Patents by Inventor Seong Ho Choi

Seong Ho Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250071896
    Abstract: A circuit board include: a substrate having a first surface including a first region and a second region; a connection pad disposed in the first region and having a first height in a direction perpendicular to the first surface; a circuit wiring disposed in the second region, including different metal films, and having a second height in the direction perpendicular to the first surface to be greater than the first height; and an insulating pattern layer covering the circuit wiring in the second region and protruding from the first surface to have a step from the first region.
    Type: Application
    Filed: February 27, 2024
    Publication date: February 27, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Seong Ho Choi
  • Publication number: 20250051889
    Abstract: The present invention relates to a high-strength steel sheet having excellent formability and a high yield ratio, and a manufacturing method therefor, and more particularly, to a high-strength steel sheet having excellent formability and a high yield ratio, and a manufacturing method therefor, the steel sheet having various uses such as that of vehicle parts.
    Type: Application
    Filed: December 14, 2022
    Publication date: February 13, 2025
    Applicant: POSCO CO., LTD
    Inventors: Jae-Hoon LEE, Seong-Ho HAN, Yong-Hoon CHOI
  • Publication number: 20250052928
    Abstract: Exemplary flexible coverlenses and the methods of making them are described. The methods may include exposing a surface of a substrate layer to a surface treatment plasma to form a treated surface of the substrate layer. A silicon-containing adhesion layer may be deposited on the treated surface of the substrate layer. A silane-containing adhesion promoter may be incorporated on the silicon-containing adhesion layer. The method may also include forming a hardcoat layer on the silicon-containing adhesion layer, where the silane-containing adhesion promoter is bonded to both the hardcoat layer and the silicon-containing adhesion layer. The exemplary flexible coverlenses made by the present methods are less susceptable to folding fatigue along a bending or folding axis of the coverlens.
    Type: Application
    Filed: December 20, 2021
    Publication date: February 13, 2025
    Applicant: Applied Materials, Inc.
    Inventors: Helinda Nominada, Harvey You, Han Nguyen, Tae Kyung Won, Seong Ho Yoo, Soo Young Choi
  • Patent number: 12221089
    Abstract: The present disclosure relates to a master cylinder and an electronic brake system having the same. The master cylinder includes a cylinder block having a bore of a multi-stage form in a longitudinal direction therein, a first master chamber and a second master chamber sequentially arranged in series in the bore, a first master piston provided to move in connection with an operation of a brake pedal and to pressurize the first master chamber, a second master piston provided to be displaceable by a displacement of the first master piston or a hydraulic pressure in the first master chamber and to pressurize the second master chamber, and a pedal simulator interposed between the first master piston and the second master piston to provide a reaction force to the brake pedal, wherein a cross-sectional area of the first master piston is provided to be relatively larger than a cross-sectional area of the second master piston.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: February 11, 2025
    Assignee: HL MANDO CORPORATION
    Inventors: Jin Seok Kim, Seong Ho Choi
  • Patent number: 12217003
    Abstract: An apparatus for processing natural language according to an embodiment includes a collection module that collects documents having tags, a parsing module that extracts text from the collected documents and extracts tag-related information on the tag surrounding each extracted text, and a preprocessing module that generates tokens of a preset unit by tokenizing each extracted text, generates token position information for each token in full text of the document, and sets the token and the token position information as training data in matching with the tag-related information.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: February 4, 2025
    Assignee: SAMSUNG SDS CO., LTD.
    Inventors: Bong-Kyu Hwang, Ju-Dong Kim, Jae-Woong Yun, Hyun-Jae Lee, Hyun-Jin Choi, Seong-Ho Joe, Young-June Gwon
  • Publication number: 20250038252
    Abstract: The present disclosure relates to a sulfide-based solid electrolyte having a new composition and a new crystal structure.
