Patents by Inventor Seonhong Choi

Seonhong Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10388611
    Abstract: A semiconductor device has a substrate and a semiconductor component disposed over the substrate. A discrete electrical device can be disposed over the substrate. An encapsulant is deposited over the substrate and semiconductor component. A ferromagnetic material is disposed over the encapsulant. The ferromagnetic material includes one or more ferrite type materials or other material having a crystalline structure exhibiting ferromagnetic properties. The ferromagnetic material includes a ferromagnetic film with a polyethylene terephthalate layer, ferrite layer, and adhesive layer. The ferromagnetic film is provided from the sheet of ferromagnetic films. A shielding layer is formed over the ferromagnetic material and around the semiconductor component.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: August 20, 2019
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Sungwon Cho, Seonhong Choi, Changoh Kim
  • Publication number: 20180261550
    Abstract: A semiconductor device has a substrate and a semiconductor component disposed over the substrate. A discrete electrical device can be disposed over the substrate. An encapsulant is deposited over the substrate and semiconductor component. A ferromagnetic material is disposed over the encapsulant. The ferromagnetic material includes one or more ferrite type materials or other material having a crystalline structure exhibiting ferromagnetic properties. The ferromagnetic material includes a ferromagnetic film with a polyethylene terephthalate layer, ferrite layer, and adhesive layer. The ferromagnetic film is provided from the sheet of ferromagnetic films. A shielding layer is formed over the ferromagnetic material and around the semiconductor component.
    Type: Application
    Filed: March 13, 2017
    Publication date: September 13, 2018
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Sungwon Cho, Seonhong Choi, Changoh Kim