Patents by Inventor Seon-ho Choi

Seon-ho Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Railless variable seatback type rear seat
    Patent number: 11970090
    Abstract: A railess variable seatback type rear seat includes: a linear movement device configured to convert a rotation of a motor into a linear movement; a sliding movement device configured to convert the linear movement into a sliding movement in which a seat cushion is pushed forward or backward; and a reclining angle change device configured to convert the sliding movement into a reclining movement, and to fold a seatback, which is connected to the seat cushion, forward or to recline the seatback backward.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: April 30, 2024
    Assignees: HYUNDAI MOTOR COMPANY, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Seung-Hyun Kim, Sang-Hyun Lee, Min-Ju Lee, Byung-Yong Choi, Chan-Ho Jung, Seon-Chae Na, Young-Woon Choi, Jae-Jin Lee, Dong-Hwan Kim, In-Chang Hwang
  • DATA DRIVING DEVICE
    Publication number: 20240105099
    Abstract: The embodiment relates to a data driving device for driving pixels of a display panel. In the data driving device, two adjacent DACs can have different gate loads for the same gray level value so that the fluctuation of the gate load according to the gray level value is reduced.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 28, 2024
    Applicant: LX SEMICON CO., LTD.
    Inventors: Da Sol WON, Kwang Myung KANG, Yong Min KIM, Dong Keun SONG, Jung Min CHOI, Seon Ho HONG
  • Microelectronic die including locking bump and method of making same
    Patent number: 7800225
    Abstract: A microelectronic die and a method of providing same. The die includes a die substrate having an active surfaces and a locking bump on the active surface of the die substrate. The locking bump defines a recess adapted to receive therein a solder bump of a package substrate such that an apex of the solder bump contacts a bottom of the recess.
    Type: Grant
    Filed: June 11, 2007
    Date of Patent: September 21, 2010
    Assignee: Intel Corporation
    Inventor: Seon-ho Choi
  • Microelectronic Die Including Locking Bump and Method of Making Same
    Publication number: 20080303143
    Abstract: A microelectronic die and a method of providing same. The die includes a die substrate having an active surfaces and a locking bump on the active surface of the die substrate. The locking bump defines a recess adapted to receive therein a solder bump of a package substrate such that an apex of the solder bump contacts a bottom of the recess.
    Type: Application
    Filed: June 11, 2007
    Publication date: December 11, 2008
    Inventor: Seon-ho Choi