Patents by Inventor Seok-Youn Kim

Seok-Youn Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250066347
    Abstract: The present invention relates to: a substituted thiazolidinedione derivative compound having a novel structure acting as a sterol regulatory element-binding protein-1 (SREBP1) inhibitor, a hydrate thereof, or a pharmaceutically acceptable salt thereof; and a pharmaceutical composition for preventing or treating cancer, comprising same as an active ingredient.
    Type: Application
    Filed: December 19, 2022
    Publication date: February 27, 2025
    Inventors: Jun-Kyum KIM, Jia CHOI, Eun-Jung KIM, Cheol-Kyu PARK, Seok Won HAM, Min Gi PARK, Hyeon Ju JEONG, Sung Jin KIM, Kyungim MIN, Jong Min PARK, Jungwook CHIN, Sung Jin CHO, Jina KIM, Kyung Jin JUNG, Nayeon KIM, Suhui KIM, Sugyeong KWON, Su-Jeong LEE, Minseon JEONG, Hongchan AN, Jeong-Eun PARK, Dong-Hyun KIM, Ji-youn LIM, Ju-sik MIN, Ji Sun HWANG, Hyo-Jung CHOI, Hayoung HWANG, Oh-Bin KWON, Sungwoo LEE, Sang Bum KIM
  • Publication number: 20250070032
    Abstract: Provided is a semiconductor package including an interposer. The semiconductor package includes: a package base substrate; a lower redistribution line structure disposed on the package base substrate and including a plurality of lower redistribution line patterns; at least one interposer including a plurality of first connection pillars spaced apart from each other on the lower redistribution line structure and connected respectively to portions of the plurality of lower redistribution line patterns, and a plurality of connection wiring patterns; an upper redistribution line structure including a plurality of upper redistribution line patterns connected respectively to the plurality of first connection pillars and the plurality of connection wiring patterns, on the plurality of first connection pillars and the at least one interposer; and at least two semiconductor chips adhered on the upper redistribution line structure while being spaced apart from each other.
    Type: Application
    Filed: November 11, 2024
    Publication date: February 27, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jong-youn KIM, Seok-hyun LEE
  • Patent number: 7988122
    Abstract: A vibration control pedestal and an installation method thereof are disclosed, including a method for reducing particles and vibrations while moving equipment, including semiconductor equipment, from one vibration control pedestal to another. The vibration control pedestal includes an equipment support body having at least two equipment support cells. A cell connection unit passes through side surfaces of the equipment support cells and connects the equipment support cells to each other. A bottom structure installed under the equipment support body braces the equipment support body.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: August 2, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seok-Youn Kim, Jung-Sung Hwang, Ho-Young Lee, Do-Hyun Kwun, Jung-Shik Heo
  • Publication number: 20080174057
    Abstract: A vibration control pedestal and an installation method thereof are disclosed, including a method for reducing particles and vibrations while moving equipment, including semiconductor equipment, from one vibration control pedestal to another. The vibration control pedestal includes an equipment support body having at least two equipment support cells. A cell connection unit passes through side surfaces of the equipment support cells and connects the equipment support cells to each other. A bottom structure installed under the equipment support body braces the equipment support body.
    Type: Application
    Filed: November 8, 2007
    Publication date: July 24, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok-Youn KIM, Jung-Sung HWANG, Ho-Young LEE, Do-Hyun KWUN, Jung-Shik HEO