Patents by Inventor Seong-Hyun Chung

Seong-Hyun Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substituted pyrimido[4,5-b][1,4]diazepines as PLK1 degradation inducers
    Patent number: 11939334
    Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound having a structure according to Formula I, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: March 26, 2024
    Assignee: UPPTHERA, INC.
    Inventors: Soo Hee Ryu, Im Suk Min, Han Kyu Lee, Seong Hoon Kim, Hye Guk Ryu, Keum Young Kang, Sang Youn Kim, So Hyun Chung, Jun Kyu Lee, Gibbeum Lee
  • Substituted pyrimido[4,5-b][1,4]diazepines as PLK1 degradation inducers
    Patent number: 11912710
    Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound having a structure according to Formula I, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: February 27, 2024
    Assignee: UPPTHERA, INC.
    Inventors: Soo Hee Ryu, Im Suk Min, Han Kyu Lee, Seong Hoon Kim, Hye Guk Ryu, Keum Young Kang, Sang Youn Kim, So Hyun Chung, Jun Kyu Lee, Gibbeum Lee
  • PLASMA ETCHING CHAMBER
    Publication number: 20110139371
    Abstract: Disclosed is a plasma etching chamber including a gas distribution plate guiding a reaction gas to the edge of the wafer; a plate disposed to be spaced apart from the gas distribution plate; and bumper portions protruding on at least one of opposite surfaces of the gas distribution plate and the plate to allow the pressure of the reaction gas moving to the edge of the wafer to be uniform.
    Type: Application
    Filed: October 31, 2008
    Publication date: June 16, 2011
    Inventors: Hee-Se Lee, Seong-Hyun Chung, Se Mun Park