Patents by Inventor Seok-Keun Lim

Seok-Keun Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure
    Patent number: 8552546
    Abstract: Provided is a semiconductor package. The semiconductor package may include a first semiconductor package having first semiconductor chips sequentially stacked on a substrate. In example embodiments, the first semiconductor chips may have a cascaded arrangement in which first sides and second sides of the semiconductor chips define cascade patterns. The cascaded arrangement may extend in a first direction to define a space between the first sides of the first semiconductor chips and the substrate. The semiconductor package may also include at least one first connection wiring at the second sides of the semiconductor chips, the at least one first connection wiring being configured to electrically connect the substrate with the first semiconductor chips. In addition, the semiconductor package may further include a first filling auxiliary structure adjacent to the first sides of the first semiconductor chips.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: October 8, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: In-Sang Song, Seok-Keun Lim, In-Wook Jung, Bong-Ken Yu, Sang-Wook Park, Ji-Seok Hong
  • SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SEMICONDUCTOR PACKAGE, AND MOBILE PHONE INCLUDING THE SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20110079890
    Abstract: Provided is a semiconductor package. The semiconductor package may include a first semiconductor package having first semiconductor chips sequentially stacked on a substrate. In example embodiments, the first semiconductor chips may have a cascaded arrangement in which first sides and second sides of the semiconductor chips define cascade patterns. The cascaded arrangement may extend in a first direction to define a space between the first sides of the first semiconductor chips and the substrate. The semiconductor package may also include at least one first connection wiring at the second sides of the semiconductor chips, the at least one first connection wiring being configured to electrically connect the substrate with the first semiconductor chips. In addition, the semiconductor package may further include a first filling auxiliary structure adjacent to the first sides of the first semiconductor chips.
    Type: Application
    Filed: October 1, 2010
    Publication date: April 7, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: In-Sang Song, Seok-Keun Lim, In-Wook Jung, Bong-Ken Yu, Sang-Wook Park, Ji-Seok Hong