Patents by Inventor Seok Kim Tay

Seok Kim Tay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200253051
    Abstract: A method includes providing an electrically conductive layer structure on top of an electrically insulating layer structure, forming a window in the electrically conductive layer structure and removing material of the electrically insulating layer structure below the window by a first laser beam, and subsequently removing further material of the electrically insulating layer structure below the window by a second laser beam having a smaller size than a size of the window.
    Type: Application
    Filed: January 28, 2020
    Publication date: August 6, 2020
    Inventors: Seok Kim Tay, Abderrazzaq Ifis, Haina Wu
  • Publication number: 20200253053
    Abstract: A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 ?m and a narrowest vertical thickness of the bridge structure is at least 20 ?m.
    Type: Application
    Filed: January 30, 2020
    Publication date: August 6, 2020
    Inventors: Ismadi Bin Ismail, Valerian Yun Khim Chung, Alex Yucun Dou, Seok Kim Tay
  • Publication number: 20200253062
    Abstract: A component carrier includes an electrically insulating layer structure with a first main surface and a second main surface, a through hole extends through the electrically insulating layer structure between the first main surface and the second main surface. The through hole has a first tapering portion extending from the first main surface and a second tapering portion extending from the second main surface. The through hole is delimited by a first plating structure on at least part of the sidewalls of the electrically insulating layer structure and a second plating structure formed separately from and arranged on the first plating structure. The second plating structure includes an electrically conductive bridge structure connecting the opposing sidewalls.
    Type: Application
    Filed: January 30, 2020
    Publication date: August 6, 2020
    Inventors: Robin Zhang, Seok Kim Tay
  • Publication number: 20200163206
    Abstract: An electronic package having a base structure; a layer stack formed over the base structure; and a component embedded at least partially within the base structure and/or within the layer stack. The layer stack has a decoupling layer structure, the decoupling layer structure with a decoupling material having a Young Modulus being smaller than 1 GPa.
    Type: Application
    Filed: November 18, 2019
    Publication date: May 21, 2020
    Inventors: Mikael Tuominen, Seok Kim Tay
  • Publication number: 20200163223
    Abstract: A method of manufacturing first and second component carriers includes: i) providing a separation component comprising a first separation surface and a second separation surface being opposed to the first separation surface, ii) coupling a first base structure having a first cavity with the first separation surface, iii) coupling a second base structure having a second cavity with the second separation surface, iv) placing a first electronic component in the first cavity, v) connecting the first base structure with the first electronic component to form the first component carrier, vi) placing a second electronic component in the second cavity, vii) connecting the second base structure with the second electronic component to form the second component carrier, viii) separating the first component carrier from the first separation surface of the separation component, and ix) separating the second component carrier from the second separation surface of the separation component.
    Type: Application
    Filed: November 19, 2019
    Publication date: May 21, 2020
    Inventors: Jeesoo Mok, Seok Kim Tay, Mikael Tuominen, Yu-Hui Wu
  • Publication number: 20200163205
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component embedded in the stack so that a gap of less than 100 ?m, in particular less than 60 ?m, remains between at least one sidewall of the component and a sidewall of an adjacent one of the layer structures or a further component embedded in the stack; and a filler medium including filler particles, wherein the filler medium at least partially fills the gap. In addition, a method of manufacturing a component carrier is provided.
    Type: Application
    Filed: November 12, 2019
    Publication date: May 21, 2020
    Inventors: Seok Kim Tay, Mikael Tuominen