Patents by Inventor Seok-Hwan Ahn
Seok-Hwan Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136113Abstract: A coil component includes: a body having first and second recesses on outer surfaces, and including magnetic powder particles; a support member disposed in the body; a coil disposed on the support member; and first and second external electrodes disposed on one surface of the body and respectively extending to the first and second recesses to be connected to the coil, wherein the body is divided into a first region and a second region, an average diameter of the magnetic powder particles included in the second region is smaller than an average diameter of the magnetic powder particles included in the first region, and the first and second recesses are disposed in the second region.Type: ApplicationFiled: September 17, 2023Publication date: April 25, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byeong Cheol MOON, In Young KANG, Seok Hwan AHN, Boum Seock KIM
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Patent number: 11600430Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.Type: GrantFiled: August 4, 2020Date of Patent: March 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Yoon Jang, Seok Hwan Ahn, Jeong Min Cho, Tae Hoon Kim, Jin Gul Hyun, Se Woong Paeng
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Publication number: 20200365313Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.Type: ApplicationFiled: August 4, 2020Publication date: November 19, 2020Inventors: Jong Yoon JANG, Seok Hwan AHN, Jeong Min CHO, Tae Hoon KIM, Jin Gul HYUN, Se Woong PAENG
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Patent number: 10763031Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.Type: GrantFiled: August 15, 2017Date of Patent: September 1, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Yoon Jang, Seok Hwan Ahn, Jeong Min Cho, Tae Hoon Kim, Jin Gul Hyun, Se Woong Paeng
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Patent number: 10650958Abstract: A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.Type: GrantFiled: August 9, 2016Date of Patent: May 12, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Hui Jo, Han Lee, Mi Sun Hwang, Jeong Min Cho, Myung Sam Kang, Seok Hwan Ahn, Tae Hoon Kim
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Patent number: 10455708Abstract: A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting point metal layer having a melting point lower than a melting point of the conductive pattern and a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer.Type: GrantFiled: November 13, 2017Date of Patent: October 22, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seok-Hwan Ahn, Mi-Sun Hwang, Young-Gwan Ko, Jong-Seok Bae, Myung-Sam Kang
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Patent number: 10356916Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an inner layer including at least one insulating layer and wiring parts, and outer layers disposed on opposing sides of the inner layer, the outer layers including reinforcing layers and wiring parts, the reinforcing layers having a greater degree of rigidity than the insulating layer.Type: GrantFiled: April 29, 2016Date of Patent: July 16, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Sang Yul Ha, Sung Han Kim, Kyung Ho Lee, Seok Hwan Ahn, Myung Sam Kang
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Patent number: 10098232Abstract: Disclosed is an embedded board and a method of manufacturing the same. The embedded board may include an insulating layer a first circuit layer formed inside the insulating layer a second circuit layer formed on an upper part of the first circuit layer, and the second circuit layer being disposed inside the insulating layer, a first electronic element arranged inside the insulating layer, the first electronic element being spaced apart from the second circuit layer, a metal pillar formed between the first circuit layer and the second circuit layer or the first electronic element, and a first via formed on the upper part of the second circuit layer inside the insulating layer.Type: GrantFiled: January 7, 2016Date of Patent: October 9, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Joon-Sung Lee, Yong-Sam Lee, Seok-Hwan Ahn, Jae-Hoon Choi
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Patent number: 10045436Abstract: A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.Type: GrantFiled: November 11, 2014Date of Patent: August 7, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Suk Hyeon Cho, Hyo Seung Nam, Yong Sam Lee, Seok Hwan Ahn
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Publication number: 20180070458Abstract: A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting point metal layer having a melting point lower than a melting point of the conductive pattern and a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer.Type: ApplicationFiled: November 13, 2017Publication date: March 8, 2018Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seok-Hwan AHN, Mi-Sun HWANG, Young-Gwan KO, Jong-Seok BAE, Myung-Sam KANG
