Abstract: An electronics package is disclosed. The electronics package is disclosed as including a substrate core, a metal layer established on top of the substrate core, the metal layer being etched so as to include a die attachment anchor and at least one gap that separates a die bonding pad from at least one of a trace and wire bonding pad, for example. The die attachment anchor is established on top of the die bonding pad and has a depth that does not extend all the way through the die bonding pad.

Abstract: A light-emitting device having a light source die mounted within an aperture is disclosed. The aperture is covered by a die attach pad on one side. The light source die is mounted on a die attach pad within the aperture. In one embodiment, an optical coupling layer can be formed within an aperture encapsulating a light source die. A wavelength converting layer can be formed on the substrate above the optical coupling layer. The wavelength converting layer can comprise a high density layer and a low density layer. The high density layer can comprise wavelength-converting material precipitated on one side of the wavelength converting layer. The low density layer can comprise the wavelength-converting material in particle form suspended within the wavelength converting layer. In one embodiment, the wavelength converting layer may be confined within the aperture of the substrate.

Abstract: An electronics package is disclosed. The electronics package is disclosed as including a substrate core, a metal layer established on top of the substrate core, the metal layer being etched so as to include a die attachment anchor and at least one gap that separates a die bonding pad from at least one of a trace and wire bonding pad, for example. The die attachment anchor is established on top of the die bonding pad and has a depth that does not extend all the way through the die bonding pad.

Abstract: An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.

Abstract: A multi-segment display is disclosed. Specifically, a low height LED-based display is disclosed that includes a number of segments. The segment construction may include a Printed Circuit Board (PCB) layer, a first substrate, and a second substrate that are laminated or otherwise connected to one another. The first and second substrates may include windows which allow light generated by a light source mounted on the PCB to exit the display and one or more of the windows may be filled with an encapsulant.

Abstract: An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.

Abstract: A multi-segment display is disclosed. Specifically, a low height LED-based display is disclosed that includes a number of segments. The segment construction may include a Printed Circuit Board (PCB) layer, a first substrate, and a second substrate that are laminated or otherwise connected to one another. The first and second substrates may include windows which allow light generated by a light source mounted on the PCB to exit the display and one or more of the windows may be filled with an encapsulant.

Abstract: An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.

Abstract: Electronic substrates having cavities located therein and methods of making the substrates are disclosed herein. An embodiment of a method of making the substrate comprises manufacturing a circuit board. An adhesive film is attached to the circuit board, wherein the adhesive film has a first side facing the circuit board and a second side located opposite the first side, and wherein the second side is adhesive. At least one cavity is formed in a material. The material is adhered to the second side of the adhesive film.

Abstract: Displays and methods of manufacturing displays are disclosed herein. An embodiment of a method of manufacturing a display comprises manufacturing a circuit board; forming a hole in a material; attaching the circuit board to the material, wherein the hole forms a cavity upon attachment of the circuit board to the material; and connecting a light source to the circuit board, the light source being located within the cavity.

Abstract: A light source and method for making the same are disclosed. The light source includes a substrate, a plurality of dies and a transparent layer of encapsulant. The substrate includes an insulating layer having top and bottom surfaces, the top surface having a first metal patterned layer thereon, and the bottom surface having a second metal patterned layer thereon. The first metal patterned layer has a plurality of die mounting areas thereon, and the second metal patterned layer includes a first contact layer that underlies the die mounting area, the die mounting area and the first contact layer being connected by metal lined vias at each of the die mounting areas. The transparent encapsulant covers the plurality of dies and is bonded to the first metal patterned layer and the top surface of the insulating layer.

Abstract: A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned aperture. A light emitting diode is mounted on a metallic layer covering the bottom of the aperture, and is encapsulated by a transparent encapsulant material. The metallic layer provides a thermal path for heat generated by the light emitting diode.

Abstract: A light unit is provided that includes a thin flexible substrate layer. A number of flexible electrical tracks are formed on the flexible substrate layer. A number of Light Emitting Diodes (LEDs) are arranged on the flexible substrate layer along the electrical tracks and are electrically connected to the electrical tracks such that the light unit is both thin and flexible.

Abstract: A light unit is provided that includes a thin flexible substrate layer. A number of flexible electrical tracks are formed on the flexible substrate layer. A number of Light Emitting Diodes (LEDs) are arranged on the flexible substrate layer along the electrical tracks and are electrically connected to the electrical tracks such that the light unit is both thin and flexible.

Abstract: A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned recess. A light emitting diode is mounted in the recess and the substrate is encapsulated by a transparent encapsulant material forming an ellipsoidal dome over the light emitting diode.

Abstract: A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned aperture. A light emitting diode is mounted on a metallic layer covering the bottom of the aperture, and is encapsulated by a transparent encapsulant material. The metallic layer provides a thermal path for heat generated by the light emitting diode.

Abstract: A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned recess. A light emitting diode is mounted in the recess and the substrate is encapsulated by a transparent encapsulant material forming an ellipsoidal dome over the light emitting diode.

Abstract: A method of interconnecting bond pads on a semiconductor die to leads of a package is disclosed. The method includes placing a connector over each bond pad and its corresponding lead. The connector is one of a plurality of ganged connectors. The method also includes electrically connecting the connector to the bond pad and the lead and singularizing the connector from the plurality of ganged connectors. Such a method of interconnection has the advantage of simultaneously interconnecting multiple bond pads to leads. In a preferred embodiment, light-emitting diodes (LEDs) are manufactured using the method. A PCB is etched to produced lead pairs of the LEDs. A semiconductor die is attached to a first lead of each lead pair. Ganged interconnects are aligned with and tagged onto the dies and the second leads of the lead pairs, thereby electrically connecting them. After tagging, the interconnects are singularized. An encapsulant is applied on each die and interconnect.