Patents by Inventor Seok Jun Hong

Seok Jun Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250214330
    Abstract: The present invention relates to an eco-friendly packaging material and a manufacturing method therefor. Specifically, the packaging material according to an embodiment of the present invention includes a surface coating layer, a first fiber layer, a second fiber layer, and a sealing coating layer, and thus has high recyclability and decomposes well in the soil and ocean, and may have excellent oxygen and/or moisture barrier properties, printability, antifouling/water resistance properties, sealing properties, etc.
    Type: Application
    Filed: March 31, 2023
    Publication date: July 3, 2025
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Seok Jun HONG, Yukhen PARK, Kyoung Sik CHO, Grace KIM
  • Publication number: 20250067524
    Abstract: An evaporation apparatus includes a lower case that accommodates a deposition material, a nozzle emitting the deposition material, a first angle limiting member including a first angle limiting plate extending in a direction that limits an angle of the deposition material emitted from the nozzle, a plurality of first cooling fins connected to a side of the first angle limiting member, and a first heat exchanger having a plurality of first heat exchange fins located between the plurality of first cooling fins.
    Type: Application
    Filed: June 21, 2024
    Publication date: February 27, 2025
    Applicant: Samsung Display Co., LTD.
    Inventors: Hwa Pyeong JEONG, Eu Gene KANG, Kyoung Woon LEE, Seok Jun HONG, Jong Gun YUN
  • Publication number: 20240417844
    Abstract: Provided is a method of manufacturing a Zn—Mg alloy plated steel having excellent plating adhesion and corrosion resistance. The method includes: sequentially forming a first Zn plating layer, a second Mg plating layer, and a third Zn plating layer on base steel by a physical vapor deposition (PVD) method to provide a plated steel material; heating the plated steel material for alloying heat treatment to provide an alloy plated steel material; and cooling the alloy plated steel material. In the providing of the plated steel material, the second Mg plating layer has a thickness of 30% to 35% of the sum of thicknesses of the first Zn plating layer, the second Mg plating layer, and the third Zn plating layer, and the first Zn plating layer has a thickness of 1.1 to 4 times a thickness of the third Zn plating layer.
    Type: Application
    Filed: August 23, 2024
    Publication date: December 19, 2024
    Inventors: Seok-Jun HONG, Woo-Sung JUNG
  • Patent number: 12156339
    Abstract: A camera module according to an embodiment includes a printed circuit board; an infrared filter disposed on an upper surface of the printed circuit board; and an image sensor disposed under a lower surface of the printed circuit board, wherein the printed circuit board includes: an insulating layer including a cavity overlapping at least a part of the infrared filter and at least a part of the image sensor in an optical axis direction; and a circuit pattern buried in the insulating layer and connected to a terminal of the image sensor; and wherein a shape of the cavity is different from a shape of the image sensor.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: November 26, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Suk Ho Kim, Sang Hyuck Nam, Seok Jun Hong
  • Patent number: 12077845
    Abstract: A Zn—Mg alloy plated steel material having excellent adhesion to plating and corrosion resistance comprises base steel and a plating layer formed on the surface of the base steel, wherein the plating layer comprises a Zn single phase, a Mg single phase, an MgZn2 alloy phase, and an Mg2Zn11 alloy phase, the Zn single phase is contained in the plating layer at a proportion of 15 to 19 volumes, and the proportion of the Zn single phase in a lower t/2 area of the plating layer adjacent to the base steel may be greater than the proportion of the Zn single phase in an upper t/2 area of the plating layer on the surface layer side of the plating layer. (Here, t means the thickness (?m) of the plating layer).
