Patents by Inventor Seok Joon Moon
Seok Joon Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9627360Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: September 12, 2016Date of Patent: April 18, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Publication number: 20170018535Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: September 12, 2016Publication date: January 19, 2017Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Patent number: 9449716Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: May 22, 2015Date of Patent: September 20, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Patent number: 9171644Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: May 7, 2015Date of Patent: October 27, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Publication number: 20150257255Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: May 22, 2015Publication date: September 10, 2015Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Publication number: 20150243371Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: May 7, 2015Publication date: August 27, 2015Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Patent number: 9069036Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: December 12, 2013Date of Patent: June 30, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Patent number: 8917107Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: July 31, 2012Date of Patent: December 23, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Publication number: 20140097865Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: December 12, 2013Publication date: April 10, 2014Applicant: Samsung Electronics Co., Ltd.Inventors: Sang-Guk Han, Seok-Joon Moon
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Publication number: 20130043601Abstract: Disclosed is a memory card which includes a universal PCB including a first pad group and a second pad group, the first and second pad groups being connected to each other via one or more PCB wires, a first semiconductor chip electrically connected with at least one pad of the first pad group via a first bonding wire, and a second semiconductor chip electrically connected with at least one pad of the second pad groups via a second bonding wire, wherein the first bonding wire or the second bonding wire is changed according to a combination of the first and second semiconductor chips without a change in the PCB wires.Type: ApplicationFiled: August 2, 2012Publication date: February 21, 2013Inventors: Seok-Joon MOON, In-Jae Lee, So-Young Jung
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Publication number: 20120292091Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: July 31, 2012Publication date: November 22, 2012Inventors: Sang-Guk Han, Seok-Joon Moon
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Patent number: 8248093Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: July 16, 2010Date of Patent: August 21, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Guk Han, Seok-Joon Moon
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Patent number: 8203355Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: October 22, 2010Date of Patent: June 19, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Guk Han, Seok-Joon Moon
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Patent number: 8139363Abstract: A memory card includes a substrate, at least one semiconductor chip attached to the substrate, a writing permitting/prohibiting setting element attached to the substrate, and a molding member formed on the substrate to cover the semiconductor chip.Type: GrantFiled: June 8, 2009Date of Patent: March 20, 2012Assignee: Samsung Electronics Co., Ltd.Inventor: Seok-joon Moon
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Publication number: 20110037491Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: October 22, 2010Publication date: February 17, 2011Inventors: Sang-Guk Han, Seok-Joon Moon
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Patent number: 7872483Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: September 4, 2008Date of Patent: January 18, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Guk Han, Seok-Joon Moon
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Publication number: 20100289157Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: July 16, 2010Publication date: November 18, 2010Inventors: Sang-Guk Han, Seok-Joon Moon
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Publication number: 20090323294Abstract: A memory card includes a substrate, at least one semiconductor chip attached to the substrate, a writing permitting/prohibiting setting element attached to the substrate, and a molding member formed on the substrate to cover the semiconductor chip.Type: ApplicationFiled: June 8, 2009Publication date: December 31, 2009Applicant: Samsung Electronics Co., LtdInventor: Seok-joon MOON
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Patent number: 7576488Abstract: Disclosed is a multi-typed plasma display panel for preventing internal penetration of a seal line by forming a barrier rib in a vertical direction, in a horizontal direction or in both directions. In the multi-typed plasma display panel, a barrier rib is formed according to a cross-section in a vertical direction, in a horizontal direction or in both directions so that a seal line of the cross-section is prevented from being penetrated internally. In the horizontal direction, an auxiliary barrier rib may be further formed outside the barrier rib. Additionally, a dielectric of the rear panel is removed as large as an area separated from the cross-section in a predetermined distance so that the seal line may be formed in a condition where a glass is exposed.Type: GrantFiled: December 24, 2003Date of Patent: August 18, 2009Assignee: Orion PDP Co., Ltd.Inventors: Gwon Jin Moon, Gwang Pyo Choi, Seok Joon Moon, Hea Sung Jang
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Publication number: 20090153163Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: September 4, 2008Publication date: June 18, 2009Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Guk HAN, Seok-Joon MOON