Patents by Inventor Seong Ho Kil
Seong Ho Kil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11573035Abstract: An air conditioning device includes a plurality of ejectors which have a refrigerant circuit including a compressor, a condenser and an evaporator, are connected in parallel to the refrigerant circuit, and are formed so as to each have a different maximum refrigerant flow, and a control unit which, according to a driving condition of the air conditioning device, controls so that the refrigerant flows to one ejector among the plurality of ejectors, and the refrigerant does not flow to the rest of the ejectors.Type: GrantFiled: April 1, 2016Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: You-seop Lee, Hee-moon Jeong, Seong-ho Kil, Bo-heum Kim, Seok-uk Kim, Sun-soo Kim, Yong-taek Hong
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Patent number: 11441256Abstract: A dryer is disclosed. The dryer comprises: a body having a first opening disposed at one side thereof; a first drum rotatably disposed in the body and including a first drying chamber connected to the first opening; a first hot-air unit for supplying hot air to the inside of the first drum; a first door coupled to the body to open or close the first opening; a second drum disposed at the first door; and a second hot-air unit for supplying hot air to the inside of the second drum.Type: GrantFiled: August 1, 2018Date of Patent: September 13, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong-woo Lee, Dong-wook Kim, Seong-ho Kil, Dong-il Back
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Publication number: 20200325621Abstract: A dryer is disclosed. The dryer comprises: a body having a first opening disposed at one side thereof; a first drum rotatably disposed in the body and including a first drying chamber connected to the first opening; a first hot-air unit for supplying hot air to the inside of the first drum; a first door coupled to the body to open or close the first opening; a second drum disposed at the first door; and a second hot-air unit for supplying hot air to the inside of the second drum.Type: ApplicationFiled: August 1, 2018Publication date: October 15, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong-woo LEE, Dong-wook KIM, Seong-ho KIL, Dong-il BACK
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Patent number: 10576485Abstract: As an ejector of the present disclosure and a cooling apparatus having the same include a suction guide unit at least partially having a curved surface so that the ejector guides a flow of a refrigerant, a structure is improved and thus a flow loss can be reduced. Also, through the improved structure, a mixture rate between a refrigerant passing through a nozzle unit and a refrigerant passing through a suction unit is improved, so that pressure rising efficiency can be increased to reduce a compressor load, and thus energy efficiency can be increased due to an increase in efficiency of the ejector.Type: GrantFiled: December 28, 2015Date of Patent: March 3, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hee Moon Jeong, Yong Taek Hong, Seok Uk Kim, Seong Ho Kil, Bo Heum Kim, Yong Chan Kim, Jae Jun Lee, Yong Seok Jeon
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Patent number: 10139139Abstract: Disclosed herein is a refrigeration cycle includes a first refrigerant circuit configured to cause a refrigerant ejected from a compressor to flow through a condenser, an ejector, a first evaporator, and a second evaporator and flow back to the compressor; a second refrigerant circuit configured to cause the refrigerant to bypass the first evaporator in the first refrigerant circuit; and a third refrigerant circuit branching at a junction provided at a downstream end of the condenser from at least one of the first refrigerant circuit and the second refrigerant circuit, and configured to cause the refrigerant to flow through an expansion device and a third evaporator and flow to the ejector. By such configuration, a coefficient of performance (COP) of a refrigeration cycle may be improved and an ejector may be used to improve energy efficiency.Type: GrantFiled: May 21, 2015Date of Patent: November 27, 2018Assignees: SAMSUNG ELECTRONICS CO., LTD., KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATIONInventors: Hee Moon Jeong, Seong Ho Kil, Seok Uk Kim, Keon Kuk, Yong Chan Kim, Jae Jun Lee, Yong Seok Jeon
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Publication number: 20180274821Abstract: The present disclosure relates to an air conditioning device having a plurality of ejectors, the air conditioning device comprising a plurality of ejectors which have a refrigerant circuit comprising a compressor, a condenser and an evaporator, are connected in parallel to the refrigerant circuit, and are formed so as to each have a different maximum refrigerant flow, and a control unit which, according to a driving condition of the air conditioning device, controls so that the refrigerant flows to one ejector among the plurality of ejectors, and the refrigerant does not flow to the rest of the ejectors.Type: ApplicationFiled: April 1, 2016Publication date: September 27, 2018Applicant: Samsung Electronics Co., Ltd.Inventors: You-seop LEE, Hee-moon JEONG, Seong-ho KIL, Bo-heum KIM, Seok-uk KIM, Sun-soo KIM, Yong-taek HONG