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: September 3, 2024
    Assignee: POSCO CO., LTD
    Inventors: Seok-Jun Hong, Woo-Sung Jung
  • Patent number: 12067903
    Abstract: The present application relates to a method for manufacturing an indicator for food that can visually check the quality change in food in a package state, an indicator for food manufactured therefrom, and a method for checking the storage status of food using the same. The manufacturing method of an indicator for food of the present application includes bonding a first film, on which an indicator layer including a pH-sensitive indicator is formed on one surface thereof, and a second film, on which an adhesive layer is formed on one surface thereof, so that the indicator layer of the first film and the adhesive layer of the second film can face each other.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: August 20, 2024
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Grace Kim, Do Wan Kim, Kyoung Sik Cho, Seok Jun Hong
  • Publication number: 20240231219
    Abstract: A hard mask may include a first layer and a second layer on the first layer. Each of the first layer and the second layer may include an amorphous carbon layer. The first layer may have a first extinction coefficient. The second layer may have a second extinction coefficient and the second extinction coefficient may be different from the first extinction coefficient. The first extinction coefficient and the second extinction coefficient each may be in a range of 0.4 to 0.7.
    Type: Application
    Filed: September 19, 2023
    Publication date: July 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Nam Jin CHO, Yi Hwan KIM, Seok Jun HONG, Seong Keun CHO, Sang Chul HAN
  • Publication number: 20230309235
    Abstract: A camera module according to an embodiment includes a printed circuit board; an infrared filter disposed on an upper surface of the printed circuit board; and an image sensor disposed under a lower surface of the printed circuit board, wherein the printed circuit board includes: an insulating layer including a cavity overlapping at least a part of the infrared filter and at least a part of the image sensor in an optical axis direction; and a circuit pattern buried in the insulating layer and connected to a terminal of the image sensor; and wherein a shape of the cavity is different from a shape of the image sensor.
    Type: Application
    Filed: August 17, 2021
    Publication date: September 28, 2023
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Suk Ho KIM, Sang Hyuck NAM, Seok Jun HONG
  • Publication number: 20230170289
    Abstract: An interposer structure includes an interposer substrate, an interlayer insulating layer on an upper surface of the interposer substrate, a capacitor structure inside the interlayer insulating layer, a first via which penetrates the interlayer insulating layer in a vertical direction, the first via being connected to the capacitor structure, an insulating layer on the interlayer insulating layer, a second via which penetrates the insulating layer in the vertical direction, the second via being connected to the first via, and a through via which completely penetrates each of the interposer substrate, the interlayer insulating layer, and the insulating layer in the vertical direction, an upper surface of the through via being coplanar with an upper surface of the second via.
    Type: Application
    Filed: July 8, 2022
    Publication date: June 1, 2023
    Inventors: Woo Seong JANG, Won Ji PARK, Jeong Hoon AHN, Jae Hee OH, Ji Hyung KIM, Shaofeng DING, Seok Jun HONG, Je Gwan HWANG
  • Patent number: 11649542
    Abstract: Provided is a multilayer zinc alloy plated steel material comprising a base steel material and multiple plating layers formed on the base steel material, wherein each of the multiple plating layers includes one of a Zn plating layer, a Mg plating layer, and a Zn—Mg alloy plating layer, and the ratio of the weight of Mg contained in the multiple plating layers to the total weight of the multiple plating layers is from 0.13 to 0.24.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: May 16, 2023
    Assignee: POSCO CO., LTD
    Inventors: Young-Jin Kwak, Goo-Hwa Kim, Mun-Jong Eom, Seok-Jun Hong, Kyoung-Pil Ko, Yong-Hwa Jung, Dong-Yoeul Lee, Tae-Yeob Kim, Kyung-Hoon Nam
  • Publication number: 20230085774
    Abstract: The present application relates to a composition for manufacturing paper and a method for manufacturing paper using same. The composition for manufacturing paper of the present application comprises a pulp fiber and a polymer fiber, and the content ratio between the pulp fiber and the polymer fiber is 50:50 to 95:5.
