absorbent polymer and a method for preparing a super absorbent polymer using the same. The apparatus for cutting a super absorbent polymer of the present invention includes: an injection part for injecting a super absorbent polymer; a first cutter for primarily cutting the super absorbent polymer; a second cutter for secondarily cutting the super absorbent polymer; and a discharging part for discharging the cut super absorbent polymer.

Abstract: The present invention relates to a super absorbent resin cutting device and a super absorbent resin manufacturing method using the same. The super absorbent resin cutting device according to the present invention includes: an introduction unit for introducing a super absorbent resin; a cutter for cutting the super absorbent resin into pieces; and a discharge unit for discharging the super absorbent resin that has been cut.

Abstract: The present invention relates to a method for preparing a superabsorbent polymer. The method for preparing a superabsorbent according to the present invention includes the steps of: polymerizing a monomer composition into a superabsorbent polymer in a polymerization reactor; grinding the obtained superabsorbent polymer; and hydrolyzing the fine particles generated during the process and reusing the same for the monomer composition.

Abstract: The present invention relates to a method for preparing a superabsorbent polymer. The method for preparing a superabsorbent polymer according to the present invention includes the steps of: polymerizing monomer compositions in at least two polymerization reactors; grinding the polymers obtained in the polymerization step; drying the polymers; and mixing the polymers.

Abstract: An apparatus for manufacturing a super absorbent polymer, including: a belt installed over two or more rotary shafts and moved in a predetermined direction by the rotation of the rotary shafts; a supply unit supplying a monomer composition to the belt; and a cover covering at least a part of the belt and passing the belt from one side thereof to the other side thereof, wherein the belt includes a horizontal bottom, and lateral jaws provided at both ends of the belt at an angle of 30° to 70° to the horizontal bottom, and the cover includes heat inlets for supplying heat into the cover at both lateral sides thereof.

Abstract: There is provided a conductive ink composition for offset or reverse-offset printing, the conductive ink composition including a high boiling point solvent having a boiling point of 180 to 250° C. and a dispersion assistant solvent having a boiling point of 50 to 150° C., together with metal particles and tert-butyl alcohol as a main solvent.

Abstract: The present invention relates to a method for manufacturing a conductive metal thin film, including: preparing a conductive metal coating solution by adding carboxylic acid to a dispersion including a conductive metal particle having a core/shell structure; coating the conductive metal coating solution on a top portion of a substrate, heat-treating it, and removing an metal oxide layer of the surface of the conductive metal particle having the core/shell structure; and forming a thin film of the conductive metal particle from which the metal oxide layer is removed.

Abstract: Disclosed herein is a conductive particle, including: a base particle containing a metal; a seed particle formed on a surface of the base particle; and a first metal layer formed on the base particle, wherein the first metal layer includes a protrusion surrounding the seed particle. The conductive particle has excellent specific resistance characteristics when it is sintered because it has nanosized protrusions formed on the surface of a metal base particle.

Abstract: Provided is a method for preparing an aqueous dispersion of metal nanoparticles having superior dispersibility and being sinterable at low temperature by modifying the surface of metal nanoparticles having hydrophobic groups with hydrophilic groups. Specifically, by treating the surface hydrophobic groups of the metal nanoparticles with a surface modification solution containing a surfactant and a wetting-dispersing agent, the treatment throughput can be improved about 10-fold and the particles can be monodispersed without agglomeration. Further, by using an antioxidant and a ligand removal agent in the solution, denaturation and oxidation of the particles can be prevented and the high-boiling-point hydrophobic ligands can be eliminated effectively. The hydrophilically treated metal nanoparticles may be dispersed in an aqueous-based solvent to prepare a metal ink sinterable at low temperature.

Abstract: Disclosed herein is a conductive particle, including: a base particle containing a metal; a seed particle formed on a surface of the base particle; and a first metal layer formed on the base particle, wherein the first metal layer includes a protrusion surrounding the seed particle. The conductive particle has excellent specific resistance characteristics when it is sintered because it has nanosized protrusions formed on the surface of a metal base particle.

Abstract: There is provided a conductive ink composition for offset or reverse-offset printing, the conductive ink composition including a high boiling point solvent having a boiling point of 180 to 250° C. and a dispersion assistant solvent having a boiling point of 50 to 150° C., together with metal particles and tert-butyl alcohol as a main solvent.

Abstract: The present invention relates to a method for manufacturing a conductive metal thin film, including: preparing a conductive metal coating solution by adding carboxylic acid to a dispersion including a conductive metal particle having a core/shell structure; coating the conductive metal coating solution on a top portion of a substrate, heat-treating it, and removing an metal oxide layer of the surface of the conductive metal particle having the core/shell structure; and forming a thin film of the conductive metal particle from which the metal oxide layer is removed.

Abstract: Provided is a method for preparing an aqueous dispersion of metal nanoparticles having superior dispersibility and being sinterable at low temperature by modifying the surface of metal nanoparticles having hydrophobic groups with hydrophilic groups. Specifically, by treating the surface hydrophobic groups of the metal nanoparticles with a surface modification solution containing a surfactant and a wetting-dispersing agent, the treatment throughput can be improved about 10-fold and the particles can be monodispersed without agglomeration. Further, by using an antioxidant and a ligand removal agent in the solution, denaturation and oxidation of the particles can be prevented and the high-boiling-point hydrophobic ligands can be eliminated effectively. The hydrophilically treated metal nanoparticles may be dispersed in an aqueous-based solvent to prepare a metal ink sinterable at low temperature.

Abstract: The present invention relates to a method of producing electroconductive electroless plating powder having excellent dispersibility and adherence, and, more particularly, to a method of producing electroconductive electroless plating powder having excellent dispersibility and adherence, using an electroless plating method of forming a metal plating layer on the surface of a base material made of resin powder in an electroless plating solution, wherein an ultrasonic treatment is performed at the time of forming the plating layer. The present invention has advantages in that an aggregation phenomenon, which is generated when the base material made of the resin powder is plated using an electroless plating method, does not occur and a plating reaction can be performed at low temperature, so that it is possible to obtain a compact plating layer and plating powder having improved uniformity and adherence with respect to resin powder.

Abstract: Disclosed herein are acryl microbeads having a narrow particle size distribution and a method of preparing the same. In a method of preparing acryl microbeads through polymerization by stirring a polymerization composition containing vinyl acrylate monomers, an initiator and a dispersion stabilizer at a high speed to form microdroplets and increasing a reaction temperature to induce the polymerization reaction of the monomers within the microdroplets, a low molecular weight seed particle capable of absorbing vinyl acrylate monomers dissolved in a reaction medium outside the microdroplets is supplied at the time of the polymerization reaction, and thus the acryl microbeads have a narrow particle size distribution. The microbeads, which are almost completely free of fine and coarse particles and thus need no sorting process, which range in size from 1 to 50 ?m, and which have a narrow particle size distribution can be prepared at a high yield without using a polymerization inhibitor.