Patents by Inventor Seok Hoon Kang

Seok Hoon Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966768
    Abstract: Disclosed herein are an apparatus and method for a multi-cloud service platform. The apparatus includes one or more processors and executable memory for storing at least one program executed by the one or more processors. The at least one program may receive a service request from a user client device, generate a multi-cloud infrastructure service using multiple clouds in response to the service request, make the multiple clouds interoperate with mufti-cloud infrastructure in order to provide the multi-cloud infrastructure service, and generate a multi-cloud application runtime environment corresponding to the multi-cloud infrastructure service.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: April 23, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Seok-Ho Son, Dong-Jae Kang, Byoung-Seob Kim, Seung-Jo Bae, Ji-Hoon Seo, Byeong-Thaek Oh, Kure-Chel Lee, Young-Woo Jung
  • Patent number: 11961457
    Abstract: A display device, includes: a display panel including a pixel electrically coupled to a gate line and a data line; a gate driver configured to provide a gate signal to the gate line; and a data driver configured to provide a data signal to the data line, wherein the gate driver is configured to sequentially provide a first gate signal and a second gate signal to the gate line during a first frame period, wherein the data driver is configured to provide a first data signal to the data line in response to the first gate signal, and to provide a second data signal to the data line in response to the second gate signal, and wherein the second data signal is different from the first data signal and varies dependent on the first data signal.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: April 16, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jae Hyun Koh, Sung Hoon Bang, Eui Myeong Cho, Ho Cheol Kang, Seok Young Yoon
  • Patent number: 9564567
    Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: February 7, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jun Seok Park, Seok Hoon Kang
  • Patent number: 8721117
    Abstract: A lighting device comprises: a first substrate comprising a first connector and a first connection terminal, the first connector being connected to an external power supply or driving device, the first connection terminal being electrically connected to the first connector; and a second substrate connected electrically to the first connection terminal and comprising a light emitting device.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: May 13, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Seok Hoon Kang, Jun Seok Park
  • Patent number: 8395178
    Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: March 12, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jun Seok Park, Seok Hoon Kang
  • Patent number: 8178894
    Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: May 15, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jun Seok Park, Seok Hoon Kang
  • Patent number: 7977699
    Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: July 12, 2011
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jun Seok Park, Seok Hoon Kang
  • Publication number: 20100277948
    Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
    Type: Application
    Filed: June 28, 2010
    Publication date: November 4, 2010
    Inventors: Jun Seok Park, Seok Hoon Kang
  • Publication number: 20100238674
    Abstract: A lighting device comprises: a first substrate comprising a first connector and a first connection terminal, the first connector being connected to an external power supply or driving device, the first connection terminal being electrically connected to the first connector; and a second substrate connected electrically to the first connection terminal and comprising a light emitting device.
    Type: Application
    Filed: August 20, 2008
    Publication date: September 23, 2010
    Inventors: Seok Hoon Kang, Jun Seok Park
  • Publication number: 20100232177
    Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
    Type: Application
    Filed: May 26, 2010
    Publication date: September 16, 2010
    Inventors: Jun Seok Park, Seok Hoon Kang
  • Patent number: D575750
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: August 26, 2008
    Assignee: LG Innotek Co., Ltd.
    Inventor: Seok Hoon Kang