Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.

Abstract: A coil component includes a body including magnetic metal powder and an insulating resin, an insulating substrate embedded in the body, a coil portion disposed on at least one side of the insulating substrate the body, and having a lead-out pattern exposed from one of end surfaces of the body opposing each other, an external insulating layer exposing the lead-out pattern while surrounding the body, and including a magnetic ceramic, and an external electrode disposed on the body, and connected to the lead-out pattern.

Abstract: A coil electronic component includes a support substrate including a metal plate having a plurality of through-holes formed therein, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, an encapsulant disposed on at least a portion of the support substrate, the coil pattern, and at least a portion of the metal plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

Abstract: An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.

Abstract: A coil electronic component includes a support substrate including a metal plate having a plurality of through-holes formed therein, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, an encapsulant disposed on at least a portion of the support substrate, the coil pattern, and at least a portion of the metal plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

Abstract: A coil component includes a body including magnetic metal powder and an insulating resin, an insulating substrate embedded in the body, a coil portion disposed on at least one side of the insulating substrate the body, and having a lead-out pattern exposed from one of end surfaces of the body opposing each other, an external insulating layer exposing the lead-out pattern while surrounding the body, and including a magnetic ceramic, and an external electrode disposed on the body, and connected to the lead-out pattern.

Abstract: An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.

Abstract: A chip electronic component includes a body including a coil portion disposed therein and a magnetic metallic powder, and a stress buffer layer disposed on a surface of the body. A Young's modulus of the stress buffer layer is less than that of the body.