Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a second component disposed on the first surface of the substrate, a first sealing portion to seal the first component, a second sealing portion to seal the second component, a shielding wall disposed between the first component and the second component. The shielding wall includes a bobbin disposed between the first sealing portion and the second sealing portion and a conductive portion to seal the bobbin. A shielding layer of a conductive material is disposed along a surface formed by the first sealing portion, the second sealing portion, and the shielding wall.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a first sealing portion sealing the at least one first component and a second sealing portion sealing the at least one second component, a shielding wall disposed between the at least one first component and the at least one second component to block a flow of electromagnetic waves, and a shielding layer of a conductive material disposed along a surface formed by the first and second sealing portions and the shielding wall. The shielding wall includes a first wall and a second wall spaced apart from each other, and the shielding layer is partially formed on opposing surfaces of the first wall and the second wall.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a first sealing portion sealing the at least one first component and a second sealing portion sealing the at least one second component, a shielding wall disposed between the at least one first component and the at least one second component to block a flow of electromagnetic waves, and a shielding layer of a conductive material disposed along a surface formed by the first and second sealing portions and the shielding wall. The shielding wall includes a first wall and a second wall spaced apart from each other, and the shielding layer is partially formed on opposing surfaces of the first wall and the second wall.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a second component disposed on the first surface of the substrate, a first sealing portion to seal the first component, a second sealing portion to seal the second component, a shielding wall disposed between the first component and the second component. The shielding wall includes a bobbin disposed between the first sealing portion and the second sealing portion and a conductive portion to seal the bobbin. A shielding layer of a conductive material is disposed along a surface formed by the first sealing portion, the second sealing portion, and the shielding wall.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a first sealing portion sealing the at least one first component and a second sealing portion sealing the at least one second component, a shielding wall disposed between the at least one first component and the at least one second component to block a flow of electromagnetic waves, and a shielding layer of a conductive material disposed along a surface formed by the first and second sealing portions and the shielding wall. The shielding wall includes a first wall and a second wall spaced apart from each other, and the shielding layer is partially formed on opposing surfaces of the first wall and the second wall.

Abstract: A ceramic multilayer substrate includes a plurality of ceramic substrates being stacked vertically, each substrate having a designated thickness; pattern layers formed on surfaces of the ceramic substrates so as to form circuit elements; external terminal vertically formed on side surfaces of the stacked ceramic substrates; and internal connection parts, each of which is formed on a part of one of the pattern layers, is connected to one of the external terminals so as to exchange signals with the outside, and is broad enough to surround at least partially the connected external terminal.

Abstract: A ceramic multilayer substrate is formed by vertically stacking and firing a plurality of ceramic sheets, in which a connection bar is vertically formed between internal patterns and an external terminal of each ceramic sheet, preventing metallic conductive layers of the internal patterns from being deformed during processing the external terminal. The ceramic multilayer substrate has pattern layers formed on surfaces of at least some of the ceramic sheets. At least one through hole is formed on the edges of the stacked ceramic sheets so as to be opened to the outside. An external terminal is formed on an inner wall of the through hole connected with the pattern layers, and directly contacting the connection bar, whereby the connection bar supports the electrical connection between the external terminal and the pattern layers.

Abstract: Disclosed is a terminal structure of a multi-layer substrate and a method for forming the same. In the terminal structure, a plurality of terminals are formed on at least two adjacent substrate layers, each of the terminals being spaced from adjacent ones to a predetermined interval. Openings are formed in at least one of the substrate layers. Each of the openings is formed between each adjacent ones of first terminals in the at least one substrate layer, and spaced from the each first terminals to a predetermined gap, and has a size same as that of the first terminals. The substrate layers are stacked one atop another and compressed together so that second terminals formed on at least one corresponding substrate layer are projected to a plane of an outermost substrate layer on which corresponding terminals are formed. The terminal structure and the method can secure a predetermined interval to a plurality of terminals in a package when the terminals are formed as well as simplify formation thereof.

Abstract: The present invention relates to a multilayer ceramic package providing an improved connection pattern structure between inside and outside terminals and a fabrication method thereof. The ceramic package internally mounts at least one component and is formed by stacking a plurality of ceramic sheets one atop another. Internal patterns are formed in at least a portion of the ceramic sheets. A lid is mounted on the layered structure above the cavity to maintain the cavity airtight. Outside connection terminals are formed in outer portions of the layered structure. Internal connection patterns are separately formed horizontally in at least two of the ceramic sheets to be electrically connected with the outside connection terminals. Inside connection terminals formed within the cavity to be electrically connected with the component and at least a portion of the internal connection pattern.

Abstract: Disclosed are a ceramic multilayer substrate in which internal connection parts formed in the internal patterns are broad enough to surround the external terminal, and a method for manufacturing the substrate, thereby stably achieving a connection between the internal patterns and the external terminal and maintaining the connection even in the case of an error occurring in a step for forming a through hole on the substrate. The ceramic multilayer substrate comprises a plurality of ceramic substrates being stacked vertically, each substrate having a designated thickness; pattern layers formed on surfaces of the ceramic substrates so as to form circuit elements; external terminals formed on side surfaces of the stacked ceramic substrates; and internal connection parts, each of which is formed on a part of the pattern layer, being connected to the external terminal so as to exchange signals with the outside and being broad enough to surround the external terminal.

Abstract: Disclosed are a ceramic multilayer substrate formed by vertically stacking and firing a plurality of ceramic substrates, in which a connection bar is longitudinally formed on connection areas between internal patterns and an external terminal of each ceramic substrate, thereby preventing metallic conductive layers of the internal patterns from being deformed during processing the external terminal and stably connecting the internal patterns to the external terminal, and a method for manufacturing the substrate.