Abstract: A ring-type wearable device is disclosed. The disclosed ring-type wearable device comprises: an outer ring member; an inner ring member separably inserted into the outer ring member; a sensor unit disposed in the outer ring member; and a control unit disposed in the outer ring member so as to be electrically connected to the sensor unit, wherein the sensor unit can maintain constant sensitivity in correspondence to the thickness of the inner ring member.

Abstract: A display may include flexible substrate, a blocking layer on the flexible substrate, a pixel on the flexible substrate and the blocking layer, and a scan line, a data line, a driving voltage line, and an initialization voltage line connected to the pixel. The pixel may include an organic light emitting diode, a switching transistor connected to the scan line, and a driving transistor to apply a current to the organic light emitting diode. The blocking layer is in an area that overlaps the switching transistor on a plane, and between the switching transistor and the flexible substrate, and receives a voltage through a contact hole that exposes the blocking layer.

Abstract: An apparatus for extracting object information according to one embodiment includes: a padding image generator for generating a padding image including an original image; a partial image acquirer for acquiring a plurality of partial images of the padding image; an object classification result acquirer for acquiring an object classification result for each of the plurality of partial images using an object classification model; a confidence map generator for generating a confidence map having a size the same as that of the padding image and including a confidence value on the basis of the object classification result; and an object information acquirer for acquiring information on an object in the padding image on the basis of the confidence map.

Abstract: An apparatus for extracting object information according to one embodiment includes: a padding image generator for generating a padding image including an original image; a partial image acquirer for acquiring a plurality of partial images of the padding image; an object classification result acquirer for acquiring an object classification result for each of the plurality of partial images using an object classification model; a confidence map generator for generating a confidence map having a size the same as that of the padding image and including a confidence value on the basis of the object classification result; and an object information acquirer for acquiring information on an object in the padding image on the basis of the confidence map.

Abstract: A wafer test machine is disclosed. The wafer test machine comprises a main body having a chamber defined therein, wherein a probe card is disposed at an upper portion of the chamber; a chuck for fixing a wafer in the chamber; a moving unit for moving the chuck in the chamber, thus making a contact between the probe card and the wafer; and a laser cleaning apparatus for cleaning the probe card in the chamber using a laser beam, when the probe card does not contact the wafer.

Abstract: A method for recognizing a moving object includes receiving real-time video data from an image capturing device by an object recognition apparatus, extracting a first image at a first time point of the real-time video data by the object recognition apparatus, extracting a first background image from the first image, extracting a second image at a second time point of the real-time video data by the object recognition apparatus, wherein the second time point is after the first time point, updating the first background image to a second background image based on the second image, comparing the second image with the second background image to extract a moving object, and extracting the moving object.

Abstract: A wafer test machine is disclosed. The wafer test machine comprises a main body having a chamber defined therein, wherein a probe card is disposed at an upper portion of the chamber; a chuck for fixing a wafer in the chamber; a moving unit for moving the chuck in the chamber, thus making a contact between the probe card and the wafer; and a laser cleaning apparatus for cleaning the probe card in the chamber using a laser beam, when the probe card does not contact the wafer.