Patents by Inventor Seol-Ah CHONG

Seol-Ah CHONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190121235
    Abstract: A photo-curable and thermo-curable resin composition includes an epoxy resin including an epoxy group; a carboxyl group-containing photosensitive resin; a photopolymerization initiator; and a filler, wherein a value of an equivalent number of the epoxy group/an equivalent number of the carboxyl group is from more than 1 to less than 2.
    Type: Application
    Filed: May 18, 2018
    Publication date: April 25, 2019
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geum-Hee YUN, Hwa-Young LEE, Seol-Ah CHONG
  • Publication number: 20180305509
    Abstract: A molded product includes a body comprising a light-shielding photosensitive resin. The light-shielding photosensitive resin has a tinting strength having an L value equal than or less than 40, an a* value of ?40 to ?10, and a b* value less than or equal to 5 in the L*a*b* color space (CIE colorimetric system), and the light-shielding photosensitive resin has a directed transmittance (% T) of less than 10% at a wavelength band of 200 nm to 700 nm.
    Type: Application
    Filed: November 30, 2017
    Publication date: October 25, 2018
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Geum-Hee YUN, Seol-Ah CHONG, Hwa-Young LEE, Ji-Hye SHIM, Sang-Eun SHIN