Abstract: Disclosed is a flexible display device adapted to accurately detect bending information when the flexible display device is flexed, bent or folded, and to be capable of variously controlling an image displayed on a screen on the basis of the detected bending information. The flexible display device includes a flexible touch screen part, and a bending detection part provided on the touch screen part, the bending detection part having an electrostatic capacitance or electric resistance that changes depending on a bending of the touch screen part, so as to detect bending information.

Abstract: A resistive overlay-type touch sensor for a touch screen panel and a method for fabricating the same are provided, in which a plurality of first substrates are extended in parallel along a first direction, a plurality of second substrates are extended in parallel along a second direction perpendicular to the first direction, and a plurality of transparent electrodes are formed on the first and second substrates. The second substrates intersect with the first substrates, each second substrate facing alternately one and the other surfaces of the first substrates along the second direction, and each of the transparent electrodes on the first substrates faces one of the transparent electrodes on the second substrates.

Abstract: A signal transmitting/receiving antenna device for Radio Frequency Identification (RFID) which executes contactless data communication, and a method of manufacturing the same. The antenna device includes an antenna module including a dielectric film substrate, an antenna pattern which is a conductive pattern printed on the top and bottom sides of the dielectric film substrate, the top and bottom antenna pattern parts being connected to each other through one or more via holes extending through the dielectric film substrate, and top and bottom passivation layers formed on the dielectric film substrate to cover the top and bottom antenna pattern parts; and a radio wave absorbent printed on one of the top and bottom passivation layers of the antenna module.

Abstract: A Printed Circuit Board (PCB) and a method for manufacturing the same are provided. A circuit pattern is formed by printing conductive ink/paste on a substrate, and sintering a layer of the conductive ink or curing a layer of the conductive paste by applying heat. A primary plating layer is formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern. A secondary plating layer is formed through electroless plating or electrolytic plating of a precious metal on the primary plating layer to improve wetting with solder.

Abstract: A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board.

Abstract: Provided is a System-In-Package (SIP) having embedded circuit boards in which boards are electrically connected and a plurality of chips are embedded in a board in a stacked manner. The SIP includes a first board on a surface of which a first circuit is formed, a second board which is provided on a top surface of the first board in a stacked manner and includes a plurality of chips embedded therein in a stacked manner, and a third board which is provided on a top surface of the second board in a stacked manner and on a surface of which a second circuit is formed.

Abstract: An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.

Abstract: An internal antenna is provided that includes a first antenna having a first antenna pattern formed on a first dielectric layer, and a second antenna having a second antenna pattern formed on a second dielectric layer. The second dielectric layer has a higher dielectric constant than the first dielectric layer. The first and second antenna patterns are electrically connected to each other.

Abstract: Disclosed is an interposer including a polyhedral body having first and second surfaces facing each other, a plurality of electric terminals formed on the first surface; and a plurality of vias extending through the first and second surfaces. In addition, a semiconductor package includes a printed circuit board having a plurality of electric contacts formed on an upper surface and an interposer having first and second surfaces facing each other, vias extending through the first and second surfaces, and first electric terminals formed on the first surface. The interposer is seated on the printed circuit board so that the vias correspond to the electric contacts.

Abstract: A main board suitable for slim configurations is disclosed. The main board includes a multi-layer Printed Circuit Board (PCB) in which at least one recess is formed, a first integrated circuit placed in the recess, and a molding that covers the first integrated circuit and the bottom of the recess. The main board further comprising a cover over said recess, said cover being a second integrated circuit or a second PC board, which may further having attached an integrated circuit positioned within the recess.

Abstract: A signal transmitting/receiving antenna device for Radio Frequency Identification (RFID) which executes contactless data communication, and a method of manufacturing the same. The antenna device includes an antenna module including a dielectric film substrate, an antenna pattern which is a conductive pattern printed on the top and bottom sides of the dielectric film substrate, the top and bottom antenna pattern parts being Connected to each other through one or more via holes extending through the dielectric film substrate, and top and bottom passivation layers formed on the dielectric film substrate to cover the top and bottom antenna pattern parts; and a radio wave absorbent printed on one of the top and bottom passivation layers of the antenna module.

Abstract: A Printed Circuit Board (PCB) and a method for manufacturing the same are provided. A circuit pattern is formed by printing conductive ink/paste on a substrate, and sintering a layer of the conductive ink or curing a layer of the conductive paste by applying heat. A primary plating layer is formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern. A secondary plating layer is formed through electroless plating or electrolytic plating of a precious metal on the primary plating layer to improve wetting with solder.

Abstract: A method for fabricating a printed circuit board is provided. The method includes manufacturing a base film including a first side and a second side opposite to the first side; printing a first wiring on the first side with a high-viscosity conductive material having a viscosity of 5,000 to 300,000 centipoise (CPS); forming a via-hole that passes through both sides of the base film, and passes by the first wiring; and printing a second wiring on the second side with a low-viscosity conductive material having a viscosity of 100 to 5,000 CPS. The low-viscosity conductive material is applied to an inner wall of the via-hole to conductively connect the first wiring to the second wiring.

Abstract: A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board.

Abstract: Disclosed is a semiconductor package adapted to be light, slim, compact, and suitable for high-density mounting and a method for manufacturing the same. The semiconductor package includes a semiconductor chip; a plurality of active/passive devices; a first PCB acting as a main board, the semiconductor chip and devices selected from the plurality of active/passive devices being mounted on the first PCB, the devices including a highest device; and at least one sub-PCB, remaining devices of the plurality of active/passive devices being mounted on the sub-PCB, the sub-PCB having a through-hole, at least the highest device on the first PCB extending through the through-hole, so that the sub-PCB is connected to the first PCB and positioned in a space above the first PCB while overlapping the first PCB.

Abstract: A main board suitable for slim configurations is disclosed. The main board includes a multi-layer Printed Circuit Board (PCB) in which at least one recess is formed, a first integrated circuit placed in the recess, and a molding that covers the first integrated circuit and the bottom of the recess. The main board further comprising a cover over said recess, said cover being a second integrated circuit or a second PC board, which may further having attached an integrated circuit positioned within the recess.

Abstract: Disclosed is an interposer including a polyhedral body having first and second surfaces facing each other, a plurality of electric terminals formed on the first surface; and a plurality of vias extending through the first and second surfaces. In addition, a semiconductor package includes a printed circuit board having a plurality of electric contacts formed on an upper surface and an interposer having first and second surfaces facing each other, vias extending through the first and second surfaces, and first electric terminals formed on the first surface. The interposer is seated on the printed circuit board so that the vias correspond to the electric contacts.

Abstract: Disclosed is a semiconductor package adapted to be light, slim, compact, and suitable for high-density mounting and a method for manufacturing the same. The semiconductor package includes a semiconductor chip; a plurality of active/passive devices; a first PCB acting as a main board, the semiconductor chip and devices selected from the plurality of active/passive devices being mounted on the first PCB, the devices including a highest device; and at least one sub-PCB, remaining devices of the plurality of active/passive devices being mounted on the sub-PCB, the sub-PCB having a through-hole, at least the highest device on the first PCB extending through the through-hole, so that the sub-PCB is connected to the first PCB and positioned in a space above the first PCB while overlapping the first PCB.