Patents by Inventor Seon Ha Kang
Seon Ha Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11638346Abstract: A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.Type: GrantFiled: March 18, 2021Date of Patent: April 25, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seon Ha Kang, Yong Hoon Kim
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Publication number: 20220210913Abstract: A printed circuit board includes: an insulating layer; a first circuit pattern embedded in one surface of the insulating layer; and a second circuit pattern disposed on the one surface of the insulating layer and including a first metal layer and a second metal layer disposed on the first metal layer. An average width of the first metal layer is wider than an average width of the second metal layer.Type: ApplicationFiled: March 11, 2021Publication date: June 30, 2022Inventors: Seon Ha KANG, Yong Hoon KIM
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Publication number: 20220053631Abstract: A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.Type: ApplicationFiled: March 18, 2021Publication date: February 17, 2022Inventors: Seon Ha Kang, Yong Hoon Kim
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Publication number: 20220005765Abstract: A substrate structure may include a printed circuit board including a first recess and a first junction pad disposed on a lower surface of the first recess; a first electronic component package disposed in the first recess, and including a first substrate and a first electronic device module disposed on at least one surface of the first substrate; and a first external junction portion connecting the first electronic component package and the first junction pad.Type: ApplicationFiled: October 29, 2020Publication date: January 6, 2022Inventors: Moon Hee Yi, Yong Hoon Kim, Yun Je Ji, Seon Ha Kang
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Patent number: 11013114Abstract: A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.Type: GrantFiled: October 23, 2019Date of Patent: May 18, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seon-Ha Kang, Sa-Yong Lee, Mi-Sun Hwang, Ju-Ho Kim
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Publication number: 20200170110Abstract: A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.Type: ApplicationFiled: October 23, 2019Publication date: May 28, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Seon-Ha KANG, Sa-Yong LEE, Mi-Sun HWANG, Ju-Ho KIM
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Patent number: 10217709Abstract: The present disclosure relates to a semiconductor package, and more particularly, to a fan-out semiconductor package in which connection terminals may extend outwardly of a region in which a semiconductor chip is disposed. In the fan-out semiconductor package, a circuit density of a redistribution layer may be increased even in a limited area.Type: GrantFiled: August 3, 2017Date of Patent: February 26, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seon Ha Kang, Myung Sam Kang
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Publication number: 20180102322Abstract: The present disclosure relates to a semiconductor package, and more particularly, to a fan-out semiconductor package in which connection terminals may extend outwardly of a region in which a semiconductor chip is disposed. In the fan-out semiconductor package, a circuit density of a redistribution layer may be increased even in a limited area.Type: ApplicationFiled: August 3, 2017Publication date: April 12, 2018Inventors: Seon Ha KANG, Myung Sam KANG
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Patent number: 9899136Abstract: A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion includes a first coil layer in which a plurality of conductors having a planar spiral shape are stacked, a second coil layer in which a plurality of conductors having a planar spiral shape are stacked, and a first bump disposed between the first and second coil layers to electrically connect the first and second coil layers to each other. The first coil layer and the second coil layer are electrically connected to each other through the first bump to form a single coil having coil turns adjacent to each other in horizontal and vertical directions.Type: GrantFiled: December 30, 2016Date of Patent: February 20, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sa Yong Lee, Myung Sam Kang, Tae Hong Min, Seon Ha Kang, Mi Sun Hwang, Il Jong Seo
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Publication number: 20170330674Abstract: A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion includes a first coil layer in which a plurality of conductors having a planar spiral shape are stacked, a second coil layer in which a plurality of conductors having a planar spiral shape are stacked, and a first bump disposed between the first and second coil layers to electrically connect the first and second coil layers to each other. The first coil layer and the second coil layer are electrically connected to each other through the first bump to form a single coil having coil turns adjacent to each other in horizontal and vertical directions.Type: ApplicationFiled: December 30, 2016Publication date: November 16, 2017Inventors: Sa Yong LEE, Myung Sam KANG, Tae Hong MIN, Seon Ha KANG, Mi Sun HWANG, Il Jong SEO
