Patents by Inventor Seong Ho Kil

Seong Ho Kil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11573035
    Abstract: An air conditioning device includes a plurality of ejectors which have a refrigerant circuit including a compressor, a condenser and an evaporator, are connected in parallel to the refrigerant circuit, and are formed so as to each have a different maximum refrigerant flow, and a control unit which, according to a driving condition of the air conditioning device, controls so that the refrigerant flows to one ejector among the plurality of ejectors, and the refrigerant does not flow to the rest of the ejectors.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: February 7, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: You-seop Lee, Hee-moon Jeong, Seong-ho Kil, Bo-heum Kim, Seok-uk Kim, Sun-soo Kim, Yong-taek Hong
  • Patent number: 11441256
    Abstract: A dryer is disclosed. The dryer comprises: a body having a first opening disposed at one side thereof; a first drum rotatably disposed in the body and including a first drying chamber connected to the first opening; a first hot-air unit for supplying hot air to the inside of the first drum; a first door coupled to the body to open or close the first opening; a second drum disposed at the first door; and a second hot-air unit for supplying hot air to the inside of the second drum.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: September 13, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-woo Lee, Dong-wook Kim, Seong-ho Kil, Dong-il Back
  • Publication number: 20200325621
    Abstract: A dryer is disclosed. The dryer comprises: a body having a first opening disposed at one side thereof; a first drum rotatably disposed in the body and including a first drying chamber connected to the first opening; a first hot-air unit for supplying hot air to the inside of the first drum; a first door coupled to the body to open or close the first opening; a second drum disposed at the first door; and a second hot-air unit for supplying hot air to the inside of the second drum.
    Type: Application
    Filed: August 1, 2018
    Publication date: October 15, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-woo LEE, Dong-wook KIM, Seong-ho KIL, Dong-il BACK
  • Patent number: 10576485
    Abstract: As an ejector of the present disclosure and a cooling apparatus having the same include a suction guide unit at least partially having a curved surface so that the ejector guides a flow of a refrigerant, a structure is improved and thus a flow loss can be reduced. Also, through the improved structure, a mixture rate between a refrigerant passing through a nozzle unit and a refrigerant passing through a suction unit is improved, so that pressure rising efficiency can be increased to reduce a compressor load, and thus energy efficiency can be increased due to an increase in efficiency of the ejector.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hee Moon Jeong, Yong Taek Hong, Seok Uk Kim, Seong Ho Kil, Bo Heum Kim, Yong Chan Kim, Jae Jun Lee, Yong Seok Jeon
  • Patent number: 10139139
    Abstract: Disclosed herein is a refrigeration cycle includes a first refrigerant circuit configured to cause a refrigerant ejected from a compressor to flow through a condenser, an ejector, a first evaporator, and a second evaporator and flow back to the compressor; a second refrigerant circuit configured to cause the refrigerant to bypass the first evaporator in the first refrigerant circuit; and a third refrigerant circuit branching at a junction provided at a downstream end of the condenser from at least one of the first refrigerant circuit and the second refrigerant circuit, and configured to cause the refrigerant to flow through an expansion device and a third evaporator and flow to the ejector. By such configuration, a coefficient of performance (COP) of a refrigeration cycle may be improved and an ejector may be used to improve energy efficiency.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: November 27, 2018
    Assignees: SAMSUNG ELECTRONICS CO., LTD., KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Hee Moon Jeong, Seong Ho Kil, Seok Uk Kim, Keon Kuk, Yong Chan Kim, Jae Jun Lee, Yong Seok Jeon
  • Publication number: 20180274821
    Abstract: The present disclosure relates to an air conditioning device having a plurality of ejectors, the air conditioning device comprising a plurality of ejectors which have a refrigerant circuit comprising a compressor, a condenser and an evaporator, are connected in parallel to the refrigerant circuit, and are formed so as to each have a different maximum refrigerant flow, and a control unit which, according to a driving condition of the air conditioning device, controls so that the refrigerant flows to one ejector among the plurality of ejectors, and the refrigerant does not flow to the rest of the ejectors.
