Abstract: A fusion protein according to an embodiment of the present disclosure includes a growth differentiation factor 11 and a heat shock protein 10 with an enhanced skin cell proliferation effect. An anti-wrinkle cosmetic composition according to an embodiment of the present disclosure includes the fusion protein as an effective component, and the cosmetic composition can be advantageously used in future as a material of a functional cosmetic product.

Abstract: A bulk-acoustic wave resonator package includes a package substrate; a cover bonded to the package substrate; an acoustic wave resonator accommodated in an accommodation space defined by the package substrate and the cover; a conductive wire disposed in the accommodation space to electrically connect the acoustic wave resonator to the package substrate; and a bonding portion to fixedly couple the acoustic wave resonator to the package substrate. The bonding portion includes an adhesive member including silicon.

Abstract: A display device of embodiments of the present disclosure may include a substrate including a display area including a plurality of pixel areas, and a non-display area adjacent the display area, a circuit element layer on the substrate, and including a plurality of non-transmission areas in which a plurality of signal lines for transferring signals for driving a pixel are positioned, and a plurality of transmission areas for transmitting light and located between the signal lines in a plan view, a light emitting element layer on the circuit element layer, and including light emitting elements, and a light blocking layer between the substrate and the circuit element layer, and including a plurality of first opening portions overlapping the non-transmission area, and a plurality of second opening portions overlapping the transmission area, wherein one of the non-transmission areas and the transmission area are in each of the pixel areas.

Abstract: The inventive concept provides an apparatus for supporting a substrate. An apparatus for treating a substrate includes a process chamber that performs a predetermined process on the substrate and a reversing unit that reverses the substrate. The reverse unit includes a grip unit that grips the substrate and a drive unit that rotates the grip unit to reverse the substrate gripped by the grip unit. The grip unit includes a first body that supports one of an upper surface and a lower surface of the substrate and a second body that supports the other surface of the substrate. Each of the first body and the second body includes a support protrusion that is brought into contact with the substrate when the grip unit grips the substrate.

Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber; a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.

Abstract: Disclosed herein is an Artificial Intelligence (AI) processor. The AI processor includes multiple NVM AI cores for respectively performing basic unit operations required for a deep-learning operation based on data stored in NVM; SRAM for storing at least some of the results of the basic unit operations; and an AI core for performing an accumulation operation on the results of the basic unit operation.

Abstract: Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (TSV) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the TSV and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the TSV of the first semiconductor die.

Abstract: An air conditioner of present invention comprises a housing having an outer panel forming the exterior and an opening formed on the outer panel, a heat exchanger configured to exchange heat with air flowing into the housing, and a door unit configured to open or close the opening by moving forward or backward from the opening through which the heat exchanged air is discharged. Wherein the door unit comprises a door blade configured to open or close the opening, a door operating part configured to move the door blade forward or backward, and a controller configured to control the air discharged from the opening to be moved forward from the opening in a straight line or to be discharged radially from the opening by controlling a distance between the door blade and the opening.

Abstract: An air conditioner of present invention comprises a housing having an outer panel forming the exterior and an opening formed on the outer panel, a heat exchanger configured to exchange heat with air flowing into the housing, and a door unit configured to open or close the opening by moving forward or backward from the opening through which the heat exchanged air is discharged. Wherein the door unit comprises a door blade configured to open or close the opening, a door operating part configured to move the door blade forward or backward, and a controller configured to control the air discharged from the opening to be moved forward from the opening in a straight line or to be discharged radially from the opening by controlling a distance between the door blade and the opening.

Abstract: A light emitting device filament includes a substrate, light emitting device chips, two electrode pads, and connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extends in a first direction and has a width in a second direction. The light emitting device chips are disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The connection lines electrically connect the light emitting device chips and the electrode pads. At least one of the connection lines includes a first portion extending in the first direction and a second portion extending in the second direction.

Abstract: An air conditioner of present invention comprises a housing having an outer panel forming the exterior and an opening formed on the outer panel, a heat exchanger configured to exchange heat with air flowing into the housing, and a door unit configured to open or close the opening by moving forward or backward from the opening through which the heat exchanged air is discharged. Wherein the door unit comprises a door blade configured to open or close the opening, a door operating part configured to move the door blade forward or backward, and a controller configured to control the air discharged from the opening to be moved forward from the opening in a straight line or to be discharged radially from the opening by controlling a distance between the door blade and the opening.

