Abstract: The present disclosure relates to a stereoscopic surface display device, and more particularly, to a stereoscopic surface display device including: a light source unit including a plurality of optical elements; and a stereoscopic display unit disposed on the light source unit. The stereoscopic display unit includes: a polymer layer; and a light absorption layer buried in the polymer layer. The stereoscopic display unit includes a plurality of cell areas arranged in two-dimension, the light absorption layer is disposed in the plurality of cell areas, the plurality of optical elements vertically overlap the plurality of cell areas, respectively, and each of the plurality of cell areas has a stereoscopic shape.

Abstract: Provided is a stereoscopic surface display device including a stereoscopic display unit having a cell area, wherein the stereoscopic display unit includes a first flexible layer, a first optical waveguide and a first optical output unit in the first flexible layer, wherein the first optical output unit are disposed in the cell area, a first light source disposed on a side of the stereoscopic display unit, wherein the first optical waveguide connects the first light source and the first optical output unit, a first photothermal response layer on the first flexible layer, wherein the first photothermal response layer is configured to receive output light emitted from the first optical output unit and emit thermal energy, and a shape deformation layer on the first photothermal response layer, wherein the shape deformation layer is configured to generate bending deformation by receiving the thermal energy from the first photothermal response layer.

Abstract: An optical image stabilization OIS unit including a base; a holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the bobbin and the outer blade; a first coil disposed on the bobbin; a magnet configured to move the bobbin by interacting with the first coil; a second coil configured to move the holder module by interacting with the magnet; a wire electrically connected with the first coil through the spring member; and a buffer unit connected with the wire, wherein the buffer unit has a curved shape having a curvature.

Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

Abstract: A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member.

Abstract: An auto calibration method and an optical image stabilizer (OIS) camera using the same are provided. The auto calibration method includes removing a DC offset of a gyroscope. A vibrator signal applied by operating a vibrator, and an actual measurement value of the gyroscope is obtained using the applied vibrator signal. A first gain value for compensating for sensitivity of the gyroscope is calculated using the vibrator signal and the actual measurement value of the gyroscope, and an actuator is operated. A displacement of a pixel actually moving on an image is moved under an operation of the actuator. A second gain value for controlling a sensitivity variation of the actuator is calculated based on the displacement of the actually moving pixel. Accordingly, it is possible to reduce processing time and to ensure high performance.

Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

Abstract: An auto calibration method and an optical image stabilizer (OIS) camera using the same are provided. The auto calibration method includes removing a DC offset of a gyroscope. A vibrator signal applied by operating a vibrator, and an actual measurement value of the gyroscope is obtained using the applied vibrator signal. A first gain value for compensating for sensitivity of the gyroscope is calculated using the vibrator signal and the actual measurement value of the gyroscope, and an actuator is operated. A displacement of a pixel actually moving on an image is moved under an operation of the actuator. A second gain value for controlling a sensitivity variation of the actuator is calculated based on the displacement of the actually moving pixel. Accordingly, it is possible to reduce processing time and to ensure high performance.

Abstract: An auto calibration method and an optical image stabilizer (OIS) camera using the same are provided. The auto calibration method includes removing a DC offset of a gyroscope. A vibrator signal applied by operating a vibrator, and an actual measurement value of the gyroscope is obtained using the applied vibrator signal. A first gain value for compensating for sensitivity of the gyroscope is calculated using the vibrator signal and the actual measurement value of the gyroscope, and an actuator is operated. A displacement of a pixel actually moving on an image is moved under an operation of the actuator. A second gain value for controlling a sensitivity variation of the actuator is calculated based on the displacement of the actually moving pixel. Accordingly, it is possible to reduce processing time and to ensure high performance.

Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module: a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

Abstract: A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

Abstract: A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member.

Abstract: A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member.