Patents by Inventor Seok Pil Jin

Seok Pil Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240067561
    Abstract: Proposed is a method of manufacturing a flexible cover window containing a flat portion disposed on a flat area of a flexible display and a folding portion formed in connection to the flat portion and disposed on a folding area of the flexible display. The method is characterized by including: preparing a glass substrate; placing the glass substrate onto a carrier substrate; forming a first coating layer on the glass substrate containing the folding portion; forming a second coating layer on the first coating layer; and separating the glass substrate from the carrier substrate.
    Type: Application
    Filed: August 21, 2023
    Publication date: February 29, 2024
    Applicant: UTI INC.
    Inventors: Jae Suk OH, Seok Pil JIN, Kukhyun SUNWOO
  • Publication number: 20230269896
    Abstract: Proposed are a hybrid flexible cover window and a method of manufacturing the same. The hybrid flexible cover window includes a flat portion formed on a flat area of a flexible display and a folding portion which is formed in succession to the flat portion and formed in a folding area of the flexible display. The hybrid flexible cover window includes a substrate, a transparent polyimide layer formed on the glass substrate, and an adhesive buffer layer formed between the glass substrate and the TPI layer, in which the TPI layer has a UV cut-off wavelength of less than 380 nm.
    Type: Application
    Filed: February 8, 2023
    Publication date: August 24, 2023
    Applicant: UTI INC.
    Inventors: Kukhyun SUNWOO, Tea Joo HA, Hee Jun AHN, Seok Pil JIN, Jae Suk OH, Joo Seok LEE
  • Patent number: 9167735
    Abstract: Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: October 20, 2015
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang Choon Chung, Hyun Nam Cho, Myung Bong Yoo, Nam-Boo Cho, Seok Pil Jin, Seong Hoon No
  • Publication number: 20130206315
    Abstract: Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.
    Type: Application
    Filed: November 12, 2010
    Publication date: August 15, 2013
    Applicant: INKTEC CO., LTD.
    Inventors: Kwang Choon Chung, Hyun Nam Cho, Myung Bong Yoo, Nam-Boo Cho, Seok Pil Jin, Seong Hoon No