    Type: Application
    Filed: December 6, 2023
    Publication date: January 30, 2025
    Inventors: Sun Ho Choi, Yong Jun Jang, Yong Gu Kim, Seong Hyeon Choi, Sa Heum Kim, Sung Man Cho, Sang Uck Lee, Ji Hoon Kim, Ji Won Lee, Ji Seon Kim
  • Patent number: 12194969
    Abstract: Disclosed is to an electronic brake system. The electronic brake system includes an integrated master cylinder having a simulation chamber, a first master chamber, and a second master chamber arranged in order from a side of a brake pedal, wherein the integrated master cylinder includes a simulation piston provided to be displaceable by the brake pedal to pressurize the simulation chamber, a first master piston configured to pressurize the first master chamber and having a diameter smaller than a diameter of the simulation piston, a second master piston configured to pressurize the second master chamber and having a diameter smaller than a diameter of the first master piston, and an elastic member interposed between the simulation piston and the first master piston to provide the brake pedal with a reaction force.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: January 14, 2025
    Assignee: HL MANDO CORPORATION
    Inventors: Jin Seok Kim, Seong Ho Choi
  • Patent number: 12156329
    Abstract: A printed circuit board includes an insulating layer, and a first wiring layer at least partially embedded in one surface of the insulating layer, one surface of the first wiring layer being exposed from the one surface of the insulating layer. The insulating layer includes a first insulating layer covering at least a portion of a side surface of the first wiring layer, and a second insulating layer disposed on the first insulating layer and the first wiring layer, and the first and second insulating layers include different insulating materials.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: November 26, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Ho Choi, Seong Il Jeon
  • Patent number: 12049206
    Abstract: The present disclosure relates to an electronic brake system. The electronic brake system includes a reservoir in which a pressurized medium is stored, an integrated master cylinder having a master chamber and a simulation chamber, a reservoir flow path provided to communicate the integrated master cylinder with the reservoir, a hydraulic pressure supply device provided to generate a hydraulic pressure by operating a hydraulic piston according to an electrical signal output in response to a displacement of the brake pedal, a hydraulic control unit including a first hydraulic circuit provided to control the hydraulic pressure to be transferred to two wheel cylinders, and a second hydraulic circuit provided to control the hydraulic pressure to be transferred to the other two wheel cylinders, and an electronic control unit configured to control valves based on hydraulic pressure information and displacement information of the brake pedal.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: July 30, 2024
    Assignee: HL MANDO CORPORATION
    Inventors: Jin Seok Kim, Seong Ho Choi
  • Patent number: 12049207
    Abstract: Disclosed herein an electronic brake system includes a hydraulic pressure supply device including a first pressure chamber and a second pressure chamber partitioned by a hydraulic piston, and a hydraulic control unit, wherein the hydraulic control unit comprises a first hydraulic flow path connecting the first pressure chamber and one of the first and second hydraulic circuits, a second hydraulic flow path branched from the first hydraulic flow path to connect to the other one of the first and second hydraulic circuits, a third hydraulic flow path branched from the first hydraulic flow path on upstream side of a branch point of the second hydraulic flow path to connect the second pressure chamber, and a fourth hydraulic flow path branched from the first hydraulic flow path on upstream side of a branch point of the third hydraulic flow path to connect the third hydraulic flow path.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: July 30, 2024
    Assignee: HL MANDO CORPORATION
    Inventors: Jin Seok Kim, Seong Ho Choi
  • Patent number: 12038639
    Abstract: A display device includes: a display panel including a display area and a non-display area; a flexible printed circuit board overlapping and attached to the display panel; a pair of first alignment indicia disposed in the non-display area; a pair of second alignment indicia adjacent to the first alignment indicia; a pair of third alignment indicia disposed on the flexible printed circuit board.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: July 16, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Myong-Soo Oh, Doo San Park, Hyun Chul Jin, Seong Ho Choi
  • Publication number: 20240206063
    Abstract: A circuit board includes: a substrate having a first surface and a second surface opposing each other; a first connection pad protruding from the first surface in a first direction perpendicular to the first surface of the substrate and having an upper surface and a side surface intersecting each other; a first conductive layer disposed on the upper surface of the first connection pad; and a second conductive layer disposed in contact with an upper surface of the first conductive layer and the side surface of the first connection pad.
