Abstract: A bitline sense amplifier including: an amplifier which is connected between a first sensing bitline and a second sensing bitline, and detects and amplifies a voltage difference between a first bitline and a second bitline in response to a first control signal and a second control signal; and an equalizer which is connected between a first supply line through which the first control signal is supplied and a second supply line through which the second control signal is supplied, and pre-charges the first bitline and the second bitline with a precharge voltage in response to an equalizing control signal, wherein the equalizer includes an equalizing enable transistor in which a source terminal is connected to the first supply line and performs equalizing in response to the equalizing control signal.

Abstract: Disclosed herein are a black photosensitive resin composition and a black column spacer prepared therefrom. The black photosensitive resin composition may form a cured film exhibiting good adhesion to a substrate, good height difference property, good surface roughness and high light shielding property (optical density), and may be effectively used for the formation of a cured film, particularly a black column spacer, of a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display.

Abstract: The present invention relates to a method for preparing a column spacer, and is characterized in using a mask including first, second, and third patterns having different light transmittance. In addition, according to the method for preparing a column spacer of the present invention, a taper angle between a matrix part and a spacer part may increase during manufacturing a column spacer in which the matrix part and the spacer part are continuously connected, and critical dimension of the spacer part may decrease. Therefore, a column spacer with fine patterns may be simply and efficiently manufactured.

Abstract: Disclosed herein is a colored photosensitive resin composition including a copolymer, an epoxy resin compound or a compound derived therefrom, a polymerizable compound, a photoinitiator, and a colorant, wherein the photoinitiator includes an oxime compound and a triazine compound. The composition, when formed into a cured film, may facilitate the fabrication of necessary height difference and satisfy the requirements of sensitivity and an exposure margin for light shielding spacers, and, thus, is useful as a material for manufacturing a light shielding spacer such as a black column spacer used in various electronic parts including the panels of an LCD and an OLED display.

Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. By comprising a copolymer (A) and a photopolymerizable compound (B) in specific amounts, a photosensitive resin composition may form a cured film having pattern developability with high resolution and good elasticity recovery rate. The composition may be effectively used for the formation of a cured film, particularly a spacer of a display device such as a liquid crystal display and an organic electroluminescence device.

Abstract: The present invention relates to a colored photosensitive resin composition capable of forming a cured film that does not generate uneven wrinkles on its surface at the time of its formation, and a light shielding spacer produced therefrom and used for a liquid crystal display, an organic EL display, or the like.

Abstract: Disclosed herein are a black photosensitive resin composition and a black column spacer prepared therefrom. The black photosensitive resin composition may form a cured film exhibiting good adhesion to a substrate, good height difference property, good surface roughness and high light shielding property (optical density), and may be effectively used for the formation of a cured film, particularly a black column spacer, of a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display.

Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. By comprising a copolymer (A) and a photopolymerizable compound (B) in specific amounts, a photosensitive resin composition may form a cured film having pattern developability with high resolution and good elasticity recovery rate. The composition may be effectively used for the formation of a cured film, particularly a spacer of a display device such as a liquid crystal display and an organic electroluminescence device.

Abstract: The present invention relates to a method for preparing a column spacer, and is characterized in using a mask including first, second, and third patterns having different light transmittance. In addition, according to the method for preparing a column spacer of the present invention, a taper angle between a matrix part and a spacer part may increase during manufacturing a column spacer in which the matrix part and the spacer part are continuously connected, and critical dimension of the spacer part may decrease. Therefore, a column spacer with fine patterns may be simply and efficiently manufactured.

Abstract: Disclosed herein is a colored photosensitive resin composition including a copolymer, an epoxy resin compound or a compound derived therefrom, a polymerizable compound, a photoinitiator, and a colorant, wherein the photoinitiator includes an oxime compound and a triazine compound. The composition, when formed into a cured film, may facilitate the fabrication of necessary height difference and satisfy the requirements of sensitivity and an exposure margin for light shielding spacers, and, thus, is useful as a material for manufacturing a light shielding spacer such as a black column spacer used in various electronic parts including the panels of an LCD and an OLED display.

Abstract: The present invention relates to a colored photosensitive resin composition capable of forming a cured film that does not generate uneven wrinkles on its surface at the time of its formation, and a light shielding spacer produced therefrom and used for a liquid crystal display, an organic EL display, or the like.

Abstract: The present invention relates to a high strength synthetic bone for bone replacement for increasing compressive strength and facilitating blood circulation, and a manufacturing method therefor, and provides the high strength synthetic bone for bone replacement in which calcium sulfate hemihydrate (CSH) and NaCl, in a particle state, penetrate into the pores of a porous inorganic material such as ?-tricalcium phosphate (?-TCP) and a wet treatment is performed on the same such that the CSH penetrated into the pores is combined with moisture so as to form a hydrated crystal of calcium sulfate dihydrate (CSD) to expand the volume thereof in the pores, thereby preventing the escape of a filler by physical force.

Abstract: A resin solution usable for forming a protection layer, including an organic solvent and a resol resin. The resin solution may further include any combination of a cross-linking agene or agent(s), a photo active compound (PAC) or compounds(s), and/or development accelerator or accelerator(s) a method forming a cured resin layer, including applying a resin solution, including a resol resin, directly or indirectly on a substrate and hard baking the resin solution to form the cured resin layer. The resin solution may include a resol resin and/or a novolac resin.

Abstract: A composition for forming a polymer layer and a method of forming a pattern using the same are provided. The composition comprises a polyhydroxystyrene resin, a cross-linking compound including silicon and a solvent. The composition has an organic-inorganic hybrid system. Thus, a polymer layer formed using the composition has improved etching resistance with respect to a photoresist pattern in an etching process.

Abstract: A photoresist composition comprising a hydrogen-bonding compound and a thermosetting resin is provided. A method of forming a photoresist pattern is also provided. The method comprises forming a photoresist film on an object by coating the object with a photoresist composition including a hydrogen-bonding compound and a thermosetting resin. Then, the photoresist film is partially removed to form the photoresist pattern.

Abstract: In a semiconductor device fabrication method and in a product formed according to the method, a photosensitive polyimide layer (PSPL) layer is applied to a semiconductor device in a manner which overcomes the limitations of the conventional approaches. The beneficial qualities of an added photoresist layer are utilized to avoid unwanted development of the underlying PSPL layer. In this manner, cracking of the PSPL layer is mitigated or eliminated, reducing the device soft error rate (SER) and increasing device yield. This is accomplished in a reliable and low-cost approach that employs standard device fabrication techniques.

Abstract: In a semiconductor device fabrication method and in a product formed according to the method, a photosensitive polyimide layer (PSPL) layer is applied to a semiconductor device in a manner which overcomes the limitations of the conventional approaches. The beneficial qualities of an added photoresist layer are utilized to avoid unwanted development of the underlying PSPL layer. In this manner, cracking of the PSPL layer is mitigated or eliminated, reducing the device soft error rate (SER) and increasing device yield. This is accomplished in a reliable and low-cost approach that employs standard device fabrication techniques.