Patents by Inventor Seok Mo Kwon

Seok Mo Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Two step wire bond process
    Patent number: 6461898
    Abstract: A two step wire bonding process is used to ultrasonically attach a wire (18) to a contact pad (13) on a semiconductor device (10). A first step is used to flatten a rounded tip (19) of the wire (18), and to start the bonding process. This is accomplished by applying a relatively large force to the rounded tip (19), and a relatively low vibrating displacement to the flattened wire tip (19). During a second step the large force is reduced, however; the vibrating displacement is increased. The total time for the two step wire bonding process is slightly less than a prior art one step process.
    Type: Grant
    Filed: August 1, 2000
    Date of Patent: October 8, 2002
    Assignee: Motorola, Inc.
    Inventors: Seok Mo Kwon, Si Hyun Choe
  • Two step wire bond process
    Patent number: 6165888
    Abstract: A two step wire bonding process is used to ultrasonically attach a wire (18) to a contact pad (13) on a semiconductor device (10). A first step is used to flatten a rounded tip (19) of the wire (18), and to start the bonding process. This is accomplished by applying a relatively large force to the rounded tip (19), and a relatively low vibrating displacement to the flattened wire tip (19). During a second step the large force is reduced, however; the vibrating displacement is increased. The total time for the two step wire bonding process is slightly less than a prior art one step process.
    Type: Grant
    Filed: October 2, 1997
    Date of Patent: December 26, 2000
    Assignee: Motorola, Inc.
    Inventors: Seok Mo Kwon, Si Hyun Choe