Abstract: A railess variable seatback type rear seat includes: a linear movement device configured to convert a rotation of a motor into a linear movement; a sliding movement device configured to convert the linear movement into a sliding movement in which a seat cushion is pushed forward or backward; and a reclining angle change device configured to convert the sliding movement into a reclining movement, and to fold a seatback, which is connected to the seat cushion, forward or to recline the seatback backward.

Abstract: Provided is yarn for a cell culture scaffold. The yarn for a cell culture scaffold according to an exemplary embodiment of the present invention includes slitting yarn produced by cutting a compressed nanofiber web to a predetermined width. Accordingly, by creating microenvironments suitable for migration, proliferation and differentiation of cells, cell viability may be enhanced and cells may be three-dimensionally proliferated. In addition, a scaffold according to the present invention has a mechanical strength sufficient for prevention of disruption of the scaffold which occurs during cell culture, such that cells may be stably proliferated. Further, the scaffold according to the present invention uses slitting yarn formed of the compressed nanofiber web, thereby having pores with various sizes, and therefore cell proliferation and cell viability may be enhanced by creation of an extracellular matrix-like environment.

Abstract: The present invention relates to a composition for forming a composite polymer film, a method for preparing the composition for forming a composite polymer film, a composite polymer film and a method for preparing the composite polymer film. The composition for forming a composite polymer film comprises: a fluorine-based polymer solution comprising a fluorine-based polymer; and polyvinylidene fluoride nanoparticles dispersed in the fluorine-based polymer solution. The method for preparing the composition for forming a composite polymer film comprises the steps of: preparing a fluorine-based polymer solution comprising a fluorine-based polymer; and dispersing polyvinylidene fluoride nanoparticles in the fluorine-based polymer solution. The composite polymer film comprises: a polymer matrix formed from a fluorine-based polymer; and polyvinylidene fluoride nanoparticles dispersed in the polymer matrix.

Abstract: An inkjet printing apparatus, method of printing ink using the same and method of fabricating display device are provided. The method of printing ink includes: ejecting ink in which a plurality of particles is dispersed from an inkjet head; irradiating the ejected ink with a first light and a second light having different wavelengths to acquire data on a first exit light and a second exit light emitted from the ink; calculating a concentration of the particles in the ink from the data on the first exit light and the second exit light; and checking whether the concentration is out of an error range from a reference value, where the first light has a wavelength of about 500 nm or less, and the second light has a wavelength of about 1000 nm or more.

Abstract: Provided are a method and apparatus for ground target precision orientation for satellite image acquisition, in which the method includes: receiving a desired satellite position (P) for imaging from a ground station, and receiving a ground plan imaging time (T) or an algorithm execution time (TA) from the ground station, in which the ground plan imaging time (T) is calculated according to the desired satellite position (P) for imaging at a ground-based orbit propagator, and the algorithm execution time (TA) is set to be earlier than the ground plan imaging time (T) by a predetermined amount of time; and determining, based on a position error (E) calculated by using a difference between the desired satellite position (P) for imaging and the predicted satellite position (Q) output from the satellite-based orbit propagator, a closest satellite position (QC) and a closest satellite time (TC) corresponding to when the satellite is closest to the desired satellite position (P) for imaging, and determining a correct

Abstract: Disclosed are an apparatus and a method for Internet of Things (IoT) device security. The method includes unifying a port in a first IoT device for communication, receiving, by the first IoT device, a packet from a second IoT device through the port, identifying whether the packet in the first IoT device is in a preset packet form, verifying content of the packet in the first IoT device when the packet is in the preset packet form, and opening the port for providing a service in the first IoT device when the verifying of the packet content is successful.

Abstract: A semiconductor package includes a lower semiconductor chip having a lower semiconductor substrate and upper pads on a top surface of the lower semiconductor substrate, an upper semiconductor chip stacked on the lower semiconductor chip, the upper semiconductor chip including an upper semiconductor substrate and solder bumps on a bottom surface of the upper semiconductor substrate, and a curing layer between the lower semiconductor chip and the upper semiconductor chip, the curing layer including a first curing layer adjacent to the upper semiconductor chip, the first curing layer including a first photo-curing agent, and a second curing layer between the first curing layer and the top surface of the lower semiconductor substrate, the second curing layer including a first thermo-curing agent.

Abstract: Disclosed is a method of fabricating a semiconductor package. The method may include providing a preliminary interposer substrate including connection terminals on a carrier substrate such that the connection terminals are oriented outward, preparing a release film including a base layer, an intermediate layer, and an adhesive layer, attaching the connection terminals to a first surface of the release film, detaching the carrier substrate from the preliminary interposer substrate, cutting the preliminary interposer substrate to form a plurality of interposer substrates separated from each other, irradiating a first light of a first wavelength onto the release film to form an air gap between the connection terminals and the release film, and detaching the interposer substrates from the release film. The intermediate substrate may include a light absorber absorbing the first light.

Abstract: A drone takeoff and landing system according to an embodiment comprises: a drone including a through-hole; and a landing pad including an extension member which can pass through the through-hole, wherein, when the extension member of the landing pad passes through the through-hole of the drone, an eddy current may occur between the through-hole and the extension member to cause magnetic braking of the drone.

Abstract: An electronic device and method are disclosed. The electronic device includes a processor which implements the method. The method includes: executing an application in a first state, displaying a first user interface for the application on a display, the first UI including a first input field and a first identifier identifying the first input field, receiving data input to the first input field, in response to detecting a particular event, changing the first operational state to a second operational state, re-executing the application in the second operational state, transmitting data for a second UI of the re-executed application to an external display device for display, the second UI including a second input field and a second identifier corresponding to the second input field, and inserting the received data input into the second input field when the first identifier corresponds to the second identifier.