    Type: Application
    Filed: January 21, 2021
    Publication date: March 23, 2023
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Grace KIM, Do Wan KIM, Kyoung Sik CHO, Hye Min CHOI, Seok Jun HONG
  • Publication number: 20230043581
    Abstract: The present application relates to a method for manufacturing an indicator for food that can visually check the quality change in food in a package state, an indicator for food manufactured therefrom, and a method for checking the storage status of food using the same. The manufacturing method of an indicator for food of the present application includes bonding a first film, on which an indicator layer including a pH-sensitive indicator is formed on one surface thereof, and a second film, on which an adhesive layer is formed on one surface thereof, so that the indicator layer of the first film and the adhesive layer of the second film can face each other.
    Type: Application
    Filed: December 24, 2020
    Publication date: February 9, 2023
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Grace KIM, Do Wan KIM, Kyoung Sik CHO, Seok Jun HONG
  • Publication number: 20220243085
    Abstract: The present disclosure relates to a pH-sensitive indicator label using a pH-sensitive color-changing ink composition, and a packaging material, the pH-sensitive indicator label including: a pH-sensitive color-changing ink composition layer including a pH-sensitive color-changing ink composition; a first film on which the pH-sensitive color-changing ink composition layer is formed; and a second film laminated onto the first film to cover the pH-sensitive color-changing ink composition formed on the first film. The pH-sensitive color-changing ink composition of the pH-sensitive color-changing ink composition layer includes a pH-sensitive indicator prepared by mixing a plurality of pH color-changing dyes of which colors change according to the pH ranges thereof and a dissolving ink capable of dissolving the pH-sensitive indicator.
    Type: Application
    Filed: May 22, 2020
    Publication date: August 4, 2022
    Inventors: Do Wan KIM, Jason CHO, Grace KIM, Seok Jun HONG
  • Publication number: 20220081582
    Abstract: The present disclosure relates to a pH-sensitive variable-color ink composition, and a pH-sensitive indicator label and packaging material using same. The pH-sensitive variable-color ink composition includes: a pH-sensitive indicator prepared by mixing a plurality of pH variable-color dyes of which colors change according to a pH range; dissolving ink which is stirred along with the pH-sensitive indicator and capable of dissolving the pH-sensitive indicator; and an adsorption compound which is stirred along with the dissolving ink and capable of adsorbing gas, and the pH-sensitive label and packaging material using the pH-sensitive variable-color ink composition use the pH-sensitive variable-color ink composition.
    Type: Application
    Filed: May 22, 2020
    Publication date: March 17, 2022
    Inventors: Do Wan KIM, Jason CHO, Grace KIM, Seok Jun HONG
  • Publication number: 20220074040
    Abstract: Provided is a multilayer zinc alloy plated steel material comprising a base steel material and multiple plating layers formed on the base steel material, wherein each of the multiple plating layers includes one of a Zn plating layer, a Mg plating layer, and a Zn—Mg alloy plating layer, and the ratio of the weight of Mg contained in the multiple plating layers to the total weight of the multiple plating layers is from 0.13 to 0.24.
    Type: Application
    Filed: November 18, 2021
    Publication date: March 10, 2022
    Inventors: Young-Jin KWAK, Goo-Hwa KIM, Mun-Jong EOM, Seok-Jun HONG, Kyoung-Pil KO, Yong-Hwa JUNG, Dong-Yoeul LEE, Tae-Yeob KIM, Kyung-Hoon NAM
  • Publication number: 20220074039
    Abstract: A Zn—Mg alloy plated steel material having excellent adhesion to plating and corrosion resistance comprises base steel and a plating layer formed on the surface of the base steel, wherein the plating layer comprises a Zn single phase, a Mg single phase, an MgZn2 alloy phase, and an Mg2Zn11 alloy phase, the Zn single phase is contained in the plating layer at a proportion of 15 to 19 volume %, and the proportion of the Zn single phase in a lower t/2 area of the plating layer adjacent to the base steel may be greater than the proportion of the Zn single phase in an upper t/2 area of the plating layer on the surface layer side of the plating layer. (Here, t means the thickness (?m) of the plating layer).
