Patents by Inventor Seong Ah Joo
Seong Ah Joo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150260376Abstract: Provided are a lens plate for a lighting emitting diode (LED) module, and the LED module. The lens plate includes: a lens substrate having a plane structure; at least one lens having a dome structure formed on the lens substrate; and a hinge structure on a side of the lens substrate and including a fastener configured to fasten to the LED module.Type: ApplicationFiled: January 2, 2015Publication date: September 17, 2015Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Seong-ah JOO
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Publication number: 20140213003Abstract: The present invention relates to a GaN type LED device and a method of manufacturing the same. More particularly, there are provided a GaN type LED device including an LED chip; and a submount eutectic-bonded with the LED chip through an adhesive layer, wherein the adhesive layer is configured by soldering a plurality of metallic layers in which a first metallic layer and a second metallic layer are sequentially stacked, and the second metallic layer is formed in a paste form. Further, the present invention provides a method of manufacturing the GaN type LED device.Type: ApplicationFiled: March 28, 2014Publication date: July 31, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kun Yoo KO, Young June JEONG, Seung Hwan CHOI, Seong Ah JOO, Jung Kyu PARK
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Patent number: 8563338Abstract: Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.Type: GrantFiled: February 8, 2012Date of Patent: October 22, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Jung Kyu Park, Yu Dong Kim, Seung Hwan Choi, Seong Ah Joo
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Patent number: 8541800Abstract: There is provided a light emitting device package including: a package body providing a chip mounting area and including first and second lead terminals; an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals; a groove portion disposed around the LED chip in the chip mounting area; and a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape defined by the groove portion.Type: GrantFiled: December 21, 2009Date of Patent: September 24, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Seong Ah Joo, Hyo Jin Lee, Il Woo Park, Kyung Tae Kim
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Patent number: 8507299Abstract: The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.Type: GrantFiled: May 21, 2010Date of Patent: August 13, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Seong Ah Joo, Chang Hoon Kwak, Na Na Park, Il Woo Park
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Patent number: 8445927Abstract: The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.Type: GrantFiled: January 27, 2009Date of Patent: May 21, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Seong Ah Joo, Chang Hoon Kwak, Na Na Park, Il Woo Park
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Publication number: 20120142127Abstract: Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.Type: ApplicationFiled: February 8, 2012Publication date: June 7, 2012Applicant: Samsung LED Co., Ltd.Inventors: Jung Kyu PARK, Yu Dong KIM, Seung Hwan CHOI, Seong Ah JOO
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Patent number: 8168997Abstract: Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electrically connected to the PCB through the conductive structure.Type: GrantFiled: August 15, 2008Date of Patent: May 1, 2012Assignee: Samsung LED Co., Ltd.Inventors: Seong Ah Joo, Jung Kyu Park, Kun Yoo Ko, Young June Jeong, Seung Hwan Choi
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Patent number: 8143634Abstract: Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.Type: GrantFiled: December 19, 2007Date of Patent: March 27, 2012Assignee: Samsung LED Co., Ltd.Inventors: Jung Kyu Park, Yu Dong Kim, Seung Hwan Choi, Seong Ah Joo
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Patent number: 8132953Abstract: There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing. Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.Type: GrantFiled: October 2, 2008Date of Patent: March 13, 2012Assignee: Samsung LED Co., Ltd.Inventors: Jung Kyu Park, Seong Ah Joo, Seung Hwan Choi
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Publication number: 20110260192Abstract: A light emitting diode (LED) package using a liquid crystal polymer, includes: a package main body formed by using a liquid crystal polymer; a lead frame formed on the package main body; an LED chip mounted on the lead frame; and a resin packaging unit encapsulating the LED chip, the resin packaging unit including phosphors. The LED package is highly reliable.Type: ApplicationFiled: October 1, 2009Publication date: October 27, 2011Inventors: Chang Hoon Kwak, II Woo Park, Jong Rak Sohn, Hyo Jin Lee, Na Na Park, Seong Ah Joo
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Publication number: 20110249424Abstract: There is provided a light emitting device package including: a package body providing a chip mounting area and including first and second lead terminals; an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals; a groove portion disposed around the LED chip in the chip mounting area; and a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape defined by the groove portion.Type: ApplicationFiled: December 21, 2009Publication date: October 13, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Seong Ah Joo, Hyo Jin Lee, Il Woo Park, Kyung Tae Kim
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Publication number: 20100227424Abstract: The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.Type: ApplicationFiled: May 21, 2010Publication date: September 9, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Ah JOO, Chang Hoon KWAK, Na Na PARK, Il Woo PARK
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Publication number: 20100127290Abstract: The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.Type: ApplicationFiled: January 27, 2009Publication date: May 27, 2010Inventors: Seong Ah Joo, Chang Hoon Kwak, Na Na Park, II Woo Park
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Patent number: 7705278Abstract: Provided is a backlight unit including one or more white light emitting diodes (LEDs) for generating light; an LED module having a printed circuit board (PCB), the LED module supporting and driving the white LED; a sensor for detecting the color temperature of the white LED; a heat generating element connected to the LED module; and a controller for controlling the sensor, the LED module, and the heat generating element.Type: GrantFiled: December 19, 2007Date of Patent: April 27, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jung Kyu Park, Seong Ah Joo, Hun Joo Hahm
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Publication number: 20090161343Abstract: There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing. Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.Type: ApplicationFiled: October 2, 2008Publication date: June 25, 2009Inventors: Jung Kyu PARK, Seong Ah Joo, Seung Hwan Choi
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Publication number: 20090085052Abstract: The present invention relates to a GaN type LED device and a method of manufacturing the same. More particularly, there are provided a GaN type LED device including an LED chip; and a submount eutectic-bonded with the LED chip through an adhesive layer, wherein the adhesive layer is configured by soldering a plurality of metallic layers in which a first metallic layer and a second metallic layer are sequentially stacked, and the second metallic layer is formed in a paste form. Further, the present invention provides a method of manufacturing the GaN type LED device.Type: ApplicationFiled: September 10, 2008Publication date: April 2, 2009Inventors: Kun Yoo Ko, Young June Jeong, Seung Hwan Choi, Seong Ah Joo, Jung Kyu Park
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Publication number: 20090072256Abstract: Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.Type: ApplicationFiled: December 19, 2007Publication date: March 19, 2009Inventors: Jung Kyu Park, Yu Dong Kim, Seung Hwan Choi, Seong Ah Joo
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Publication number: 20090072119Abstract: Provided is a backlight unit including one or more white light emitting diodes (LEDs) for generating light; an LED module having a printed circuit board (PCB), the LED module supporting and driving the white LED; a sensor for detecting the color temperature of the white LED; a heat generating element connected to the LED module; and a controller for controlling the sensor, the LED module, and the heat generating element.Type: ApplicationFiled: December 19, 2007Publication date: March 19, 2009Inventors: Jung Kyu Park, Seong Ah Joo, Hun Joo Hahm
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Publication number: 20090050923Abstract: Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electrically connected to the PCB through the conductive structure.Type: ApplicationFiled: August 15, 2008Publication date: February 26, 2009Inventors: Seong Ah Joo, Jung Kyu Park, Kun Yoo Ko, Young June Jeong, Seung Hwan Choi