    Type: Application
    Filed: April 1, 2016
    Publication date: September 27, 2018
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: You-seop LEE, Hee-moon JEONG, Seong-ho KIL, Bo-heum KIM, Seok-uk KIM, Sun-soo KIM, Yong-taek HONG
  • Patent number: 10048010
    Abstract: The heat exchanger includes at least one tube array in which refrigerant flows, the tube array includes a plurality of tubes each having a channel formed therein, and connection members coupled to opposite ends of the tubes so as to interconnect the tubes, and the tubes are injection molded integrally with the connection members.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: August 14, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young Min Cheong, Soo Young Lee, Seong Ho Kil, Moon Il Jung
  • Publication number: 20170292740
    Abstract: Disclosed herein is a refrigeration cycle includes a first refrigerant circuit configured to cause a refrigerant ejected from a compressor to flow through a condenser, an ejector, a first evaporator, and a second evaporator and flow back to the compressor; a second refrigerant circuit configured to cause the refrigerant to bypass the first evaporator in the first refrigerant circuit; and a third refrigerant circuit branching at a junction provided at a downstream end of the condenser from at least one of the first refrigerant circuit and the second refrigerant circuit, and configured to cause the refrigerant to flow through an expansion device and a third evaporator and flow to the ejector. By such configuration, a coefficient of performance (COP) of a refrigeration cycle may be improved and an ejector may be used to improve energy efficiency.
    Type: Application
    Filed: May 21, 2015
    Publication date: October 12, 2017
    Applicants: SAMSUNG ELECTRONICS CO., LTD., KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Hee Moon JEONG, Seong Ho KIL, Seok Uk KIM, Keon KUK, Yong Chan KIM, Jae Jun LEE, Yong Seok JEON
  • Publication number: 20170016677
    Abstract: The heat exchanger includes at least one tube array in which refrigerant flows, the tube array includes a plurality of tubes each having a channel formed therein, and connection members coupled to opposite ends of the tubes so as to interconnect the tubes, and the tubes are injection molded integrally with the connection members.
    Type: Application
    Filed: March 17, 2015
    Publication date: January 19, 2017
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Young Min CHEONG, Soo Young LEE, Seong Ho KIL, Moon II JUNG
  • Publication number: 20160187037
    Abstract: As an ejector of the present disclosure and a cooling apparatus having the same include a suction guide unit at least partially having a curved surface so that the ejector guides a flow of a refrigerant, a structure is improved and thus a flow loss can be reduced. Also, through the improved structure, a mixture rate between a refrigerant passing through a nozzle unit and a refrigerant passing through a suction unit is improved, so that pressure rising efficiency can be increased to reduce a compressor load, and thus energy efficiency can be increased due to an increase in efficiency of the ejector.
    Type: Application
    Filed: December 28, 2015
    Publication date: June 30, 2016
    Inventors: Hee Moon JEONG, Yong Taek HONG, Seok Uk KIM, Seong Ho KIL, Bo Heum KIM, Yong Chan KIM, Jae Jun LEE, Yong Seok JEON
  • Publication number: 20150168024
    Abstract: A cooling cycle includes a first refrigerant circuit, a second refrigerant circuit and the third refrigerant circuit and switches the refrigerant circulation between the refrigerant circuits according to cooling modes so that a plurality of evaporators is efficiently controlled and Coefficient of Performance (COP) is improved by including an ejector.