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Patent number: 10048010Abstract: The heat exchanger includes at least one tube array in which refrigerant flows, the tube array includes a plurality of tubes each having a channel formed therein, and connection members coupled to opposite ends of the tubes so as to interconnect the tubes, and the tubes are injection molded integrally with the connection members.Type: GrantFiled: March 17, 2015Date of Patent: August 14, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young Min Cheong, Soo Young Lee, Seong Ho Kil, Moon Il Jung
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Publication number: 20170292740Abstract: Disclosed herein is a refrigeration cycle includes a first refrigerant circuit configured to cause a refrigerant ejected from a compressor to flow through a condenser, an ejector, a first evaporator, and a second evaporator and flow back to the compressor; a second refrigerant circuit configured to cause the refrigerant to bypass the first evaporator in the first refrigerant circuit; and a third refrigerant circuit branching at a junction provided at a downstream end of the condenser from at least one of the first refrigerant circuit and the second refrigerant circuit, and configured to cause the refrigerant to flow through an expansion device and a third evaporator and flow to the ejector. By such configuration, a coefficient of performance (COP) of a refrigeration cycle may be improved and an ejector may be used to improve energy efficiency.Type: ApplicationFiled: May 21, 2015Publication date: October 12, 2017Applicants: SAMSUNG ELECTRONICS CO., LTD., KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATIONInventors: Hee Moon JEONG, Seong Ho KIL, Seok Uk KIM, Keon KUK, Yong Chan KIM, Jae Jun LEE, Yong Seok JEON
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Publication number: 20170016677Abstract: The heat exchanger includes at least one tube array in which refrigerant flows, the tube array includes a plurality of tubes each having a channel formed therein, and connection members coupled to opposite ends of the tubes so as to interconnect the tubes, and the tubes are injection molded integrally with the connection members.Type: ApplicationFiled: March 17, 2015Publication date: January 19, 2017Applicant: Samsung Electronics Co., Ltd.Inventors: Young Min CHEONG, Soo Young LEE, Seong Ho KIL, Moon II JUNG
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Publication number: 20160187037Abstract: As an ejector of the present disclosure and a cooling apparatus having the same include a suction guide unit at least partially having a curved surface so that the ejector guides a flow of a refrigerant, a structure is improved and thus a flow loss can be reduced. Also, through the improved structure, a mixture rate between a refrigerant passing through a nozzle unit and a refrigerant passing through a suction unit is improved, so that pressure rising efficiency can be increased to reduce a compressor load, and thus energy efficiency can be increased due to an increase in efficiency of the ejector.Type: ApplicationFiled: December 28, 2015Publication date: June 30, 2016Inventors: Hee Moon JEONG, Yong Taek HONG, Seok Uk KIM, Seong Ho KIL, Bo Heum KIM, Yong Chan KIM, Jae Jun LEE, Yong Seok JEON
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Publication number: 20150168024Abstract: A cooling cycle includes a first refrigerant circuit, a second refrigerant circuit and the third refrigerant circuit and switches the refrigerant circulation between the refrigerant circuits according to cooling modes so that a plurality of evaporators is efficiently controlled and Coefficient of Performance (COP) is improved by including an ejector.Type: ApplicationFiled: December 11, 2014Publication date: June 18, 2015Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byung Moo LEE, Hee Moon JEONG, Seong Ho KIL
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Patent number: 8925176Abstract: A structure to connect a refrigerant pipe and an air conditioner having the same, the connecting structure enabling a refrigerant pipe to be easily connected to an indoor unit or an outdoor unit of an air conditioner and including a refrigerant pipe through which refrigerant flows, a socket part connected to one end of the refrigerant pipe, and a coupling nut coupled to an outer circumferential surface of the socket part, wherein, a socket part is provided with a grip-ring allowing the refrigerant pipe to move in a first direction in which the refrigerant pipe is coupled to the socket part and preventing the refrigerant pipe from moving in a second direction in which the refrigerant pipe is separated from the socket part, and at least one O-ring configured to prevent refrigerant from leaking at the socket part.Type: GrantFiled: February 10, 2012Date of Patent: January 6, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Sun Muk Choi, Ji Ho Kwak, Sang Yong Lee, Jae Soo Jeong, Seong Ho Kil, Seok Kyun Kim, Eun Soo Jeon
