Patents by Inventor Seok Jae YOO

Seok Jae YOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250085674
    Abstract: Provided are a scalable analog passive intermodulation (PIM) module, a method of controlling analog PIM, a signal processing circuit, and a sensor device. The scalable analog PIM module includes a first plural number of digital-to-analog converters (DACs), a first plural number of static random access memory (SRAM) calculators connected to the first plural number of DACs, at least one analog-to-digital converter (ADC) connected to the first plural number of SRAM calculators and configured to convert an analog convolution result signal into digital convolution data, and an analog PIM controller configured to output an enable control signal for enabling a second number, which is equal to or less than first plural number, of SRAM calculators among the first plural number of SRAM calculators to the first plural number of SRAM calculators on the basis of the convolution data output from the ADC.
    Type: Application
    Filed: November 22, 2024
    Publication date: March 13, 2025
    Applicants: SKAIChips Co., Ltd., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Kang Yoon LEE, Jong Wan JO, Sung June BYUN, Dae Young CHOI, Young Gun PU, Joon Mo YOO, Yeon Jae JUNG, Hyung Ki HUH, Seok Kee KIM
  • Publication number: 20170313870
    Abstract: The present disclosure relates to a polycarbonate-ABS based alloy resin composition having superior plating adhesion and a molded article manufactured therefrom. In accordance with the present disclosure, a polycarbonate-ABS based alloy resin composition having superior plating adhesion as well as superior mechanical properties, and a molded article including the polycarbonate-ABS based alloy resin composition.
    Type: Application
    Filed: September 26, 2016
    Publication date: November 2, 2017
    Inventors: Jae Hwan KIM, Myeung II KIM, Seok Jae YOO, Sung Ho LEE, Sung Tae AHN, Min Ho JEONG