    Type: Application
    Filed: December 17, 2019
    Publication date: March 10, 2022
    Inventors: Seok-Jun HONG, Woo-Sung JUNG
  • Patent number: 11208716
    Abstract: Provided is a multilayer zinc alloy plated steel material comprising a base steel material and multiple plating layers formed on the base steel material, wherein each of the multiple plating layers includes one of a Zn plating layer, a Mg plating layer, and a Zn—Mg alloy plating layer, and the ratio of the weight of Mg contained in the multiple plating layers to the total weight of the multiple plating layers is from 0.13 to 0.24.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: December 28, 2021
    Assignee: POSCO
    Inventors: Young-Jin Kwak, Goo-Hwa Kim, Mun-Jong Eom, Seok-Jun Hong, Kyoung-Pil Ko, Yong-Hwa Jung, Dong-Yoeul Lee, Tae-Yeob Kim, Kyung-Hoon Nam
  • Patent number: 11136651
    Abstract: Provided is a Zn—Mg alloy plated steel material comprising: a base steel material; and first to third Zn—Mg alloy layers sequentially formed on the base steel material, wherein the first to third Zn—Mg alloy layers have a Zn single phase, a Mg single phase, a MgZn2 alloy phase, and a Mg2Zn11 alloy phase, an area rate of the MgZn2 alloy phase included in the first to third Zn—Mg alloy layers is larger than an area rate of the Mg2Zn11 alloy phase included in the first to third Zn—Mg alloy layers, and an area rate of a MgZn2 alloy phase included in each of the first to third Zn—Mg alloy layers is larger than an area rate of a MgZn2 alloy phase included in the second Zn—Mg alloy layer.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: October 5, 2021
    Assignee: POSCO
    Inventors: Seok-Jun Hong, Young-Do Kim, Woo-Sung Jung, Hyun-Woo Kim, Jong-Min Byun, Su-Ryong Bang, Tae-Yeob Kim
  • Publication number: 20200002803
    Abstract: Provided is a multilayer zinc alloy plated steel material comprising a base steel material and multiple plating layers formed on the base steel material, wherein each of the multiple plating layers includes one of a Zn plating layer, a Mg plating layer, and a Zn—Mg alloy plating layer, and the ratio of the weight of Mg contained in the multiple plating layers to the total weight of the multiple plating layers is from 0.13 to 0.24.
    Type: Application
    Filed: December 22, 2017
    Publication date: January 2, 2020
    Inventors: Young-Jin KWAK, Goo-Hwa KIM, Mun-Jong EOM, Seok-Jun HONG, Kyoung-Pil KO, Yong-Hwa JUNG, Dong-Yoeul LEE, Tae-Yeob KIM, Kyung-Hoon NAM
  • Publication number: 20190345584
    Abstract: Provided is a Zn—Mg alloy plated steel material comprising: a base steel material; and first to third Zn—Mg alloy layers sequentially formed on the base steel material, wherein the first to third Zn—Mg alloy layers have a Zn single phase, a Mg single phase, a MgZn2 alloy phase, and a Mg2Zn11 alloy phase, an area rate of the MgZn2 alloy phase included in the first to third Zn—Mg alloy layers is larger than an area rate of the Mg2Zn11 alloy phase included in the first to third Zn—Mg alloy layers, and an area rate of a MgZn2 alloy phase included in each of the first to third Zn—Mg alloy layers is larger than an area rate of a MgZn2 alloy phase included in the second Zn—Mg alloy layer.
    Type: Application
    Filed: December 22, 2017
    Publication date: November 14, 2019
    Inventors: Seok-Jun HONG, Young-Do KIM, Woo-Sung JUNG, Hyun-Woo KIM, Jong-Min BYUN, Su-Ryong BANG