Patents by Inventor Seok-Yong Kim

Seok-Yong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128022
    Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Chang Hak Choi, Seok Hyun Yoon, Ki Yong Lee, Jong Myeong Jeon
  • Patent number: 6271736
    Abstract: A digital temperature compensating crystal oscillator, and a method for stabilizing the frequency thereof, in which not only the vibration phenomenon caused during the conversion of analog signals to digital signals in spite of a constant ambient temperature is decreased, but also the output frequency vibrations caused by the noises of analog devices are also decreased, thereby improving the stability and the reliability. If an output temperature data of an analog/digital converter is a first sampling data, then the output temperature data of the analog/digital converter is used directly as a temperature code for obtaining a temperature compensating data, to be stored into a memory. If it is not a first sampling data, then the output temperature data of the analog/digital converter are accumulated up to a predetermined number of times, and an average of accumulated values is supplied into the memory as a temperature code for obtaining the temperature compensating data.
    Type: Grant
    Filed: December 23, 1999
    Date of Patent: August 7, 2001
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Seok-Yong Kim