Abstract: Disclosed herein is a multi-channel device for detecting plasma at an ultra-fast speed, including: a first antenna module connected to a first output terminal in contact with a substrate on a chuck of a process chamber and extending to ground, and receiving a first leakage current leaking through the substrate to increase reception sensitivity of the leakage current; a first current detection module detecting the first leakage current; a current measurement module receiving the first leakage current output from the first current detection module, and extracting the received first leakage current for each predetermined period to generate a first leakage current measurement information; and a control module comparing the first leakage current measurement information with a reference value to generate first arcing occurrence information.

Abstract: A secondary battery includes an electrode assembly having a positive electrode provided with a positive electrode tab, a separator, and a negative electrode provided with a negative electrode tab, the positive electrode, the separator, and the negative electrode being wound, the electrode assembly having a core part at a center thereof; a can configured to receive the electrode assembly therein, the negative electrode tab being connected to the can; a cap assembly coupled to an opening of the can, the positive electrode tab being connected to the cap assembly; and a reinforcing member provided on an end of the separator exposed beyond the positive electrode or the negative electrode to prevent heat of the positive electrode tab or the negative electrode tab from being transferred to the separator.

Abstract: A plasticizer composition including a citrate-based material and an epoxidized oil, and the plasticizer composition capable of maintaining an excellent plasticization efficiency and providing an improved mechanical properties and stress resistance when compared with conventional phthalate-based plasticizer products.

Abstract: A semiconductor package includes a redistribution substrate having a first side and an opposite second side, a semiconductor chip on the first side of the redistribution substrate, a silicon capacitor on the second side of the redistribution substrate, a plurality of solder balls on the second side of the redistribution substrate and adjacent the silicon capacitor, and a metal pattern in the redistribution substrate and positioned between the silicon capacitor and the solder balls. The metal pattern includes a first portion extending in a first direction, and a second portion connected to the first portion and extending in a second direction different from the first direction.

Abstract: In a method of forming a contact plug in a semiconductor integrated circuit device, the contact plug may be formed in a process chamber of a substrate-processing apparatus. The process chamber may have a process space. The process chamber may include a substrate supporter placed in a lower region of the process space to support a semiconductor substrate, and a gas injector placed in an upper region of the process space to inject a gas to the semiconductor substrate. An insulating interlayer having a contact hole may be formed on the semiconductor substrate loaded into the process space. A nucleation layer may be formed on an inner surface of the contact hole and an upper surface of the insulating interlayer. A semi-bulk layer may be formed on the nucleation layer in a lower region of the contact hole. An inhibiting layer may be formed on the semi-bulk layer and the exposed nucleation layer. A main-bulk layer may be formed on the semi-bulk layer to fill the contact hole with the main-bulk layer.

Abstract: In a method of forming a contact plug in a semiconductor integrated circuit device, the contact plug may be formed in a process chamber of a substrate-processing apparatus. The process chamber may have a process space. The process chamber may include a substrate supporter placed in a lower region of the process space to support a semiconductor substrate, and a gas injector placed in an upper region of the process space to inject a gas to the semiconductor substrate. An insulating interlayer having a contact hole may be formed on the semiconductor substrate loaded into the process space. A nucleation layer may be formed on an inner surface of the contact hole and an upper surface of the insulating interlayer. A semi-bulk layer may be formed on the nucleation layer in a lower region of the contact hole. An inhibiting layer may be formed on the semi-bulk layer and the exposed nucleation layer. A main-bulk layer may be formed on the semi-bulk layer to fill the contact hole with the main-bulk layer.

Abstract: A forming device of a base material and a skin layer may include a lower mold having an upper surface on which a first forming surface is formed and including a vacuum path formed inwardly from the first forming surface to be connected to the vacuum chamber; an upper mold disposed to be movable upward and downward by a press device and having a lower surface on which a second forming surface is formed to correspond to the first forming surface of the lower mold; a pressurizing member disposed at the outside of the second forming surface of the upper mold to be movable toward the upper surface of the lower mold; and a pressurizing cylinder pushing the pressurizing member toward the upper surface of the lower mold to closely adhere the skin layer injected between the upper mold and the lower mold to the upper surface of the lower mold.

Abstract: Provided is a bone filling complex and method of preparing the same. The bone filling complex includes a matrix including a hydrogel-type hyaluronic acid derivative; and a bone derivative filling the matrix For example, the bone filling complex can be used to regenerate an injured alveolar bone.

Abstract: A dental implant package includes a main body having a partition portion that is formed therein and separates a fixture accommodation space accommodating a fixture of a dental implant from an auxiliary accommodation space accommodating any of a healing abutment and a cover screw, wherein a first opening and a second opening are formed at both ends of the main body, a leveler accommodated in at least a part of the fixture accommodation space and supporting the fixture accommodated in the fixture accommodation space at a predetermined height, a first cover detachably coupled to the main body and blocking the first opening, and a second cover detachably coupled to the main body and blocking the second opening. The fixture and any of the healing abutment and the cover screw can be stored with a simple structure. Also, the fixture and the healing abutment or the cover screw can be easily pulled out during an implant operation.

Abstract: Provided is a bone filling complex and a method of preparing the same. The bone filling complex includes a matrix including a hydrogel-type hyaluronic acid derivative; and a bone derivative filling the matrix, and thus adhesion can be prevented and excellent bone generation property can be obtained. For example, the bone filling complex can be used to an injured portion of alveolar bone to derive an regeneration of the alveolar bone.

Abstract: A dental implant package includes a main body having a partition portion that is formed therein and separates a fixture accommodation space accommodating a fixture of a dental implant from an auxiliary accommodation space accommodating any of a healing abutment and a cover screw, wherein a first opening and a second opening are formed at both ends of the main body, a leveler accommodated in at least a part of the fixture accommodation space and supporting the fixture accommodated in the fixture accommodation space at a predetermined height, a first cover detachably coupled to the main body and blocking the first opening, and a second cover detachably coupled to the main body and blocking the second opening. The fixture and any of the healing abutment and the cover screw can be stored with a simple structure. Also, the fixture and the healing abutment or the cover screw can be easily pulled out during an implant operation.

Abstract: Provided are a bone filler for orthopedic and dental applications and a method of fabricating the same. The bone filler includes a pillar-like body having at least one through hole. In addition, the method of fabricating a bone filler includes preparing a slurry including a bioactive material, pressing the slurry to form a pillar-like body including at least one through hole, and calcining the body.