Abstract: An ESD protection SCR device includes an epitaxial layer provided on a P-type semiconductor substrate, the epitaxial layer having the P-type conductivity, element isolation layers provided on the epitaxial layer, the element isolation layers dividing the epitaxial layer into an anode region and a cathode region, a first well of an N-type conductivity, provided in a portion of the epitaxial layer corresponding to the anode region, a first impurity region provided on a surface of the first well, the first impurity region being connected to an anode terminal and having a high concentration P-type conductivity, a second well of the P-type conductivity, provided in a portion of the epitaxial layer corresponding to the cathode region, a second impurity region provided on a surface of the second well, the second impurity region being connected to a cathode terminal and having a high concentration N-type conductivity, and a floating well of the N-type conductivity, buried in the epitaxial layer.

Abstract: An ESD protection SCR device includes an epitaxial layer provided on a P-type semiconductor substrate, the epitaxial layer having the P-type conductivity, element isolation layers provided on the epitaxial layer, the element isolation layers dividing the epitaxial layer into an anode region and a cathode region, a first well of an N-type conductivity, provided in a portion of the epitaxial layer corresponding to the anode region, a first impurity region provided on a surface of the first well, the first impurity region being connected to an anode terminal and having a high concentration P-type conductivity, a second well of the P-type conductivity, provided in a portion of the epitaxial layer corresponding to the cathode region, a second impurity region provided on a surface of the second well, the second impurity region being connected to a cathode terminal and having a high concentration N-type conductivity, and a floating well of the N-type conductivity, buried in the epitaxial layer.

Abstract: An ESD protection SCR device includes a semiconductor substrate, an epitaxial layer, device isolation layers, an n-type well formed in an anode region, a first high concentration p-type impurity region formed on a surface portion of the n-type well, a first high concentration n-type impurity region formed on the surface portion of the n-type well, a p-type well formed in an cathode region, a second high concentration n-type impurity region formed on a surface portion of the p-type well, a second high concentration p-type impurity region formed on a surface portion of the p-type well so as to be spaced apart from the second high concentration n-type impurity region, and a third high-concentration p-type impurity region formed on the surface portion of the p-type well so as to surround a side portion of the second high-concentration n-type impurity region, adjacent to the anode region.

Abstract: An ESD protection SCR device includes a semiconductor substrate, an epitaxial layer, device isolation layers, an n-type well formed in an anode region, a first high concentration p-type impurity region formed on a surface portion of the n-type well, a first high concentration n-type impurity region formed on the surface portion of the n-type well, a p-type well formed in an cathode region, a second high concentration n-type impurity region formed on a surface portion of the p-type well, a second high concentration p-type impurity region formed on a surface portion of the p-type well so as to be spaced apart from the second high concentration n-type impurity region, and a third high-concentration p-type impurity region formed on the surface portion of the p-type well so as to surround a side portion of the second high-concentration n-type impurity region, adjacent to the anode region.