Abstract: A wafer polishing method is provided for semiconductor fabrication. The wafer polishing method includes calculating a wear profile of a polishing pad using operation parameters of a pad conditioner, generating a regression model for the wear profile of the polishing pad, and controlling the pad conditioner to condition the polishing pad based on the regression model.

Abstract: A wafer polishing pad includes a first pad having a first surface configured to receive a platen. A protrusion is disposed on the first surface of the first pad. The protrusion is disposed on an edge region of the first pad in a plan view such that a side surface of the protrusion makes contact with a side surface of the platen when the first pad is disposed on the platen.

Abstract: A design validation system including a plurality of design validation devices receiving design data from a user and performing a simulation process to validate at least one of a plurality of product characteristics calculated from the design data and a simulation management device having simulation information about the characteristics required for a performance of the simulation process and transmitting the simulation information to the design validation devices upon request by the plurality of design validation devices, wherein the plurality of design validation devices simultaneously perform the simulation processes to validate the product characteristics.