    Type: Application
    Filed: May 19, 2023
    Publication date: June 20, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Ho Choi, Seongil Jeon
  • Patent number: 11993233
    Abstract: Provided is an electronic brake system.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: May 28, 2024
    Assignee: HL MANDO CORPORATION
    Inventors: Jin Seok Kim, Seong Ho Choi
  • Patent number: 11993232
    Abstract: Provided is an electronic brake system including: a reservoir in which a pressurized medium is stored; an integrated master cylinder including a simulation chamber, a simulation piston provided in the simulation chamber to be displaceable by a brake pedal, a master chamber, a master piston provided in the master chamber to be displaceable by a displacement of the simulation piton or a hydraulic pressure of the simulation chamber, an elastic member provided between the simulation piston and the master piston, a piston spring elastically supporting the master piston, a simulation flow path connecting the simulation chamber to the reservoir, and a simulator valve provided in the simulation flow path to control a flow of a pressurized medium; a hydraulic pressure providing unit provided to generate a hydraulic pressure by operating a hydraulic piston according to an electrical signal output in response to a displacement of the brake pedal; a hydraulic pressure control unit including a first hydraulic circuit prov
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: May 28, 2024
    Assignee: HL MANDO CORPORATION
    Inventors: Jin Seok Kim, Seong Ho Choi
  • Publication number: 20240155764
    Abstract: A printed circuit board includes: a first interconnection layer; a first insulating layer covering at least a portion of a side surface of the first interconnection layer; a second insulating layer covering at least a portion of an upper surface of the first interconnection layer and at least a portion of an upper surface of the first insulating layer; a third insulating layer covering at least a portion of a lower surface of the first interconnection layer and at least a portion of a lower surface of the first insulating layer; a second interconnection layer disposed on an upper surface of the second insulating layer; and a third interconnection layer disposed on a lower surface of the third insulating layer.
    Type: Application
    Filed: February 1, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Ho CHOI, Seong Il JEON
  • Publication number: 20240123950
    Abstract: A vehicle moving apparatus may include a housing extending in a first direction; an elevator coupled to the housing to be movable in the first direction and another direction opposite thereto, extending in a third direction and being inserted to be drawable into an underside space of a vehicle, and configured to lift or lower a wheel of the vehicle; and a wheel assembly coupled to the elevator and configured to move the housing and the elevator in a direction toward the vehicle or in a direction opposite the vehicle, wherein the wheel assembly includes a wheel rotatably provided with a vertical direction as an axis, and configured to movably support the elevator; and an actuator coupled to the wheel and configured to provide power for rotating the wheel, wherein the wheel is rotatable such that a diameter of the wheel is aligned between the first and third directions.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 18, 2024
    Applicant: HL MANDO CORPORATION
    Inventors: Jeong Jae PARK, Seung Tae BAEK, WanKyu CHOI, Joon-Kyu SONG, Seong Ho CHOI
  • Patent number: 11963301
    Abstract: A printed circuit board includes: an insulating layer; a first circuit layer disposed on one surface of the insulating layer, and including a first circuit pattern and a first connection pad; and a surface treatment layer disposed on one surface of the first connection pad. The other surface of the first connection pad is covered by the insulating layer, and at least a portion of a side surface of the first connection pad is spaced apart from the insulating layer.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Ho Choi, Tae Seok Kim
  • Publication number: 20240120275
    Abstract: A metal wiring of a semiconductor device may include: a first metal line disposed in a first metal layer, and defined with an opening in a first region; and a contact metal passing through a dielectric layer under the first metal layer adjacent to the opening and connected to the first metal line around the opening.
    Type: Application
    Filed: May 1, 2023
    Publication date: April 11, 2024
    Inventors: Seong Ho CHOI, Chang Man SON
  • Patent number: 11951967
    Abstract: The present disclosure relates to an electronic brake system. The electronic brake system includes a reservoir in which a pressurized medium is stored, an integrated master cylinder including a master chamber and a simulation chamber, a reservoir flow path communicating the integrated master cylinder with the reservoir, a hydraulic pressure supply device provided to generate a hydraulic pressure by operating the hydraulic piston according to an electrical signal output in response to a displacement of the brake pedal, a hydraulic control unit including a first hydraulic circuit provided to control the hydraulic pressure transferred to two wheel cylinders and a second hydraulic circuit provided to control the hydraulic pressure transferred to the other two wheel cylinders, and an electronic control unit provided to control valves based on hydraulic pressure information and displacement information of the brake pedal.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: April 9, 2024
    Assignee: HL MANDO CORPORATION
    Inventors: Jin Seok Kim, Seong Ho Choi
  • Publication number: 20240074050
    Abstract: A printed circuit board according to an embodiment includes: an insulation layer including a recess portion; and a connection pad disposed on the recess portion of the insulation layer and protruded from the recess portion, wherein the connection pad may include a protrusion and a concave portion that is lower than the protrusion, and a surface height of the protrusion of the connection pad may be substantially the same as or less than a surface height of the insulation layer.
    Type: Application
    Filed: May 30, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Ki Min, Seong Ho Choi