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Publication number: 20180061555Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.Type: ApplicationFiled: August 15, 2017Publication date: March 1, 2018Inventors: Jong Yoon JANG, Seok Hwan AHN, Jeong Min CHO, Tae Hoon KIM, Jin Gul HYUN, Se Woong PAENG
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Patent number: 9832866Abstract: A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.Type: GrantFiled: June 29, 2016Date of Patent: November 28, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seok-Hwan Ahn, Mi-Sun Hwang, Young-Gwan Ko, Jong-Seok Bae, Myung-Sam Kang
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Publication number: 20170301453Abstract: A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.Type: ApplicationFiled: August 9, 2016Publication date: October 19, 2017Inventors: Dae Hui JO, Han LEE, Mi Sun HWANG, Jeong Min CHO, Myung Sam KANG, Seok Hwan AHN, Tae Hoon KIM
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Patent number: 9706644Abstract: A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disposed on the insulating substrate, a pair of first reinforcements spatially separated in the insulating substrate, the first reinforcements extending parallel to a surface of the insulating substrate, and a second reinforcement configured to connect the pair of first reinforcements.Type: GrantFiled: March 30, 2016Date of Patent: July 11, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung-Han Kim, Han Kim, Mi-Sun Hwang, Sang-Yul Ha, Seok-Hwan Ahn, Kyung-Ho Lee
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Publication number: 20170055345Abstract: A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disposed on the insulating substrate, a pair of first reinforcements spatially separated in the insulating substrate, the first reinforcements extending parallel to a surface of the insulating substrate, and a second reinforcement configured to connect the pair of first reinforcements.Type: ApplicationFiled: March 30, 2016Publication date: February 23, 2017Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung-Han KIM, Han KIM, Mi-Sun HWANG, Sang-Yul HA, Seok-Hwan AHN, Kyung-Ho LEE
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Publication number: 20160381791Abstract: A printed circuit board and a method of manufacturing the same are provided.Type: ApplicationFiled: April 29, 2016Publication date: December 29, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Han KIM, Sang Yul HA, Sung Han KIM, Kyung Ho LEE, Seok Hwan AHN, Myung Sam KANG
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Publication number: 20160381794Abstract: A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.Type: ApplicationFiled: June 29, 2016Publication date: December 29, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seok-Hwan AHN, Mi-Sun HWANG, Young-Gwan KO, Jong-Seok BAE, Myung-Sam KANG
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Publication number: 20160219709Abstract: Disclosed is an embedded board and a method of manufacturing the same. The embedded board may include an insulating layer a first circuit layer formed inside the insulating layer a second circuit layer formed on an upper part of the first circuit layer, and the second circuit layer being disposed inside the insulating layer, a first electronic element arranged inside the insulating layer, the first electronic element being spaced apart from the second circuit layer, a metal pillar formed between the first circuit layer and the second circuit layer or the first electronic element, and a first via formed on the upper part of the second circuit layer inside the insulating layer.Type: ApplicationFiled: January 7, 2016Publication date: July 28, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Joon-Sung LEE, Yong-Sam LEE, Seok-Hwan AHN, Jae-Hoon CHOI
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Publication number: 20150129293Abstract: A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.Type: ApplicationFiled: November 11, 2014Publication date: May 14, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Suk Hyeon CHO, Hyo Seung NAM, Yong Sam LEE, Seok Hwan AHN
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Patent number: 8604345Abstract: A printed circuit board having a plating pattern buried in a via. The printed circuit board has: an insulating substrate including an electrically insulating resin; a via hole passing through the insulating substrate; a via including a metal layer formed on an inner wall of the via hole and a filler charged in the via hole; a circuit layer including a circuit pattern buried in the insulating substrate and transmitting an electrical signal; and a plating pattern buried in an end of the filler.Type: GrantFiled: January 20, 2012Date of Patent: December 10, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seok Hwan Ahn, Young Gwan Ko