    Type: Application
    Filed: December 11, 2014
    Publication date: June 18, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byung Moo LEE, Hee Moon JEONG, Seong Ho KIL
  • Patent number: 8925176
    Abstract: A structure to connect a refrigerant pipe and an air conditioner having the same, the connecting structure enabling a refrigerant pipe to be easily connected to an indoor unit or an outdoor unit of an air conditioner and including a refrigerant pipe through which refrigerant flows, a socket part connected to one end of the refrigerant pipe, and a coupling nut coupled to an outer circumferential surface of the socket part, wherein, a socket part is provided with a grip-ring allowing the refrigerant pipe to move in a first direction in which the refrigerant pipe is coupled to the socket part and preventing the refrigerant pipe from moving in a second direction in which the refrigerant pipe is separated from the socket part, and at least one O-ring configured to prevent refrigerant from leaking at the socket part.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: January 6, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sun Muk Choi, Ji Ho Kwak, Sang Yong Lee, Jae Soo Jeong, Seong Ho Kil, Seok Kyun Kim, Eun Soo Jeon
  • Patent number: 8668458
    Abstract: A fan including a hub part, a blade part and a vibration-absorbing boss, all constituent elements of which are injection molded, thereby reducing production costs. The fan has a minimized contact area between the vibration-absorbing boss and the hub part to prevent the vibration-absorbing boss from being deformed by high-temperature heat during insert injection molding of the hub part and the blade part while assuring sufficient strength of the hub part.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: March 11, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min Gi Cho, Jin Baek Kim, Seong Ho Kil, Young Jae Kim, Byung Ghun Kim
  • Publication number: 20120211209
    Abstract: A structure to connect a refrigerant pipe and an air conditioner having the same, the connecting structure enabling a refrigerant pipe to be easily connected to an indoor unit or an outdoor unit of an air conditioner and including a refrigerant pipe through which refrigerant flows, a socket part connected to one end of the refrigerant pipe, and a coupling nut coupled to an outer circumferential surface of the socket part, wherein, a socket part is provided with a grip-ring allowing the refrigerant pipe to move in a first direction in which the refrigerant pipe is coupled to the socket part and preventing the refrigerant pipe from moving in a second direction in which the refrigerant pipe is separated from the socket part, and at least one O-ring configured to prevent refrigerant from leaking at the socket part.
    Type: Application
    Filed: February 10, 2012
    Publication date: August 23, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sun Muk CHOI, Ji Ho KWAK, Sang Yong LEE, Jae Soo JEONG, Seong Ho KIL, Seok Kyun KIM, Eun Soo JEON
  • Publication number: 20120027571
    Abstract: A fan including a hub part, a blade part and a vibration-absorbing boss, all constituent elements of which are injection molded, thereby reducing production costs. The fan has a minimized contact area between the vibration-absorbing boss and the hub part to prevent the vibration-absorbing boss from being deformed by high-temperature heat during insert injection molding of the hub part and the blade part while assuring sufficient strength of the hub part.
    Type: Application
    Filed: June 17, 2011
    Publication date: February 2, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Min Gi Cho, Jin Baek Kim, Seong Ho Kil, Young Jae Kim, Byung Ghun Kim
  • Publication number: 20110214445
    Abstract: A pipe connection unit to connect a first pipe made of a first material and a second pipe made of a second material, and an air conditioner having the same. The pipe connection unit includes a first connection member fixed to the first pipe, a second connection member coupled with the first connection member, and a ferrule received in the second connection member so as to be closely fixed to the outer circumferential surface of the second pipe according to the coupling of the first connection member and the second connection member with each other, thereby simply connecting the first pipe and the second pipe through the coupling of the first connection member and the second connection member with each other.
    Type: Application
    Filed: February 24, 2011
    Publication date: September 8, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Oh Han, Seong Ho Kil, Ji Ho Kwak
  • Patent number: 7640970
    Abstract: An evaporator utilizes micro-channel tubes, and more particularly, has a structure of a heat exchanger using micro-channel tubes, which is applied to an evaporator of a household air conditioner. The evaporator, using micro-channel tubes, includes a first heat exchanging unit including a pair of upper and lower headers, and a plurality of the micro-channel tubes erected vertically between the headers so that condensed water flows downward, and a second heat exchanging unit, installed adjacent to the first heat exchanging unit, includes a pair of upper and lower headers, and a plurality of the micro-channel tubes erected vertically between the headers so that condensed water flows downward. A plurality of return pipes connect upper headers of neighboring heat exchanging units to transmit refrigerant between the neighboring heat exchanging units.
    Type: Grant
    Filed: June 14, 2005
    Date of Patent: January 5, 2010
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jeung Hoon Kim, Hong Gi Cho, Seong Ho Kil, Keum Nam Cho, Baek Youn, Hyoung Mo Koo, Jai Kwon Lee