Abstract: Disclosed is a decay heat removal system for cooling the decay heat of a reactor core and the spent fuel. The decay heat removal system including: a first heat pipe which is placed in an upper plenum of the reactor vessel and arranged in upward and downward directions corresponding to a position of an insertion hole formed on a top of the nuclear fuel assemblies; a control rod drive mechanism which is connected to an upper portion of the first heat pipe and drives the first heat pipe to move up and down so that the first heat pipe can be selectively inserted in a control rod insertion hole of the reactor core arranged in the nuclear reactor vessel; and a second heat pipe which is coupled to and in close contact with a bottom surface of the reactor vessel and removes the decay heat generated in the reactor core.

Abstract: Disclosed is a decay heat removal system for cooling the decay heat of a reactor core and the spent fuel. The decay heat removal system including: a first heat pipe which is placed in an upper plenum of the reactor vessel and arranged in upward and downward directions corresponding to a position of an insertion hole formed on a top of the nuclear fuel assemblies; a control rod drive mechanism which is connected to an upper portion of the first heat pipe and drives the first heat pipe to move up and down so that the first heat pipe can be selectively inserted in a control rod insertion hole of the reactor core arranged in the nuclear reactor vessel; and a second heat pipe which is coupled to and in close contact with a bottom surface of the reactor vessel and removes the decay heat generated in the reactor core.

Abstract: The present invention relates to a prepreg, a composite film, and a laminated material for circuit used for thermosetting composite resin compositions and printed circuit boards, and particularly to a thermosetting composite resin composition mixed with COP (Cyclo Olefin Polymer) and thermally cross-linkable resin, wherein the COP having excellent electrical characteristics at a high frequency and thermally cross-linkable resin are blended to allow having a less dielectric constant and a less dielectric loss than those of the conventional composite resin composition, and inorganic fillers such as ceramic material, metal material, carbon black are added to allow having dielectric characteristics covering from a low dielectric constant to a high dielectric constant.

Abstract: The present invention relates to a prepreg, a composite film, and a laminated material for circuit used for thermosetting composite resin compositions and printed circuit boards, and particularly to a thermosetting composite resin composition mixed with COP (Cyclo Olefin Polymer) and thermally cross-linkable resin, wherein the COP having excellent electrical characteristics at a high frequency and thermally cross-linkable resin are blended to allow having a less dielectric constant and a less dielectric loss than those of the conventional composite resin composition, and inorganic fillers such as ceramic material, metal material, carbon black are added to allow having dielectric characteristics covering from a low dielectric constant to a high dielectric constant.