Abstract: A semiconductor package includes a lower semiconductor chip having a lower semiconductor substrate and upper pads on a top surface of the lower semiconductor substrate, an upper semiconductor chip stacked on the lower semiconductor chip, the upper semiconductor chip including an upper semiconductor substrate and solder bumps on a bottom surface of the upper semiconductor substrate, and a curing layer between the lower semiconductor chip and the upper semiconductor chip, the curing layer including a first curing layer adjacent to the upper semiconductor chip, the first curing layer including a first photo-curing agent, and a second curing layer between the first curing layer and the top surface of the lower semiconductor substrate, the second curing layer including a first thermo-curing agent.

Abstract: Disclosed are an electroplating repair apparatus, an electroplating repair system having the same, and an operating system thereof. The apparatus includes a probe body extending a predefined length in a structure corresponding to an inner diameter part of a tube, an electroplating electrode attached to and surrounding an outer circumferential surface of the probe body, a sealing member attached to opposite end sides of the probe body to seal a target portion to be electroplated, and a solution supply line supplying a solution to the target portion through the inside of the probe body, wherein the apparatus has a structure capable of wholly repairing the inside of the tube including a sealing welding part and an expanded part.

Abstract: A processing tape may include a base layer, an adhesive layer disposed on the base layer, a protection release film on the adhesive layer, and a first release layer interposed between the adhesive layer and the protection release film. The first release layer may include a silicone-based material and may be non-photo-curable.

Abstract: Disclosed is a method of fabricating a semiconductor package. The method may include providing a preliminary interposer substrate including connection terminals on a carrier substrate such that the connection terminals are oriented outward, preparing a release film including a base layer, an intermediate layer, and an adhesive layer, attaching the connection terminals to a first surface of the release film, detaching the carrier substrate from the preliminary interposer substrate, cutting the preliminary interposer substrate to form a plurality of interposer substrates separated from each other, irradiating a first light of a first wavelength onto the release film to form an air gap between the connection terminals and the release film, and detaching the interposer substrates from the release film. The intermediate substrate may include a light absorber absorbing the first light.

Abstract: A bearing steel according to an embodiment of the present disclosure includes, as a chemical composition: 0.51 to 0.56 wt % of carbon (C); 0.30 to 0.55 wt % of silicon (Si); 0.60 to 0.90 wt % of manganese (Mn); 0.025 wt % or less (excluding 0 wt %) of phosphorus (P); 0.008 wt % or less (excluding 0 wt %) of sulfur (S); 0.01 to 0.20 wt % of chromium (Cr); 0.08 wt % or less (excluding 0 wt %) of molybdenum (Mo); 0.25 wt % or less (excluding 0 wt %) of nickel (Ni); 0.01 to 0.20 wt % of vanadium (V); 0.20 wt % or less (excluding 0 wt %) of copper (Cu); 0.003 wt % or less (excluding 0 wt %) of titanium (Ti); 0.01 to 0.05 wt % of aluminum (Al); 0.0015 wt % or less (excluding 0 wt %) of oxygen (O); 0.001 wt % or less (excluding 0 wt %) of calcium (Ca); and iron (Fe) and unavoidable impurities as a remainder.

Abstract: A wheel hub includes an inner hub part made of a first material and comprising a central portion formed to protrude in an axially inward direction and a flange portion formed to extend in a radially outward direction from the central portion; and an outer hub part made of a second material, which is lower in strength and lighter in weight than the first material, and configured to be integrally coupled with the inner hub part. The flange portion comprises a plurality of main extended portions in which a plurality of fastening holes are formed to penetrate in an axial direction while being arranged to be spaced apart from each other along a circumferential direction so that a wheel is mounted to the flange portion. The plurality of main extended portions are formed to extend along a plurality of virtual extension reference lines which extend in the radially outward direction.

Abstract: Disclosed is a method and apparatus for correcting a satellite image acquisition time. The method may include receiving, from a ground-based orbit propagator, an initially predicted imaging time, a correction command execution time, and a desired satellite position for imaging, and calculating a waiting time for imaging, a predicted satellite position, a correction time, and a corrected imaging time to correct a satellite image acquisition time.

Abstract: A drone having a deployment device, which is configured such that the same can fly both in a folded mode and in a deployed mode. A platform 300 is arranged in the middle of the drone body 400, a deployment device 200 is arranged on the radial outer side of the platform 300, a fixed support table 230 extends outwardly from the radial outer surface of the platform 300, a rotating support table 210 is coupled to an outer free end of the fixed support table 230, and the rotating support table 210 is rotatably coupled to/supported on the outer free end of the fixed support table 230. Multiple propellers 100 are mounted on the radial outer ends of the rotating support table 210, respectively, a landing structure 600 is coupled to the body 400, and a holder 500 is mounted on the landing structure 600.

Abstract: A semiconductor package includes a connection structure, a semiconductor chip, and an encapsulant. The connection structure includes an insulating layer, a redistribution layer disposed on the insulating layer, and a connection via penetrating through the insulating layer and connected to the redistribution layer. The semiconductor chip has an active surface on which connection pads are disposed and an inactive surface opposing the active surface, and the active surface is disposed on the connection structure to face the connection structure. The encapsulant covers at least a portion of the semiconductor chip. The semiconductor chip includes a groove formed in the active surface and a dam structure disposed around the groove in the active surface.

Abstract: The present invention discloses an unfolding propeller unit type unmanned aerial vehicle including a body unit, a plurality of propeller units in which propellers are installed, a locking unit configured to lock the propeller units so that a state in which the propeller units are overlapping on the body unit is maintained, and propeller unit unfolders, each configured to connect each of the propeller units to the body unit, and unfold the propeller unit from the body unit so the propeller units are positioned around the body unit when locking of the locking unit is released.