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Patent number: 9514880Abstract: Embodiments of the invention provide a coil unit for a thin film inductor, a manufacturing method of a coil unit for a thin film inductor, a thin film inductor, and a manufacturing method of a thin film inductor. According to an embodiment, there is provided a coil unit for a thin film inductor. The coil unit includes an insulator having a dual insulating layer of different materials, and coil patterns respectively embedded in upper and lower surfaces of the insulator. The coil patterns include a coil pattern formed of a plurality of plating layers.Type: GrantFiled: August 14, 2014Date of Patent: December 6, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Woo Park, Seon Ha Kang, Oh Hi Lee
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Publication number: 20150048918Abstract: Embodiments of the invention provide a coil unit for a thin film inductor, a manufacturing method of a coil unit for a thin film inductor, a thin film inductor, and a manufacturing method of a thin film inductor. According to an embodiment, there is provided a coil unit for a thin film inductor. The coil unit includes an insulator having a dual insulating layer of different materials, and coil patterns respectively embedded in upper and lower surfaces of the insulator. The coil patterns include a coil pattern formed of a plurality of plating layers.Type: ApplicationFiled: August 14, 2014Publication date: February 19, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Woo PARK, Seon Ha KANG, Oh Hi LEE
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Patent number: 8881381Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.Type: GrantFiled: December 4, 2009Date of Patent: November 11, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi Sun Hwang, Myung Sam Kang, Ok Tae Kim, Seon Ha Kang, Gil Yong Shin, Kil Yong Yun, Min Jung Cho
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Publication number: 20140090245Abstract: In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.Type: ApplicationFiled: December 6, 2013Publication date: April 3, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Sun HWANG, Myung Sam KANG, Ok Tae KIM, Seon Ha Kang, Gil Yong SHIN, Kil Yong YUN, Min Jung CHO
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Patent number: 8144972Abstract: The present invention relates to a method for manufacturing a printed circuit board and an apparatus for manufacturing the same; and, more particularly, to a method for manufacturing a printed circuit board and an apparatus for manufacturing the same capable of improving the degree of matching between contact holes and pads by correcting exposure position data of an exposing process for forming the pads according to positions of the contact holes.Type: GrantFiled: September 17, 2008Date of Patent: March 27, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chung Woo Cho, Seon Ha Kang, Young Hwan Shin, Jong Jin Lee
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Publication number: 20110067233Abstract: A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.Type: ApplicationFiled: December 29, 2009Publication date: March 24, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seon Ha Kang, Myung Sam Kang, Mi Sun Hwang, Kil Yong Yun, Min Jung Cho, Gil Yong Shin, Ok Tae Kim
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Publication number: 20110061231Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.Type: ApplicationFiled: December 4, 2009Publication date: March 17, 2011Inventors: Mi Sun HWANG, Myung Sam KANG, Ok Tae KIM, Seon Ha KANG, Gil Yong SHIN, Kil Yong YUN, Min Jung CHO
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Publication number: 20110061912Abstract: Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.Type: ApplicationFiled: December 29, 2009Publication date: March 17, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myung Sam Kang, Mi Sun Hwang, Ok Tae Kim, Seon Ha Kang, Gil Yong Shin, Kil Yong Yun, Min Jung Cho
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Publication number: 20100314755Abstract: Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided.Type: ApplicationFiled: July 29, 2009Publication date: December 16, 2010Inventors: Myung Sam KANG, Mi Sun Hwang, Ok Tae Kim, Seon Ha Kang, Gil Yong Shin, Kil Yong Yun, Min Jung Cho
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Publication number: 20100021045Abstract: The present invention relates to a method for manufacturing a printed circuit board and an apparatus for manufacturing the same; and, more particularly, to a method for manufacturing a printed circuit board and an apparatus for manufacturing the same capable of improving the degree of matching between contact holes and pads by correcting exposure position data of an exposing process for forming the pads according to positions of the contact holes.Type: ApplicationFiled: September 17, 2008Publication date: January 28, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chung Woo Cho, Seon Ha Kang, Young Hwan Shin, Jong Jin Lee