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Patent number: 8668458Abstract: A fan including a hub part, a blade part and a vibration-absorbing boss, all constituent elements of which are injection molded, thereby reducing production costs. The fan has a minimized contact area between the vibration-absorbing boss and the hub part to prevent the vibration-absorbing boss from being deformed by high-temperature heat during insert injection molding of the hub part and the blade part while assuring sufficient strength of the hub part.Type: GrantFiled: June 17, 2011Date of Patent: March 11, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Min Gi Cho, Jin Baek Kim, Seong Ho Kil, Young Jae Kim, Byung Ghun Kim
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Publication number: 20120211209Abstract: A structure to connect a refrigerant pipe and an air conditioner having the same, the connecting structure enabling a refrigerant pipe to be easily connected to an indoor unit or an outdoor unit of an air conditioner and including a refrigerant pipe through which refrigerant flows, a socket part connected to one end of the refrigerant pipe, and a coupling nut coupled to an outer circumferential surface of the socket part, wherein, a socket part is provided with a grip-ring allowing the refrigerant pipe to move in a first direction in which the refrigerant pipe is coupled to the socket part and preventing the refrigerant pipe from moving in a second direction in which the refrigerant pipe is separated from the socket part, and at least one O-ring configured to prevent refrigerant from leaking at the socket part.Type: ApplicationFiled: February 10, 2012Publication date: August 23, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Muk CHOI, Ji Ho KWAK, Sang Yong LEE, Jae Soo JEONG, Seong Ho KIL, Seok Kyun KIM, Eun Soo JEON
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Publication number: 20120027571Abstract: A fan including a hub part, a blade part and a vibration-absorbing boss, all constituent elements of which are injection molded, thereby reducing production costs. The fan has a minimized contact area between the vibration-absorbing boss and the hub part to prevent the vibration-absorbing boss from being deformed by high-temperature heat during insert injection molding of the hub part and the blade part while assuring sufficient strength of the hub part.Type: ApplicationFiled: June 17, 2011Publication date: February 2, 2012Applicant: SAMSUNG ELECTRONICS CO., LTDInventors: Min Gi Cho, Jin Baek Kim, Seong Ho Kil, Young Jae Kim, Byung Ghun Kim
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Publication number: 20110214445Abstract: A pipe connection unit to connect a first pipe made of a first material and a second pipe made of a second material, and an air conditioner having the same. The pipe connection unit includes a first connection member fixed to the first pipe, a second connection member coupled with the first connection member, and a ferrule received in the second connection member so as to be closely fixed to the outer circumferential surface of the second pipe according to the coupling of the first connection member and the second connection member with each other, thereby simply connecting the first pipe and the second pipe through the coupling of the first connection member and the second connection member with each other.Type: ApplicationFiled: February 24, 2011Publication date: September 8, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Oh Han, Seong Ho Kil, Ji Ho Kwak
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Patent number: 7640970Abstract: An evaporator utilizes micro-channel tubes, and more particularly, has a structure of a heat exchanger using micro-channel tubes, which is applied to an evaporator of a household air conditioner. The evaporator, using micro-channel tubes, includes a first heat exchanging unit including a pair of upper and lower headers, and a plurality of the micro-channel tubes erected vertically between the headers so that condensed water flows downward, and a second heat exchanging unit, installed adjacent to the first heat exchanging unit, includes a pair of upper and lower headers, and a plurality of the micro-channel tubes erected vertically between the headers so that condensed water flows downward. A plurality of return pipes connect upper headers of neighboring heat exchanging units to transmit refrigerant between the neighboring heat exchanging units.Type: GrantFiled: June 14, 2005Date of Patent: January 5, 2010Assignee: Samsung Electronics Co., LtdInventors: Jeung Hoon Kim, Hong Gi Cho, Seong Ho Kil, Keum Nam Cho, Baek Youn, Hyoung Mo Koo, Jai Kwon Lee