Abstract: Provided is a semiconductor device and a method of manufacturing the same. In the method of manufacturing a semiconductor device, a substrate is prepared which is transparent and has a plurality of first electrodes thereon, and a semiconductor chip having a plurality of second electrodes thereon is disposed on the substrate to allow the first and second electrodes to respectively face each other. A polymer layer including solder particles and an oxidizing agent is formed between the substrate and the semiconductor chip, and the solder particles is locally fused between the first and second electrodes by using a laser beam and a fused solder layer is formed which electrically connects between the first and second electrodes.

Abstract: A heat exchanger for a vehicle includes a heat radiating portion including first and second connecting lines formed alternately by stacking a plurality of plates, and receiving first and second operating fluids therethrough that heat-exchange with each other while circulating unmixed through the respective first and second connecting lines, a bifurcating portion connecting an inflow hole for flowing one of the first and second operating fluids with an exhaust hole for exhausting the one operating fluid to bypass the heat radiating portion according to a temperature of the one operating fluid, and a valve unit mounted at the inflow hole to selectively open one of the connecting lines by expansion and contraction of deformable material so as to flow the operating fluid selectively to the heat radiating portion or the bifurcating portion according to a temperature of the one operating fluid flowing into the inflow hole.

Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.

Abstract: Provided is a method of measuring signal transmission time difference of a measuring device. The measuring device according to embodiments, by measuring a skew on two optical paths through signal delays of sufficient sizes for skew measurement on the optical paths, even a skew having a minute size can be measured within a measurable range.

Abstract: The present inventive concept discloses an impact-type piezoelectric micro power generator. The impact-type piezoelectric micro power generator may comprise a base having a cavity and at least one stop area adjacent to the cavity; a frame fastened to the base; a vibrating body comprising a plurality of first vibrating beams extended from the frame toward a top of the cavity, an impact beam connected to between first tips of the plurality of first vibrating beams and extended onto the stop area, and a second vibrating beam extended from the impact beam to between the plurality of first vibrating beams, the second vibrating beam having a second tip; and a piezoelectric device disposed on one of a top and a bottom of the second vibrating beam and the impact beam, the piezoelectric device generating electric power according to impacts of the vibrating body to the stop area and bending of the impact beam and the second vibrating beam.

Abstract: The present invention is directed to methods of diagnosing the presence or absence of a bacterial infection in a patient, in particular, a tuberculosis infection, by measuring exhaled, isotopically labeled nitrogen gas after administration of isotopic ally labeled isoniazid.

Abstract: Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.

Abstract: There are provided a recombinant silk protein derived from sea anemones, a method for producing the same, and a composition for preparing a silk fiber including same. The recombinant silk protein derived from sea anemones has sequence features similar to genetic information of a silk protein derived from spiders and silkworms. Also, a large amount of recombinant silk protein derived from sea anemones may be produced from a transformant and it has good physical properties such as strength and elasticity. Therefore, the recombinant silk protein derived from sea anemones can be usefully applied in various industrial fields in which natural silk protein can be applied, and it is expected to create new industrial fields based on its distinctive mechanical properties.

Abstract: Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.

Abstract: Disclosed is a fog removal system which can blow dry air onto roads, airport runways, harbors, or into coastal areas in which fog regularly occurs to reduce the relative humidity of atmospheric air down from about 100%, to thereby remove the fog. Particularly, in the fog removal system, a heating unit and a blowing unit may be connected to areas such as roads, airport runways, harbors, or coastal areas in which fog regularly occurs, to blow dry air generated in the heating unit over a long range using a strong blowing pressure from the blowing unit.

Abstract: Provided is a method of fabricating a solder particle including adding a first magnetic bar in a first container including a mixture containing first solder particles formed through a mixing process, disposing the first container in a second container including a second magnetic bar, operating the first magnetic bar and the second magnetic bar, and applying heat to the first container to melt the first solder particles.

Abstract: A conductive composition for a front electrode busbar of a silicon solar cell includes a metallic powder, a solder powder, a curable resin, a reducing agent, and a curing agent. A method of manufacturing a front electrode busbar of a silicon solar cell includes applying the composition to the front surface of the silicon solar cell wherein its front electrode finger line is formed. A substrate includes a front electrode busbar of a silicon solar cell, formed with a conductive composition. A silicon solar cell includes one or more electrodes containing a conductive composition including a conductive powder, a curable resin, a reducing agent, and a curing agent. A method of manufacturing the silicon solar cell includes forming a first electrode array with a first conductive composition, forming a second electrode, and forming a third electrode with a third conductive composition.

Abstract: Titanium suboxide (TixO2x-1) nanoparticles useful as a support for a catalyst electrode of a fuel cell, and a method for synthesizing the titanium suboxide (TixO2x-1) nanoparticles by using TiO2, a Co catalyst and hydrogen gas at a low temperature ranging from 600 to 900° C. are described Since the titanium suboxide nanoparticles show high corrosion resistance to acid and durability and have excellent thermal and electric conductivities, a catalyst electrode manufactured by using the same as a support exhibits improved catalytic activity and oxidation reduction (redox) properties.

Abstract: An apparatus and method for determining contents information corresponding to a Rights Object (RO) by transmitting information on contents together when the RO is moved from a mobile device to a memory card or a smart card or when the RO is moved from the memory card or the smart card to the mobile device are provided. The apparatus includes a meta information manager for determining information on contents corresponding to the RO when the RO is moved, and for generating meta information containing the determined contents information, and a controller for providing control to transmit the RO and the meta information generated by the meta information manager to a portable storage device. Accordingly, the conventional problem can be solved in which information on contents cannot be determined by using a Contents IDentifier (CID) if the RO does not exist together with the contents.

Abstract: Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.

Abstract: A display module including a touch panel configured to be touched so as to input information, a liquid crystal display panel disposed below the touch panel and configured to display the information to be touched on the touch panel, a plurality of emitting light units configured to emit infrared light formed in at least two sides of the touch panel, a plurality of image sensors disposed below the liquid crystal panel and configured to detect infrared rays redirected through the liquid crystal panel towards the image sensors based on a touching of the touch panel, and a controller configured to determine a portion of the touch panel that is touched based on signals received from the plurality of image sensors.

Abstract: Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.

Abstract: Provided is a method of measuring signal transmission time difference of a measuring device. The measuring device according to embodiments, by measuring a skew on two optical paths through signal delays of sufficient sizes for skew measurement on the optical paths, even a skew having a minute size can be measured within a measureable range.

Abstract: The present invention relates to recombinant mussel adhesive protein wherein a DOPA residue is in vivo incorporated instead of a tyrosine residue, and a method for producing the same. More specifically, the present invention relates to recombinant mussel adhesive protein wherein a DOPA residue is incorporated instead of a tyrosine residue, and a method for producing the same, and a transformant for producing the recombinant mussel adhesive protein.

Abstract: The present inventive concept discloses an impact-type piezoelectric micro power generator. The impact-type piezoelectric micro power generator may comprise a base having a cavity and at least one stop area adjacent to the cavity; a frame fastened to the base; a vibrating body comprising a plurality of first vibrating beams extended from the frame toward a top of the cavity, an impact beam connected to between first tips of the plurality of first vibrating beams and extended onto the stop area, and a second vibrating beam extended from the impact beam to between the plurality of first vibrating beams, the second vibrating beam having a second tip; and a piezoelectric device disposed on one of a top and a bottom of the second vibrating beam and the impact beam, the piezoelectric device generating electric power according to impacts of the vibrating body to the stop area and bending of the impact beam and the second vibrating beam.