Abstract: A fusion protein according to an embodiment of the present disclosure includes a growth differentiation factor 11 and an epidermal growth factor with an enhanced anti-oxidation activity and an enhanced skin cell proliferation effect, A cosmetic composition according to an embodiment of the present disclosure includes the fusion protein as an effective component. The cosmetic composition can be advantageously used in future as a material of a functional cosmetic product.

Abstract: A device for adjusting a position of a headrest for a vehicle includes: a stay mounted on a seatback frame; a main frame including a rotation guide hole, inserted into and mounted on the stay, and configured to ascend or descend along the stay; an elevation device mounted on the main frame and the stay, and configured to allow the main frame to ascend or descend along the stay; a rotating frame including a first end portion inserted into the stay and configured to ascend or descend along the stay, and a second end portion extending toward the rotation guide hole of the main frame; a rotating device mounted on the rotating frame and the rotation guide hole of the main frame, and configured to rotate the rotating frame along the rotation guide hole; and a headrest frame assembled to the rotating frame.

Abstract: A vehicle wheel having a suspension and a steering device is capable of not only simplifying a driving system but also reducing the number of parts and reducing weight. The vehicle wheel includes a suspension combined with a damper and a spring in a housing of a stator of an in-wheel motor embedded in each wheel of a vehicle and a steering device directly connected to the suspension.

Abstract: A display device is provided including a substrate. The substrate includes a display region that includes a plurality of pixels and a sensing region provided in at least one region of the display region. A circuit element layer is disposed on the substrate, the circuit element layer includes a plurality of conductive layers. A light emitting element layer is provided on the circuit element layer. The light emitting element layer includes a plurality of light emitting elements. A sensor layer is disposed on the substrate. The sensor layer includes a plurality of photo sensor units each including sensor pixels. The photo sensor units are arranged in an irregular pattern in the sensing region.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.

Abstract: Proposed are a CMP slurry composition and a polishing method using the same. The CMP slurry composition in which the zeta potential of colloidal silica serving as an abrasive is properly controlled and metal impurities are removed from the colloidal silica and to a polishing method using the same. The CMP slurry composition is configured to improve a polishing performance for a silicon oxide film, minimize scratches on a finished surface, and to enable adjustment of a content ratio of an abrasive and an additive in the composition, thereby enabling adjustment of a polishing selectivity among a silicon oxide film, a silicon nitride film, and a polysilicon film.

Abstract: The present invention relates to a brain-computer interface system and a method for recognizing a conversation intention of a user using the same in addition to inferring the waveform of word sound intended by a user from an imagined speech brainwave associated with a word intended by a user, since the user can intuitively recognize the sentence he/she wants to speak through the imagined speech by classifying words that are most relevant to the imagined speech brainwave of the user in a database in which a word often used by the user or frequently used in a specific situation is stored and by generating a sentence intended by the user by recognizing the words classified in this way, it is possible to perform communication by only thoughts of the user.

Abstract: A washer liquid supply valve includes a valve body provided with an inflow hole and a discharge hole configured to allow a washer liquid to flow into and out of the valve body therethrough, a housing detachably combined with an upper part of the valve body, a coil assembly installed in the housing and configured to generate magnetic force when power is applied to the washer liquid supply valve, a core combined with the coil assembly while penetrating the coil assembly and magnetized by the magnetic force generated by the coil assembly, plunger installed in the core so as to be movable and configured to be moved upwards when power is applied to the washer liquid supply valve, and a spring interposed between the core and the plunger so as to elastically support the plunger towards the valve body.

Abstract: A fingerprint sensor for a display device including: a substrate having first and second surfaces; a light transmission layer including a first layer disposed on the first surface of the substrate and having first openings in at least one first conductive layer, and a second layer disposed on the first surface of the substrate and having second openings in at least one second conductive layer; a light emitting element layer disposed on the first layer and the second layer and having at least one light emitting element; and a sensor layer disposed on the second surface of the substrate and having light sensors. At least a portion of the first openings and at least a portion of the second openings at least partially overlap and have different sizes.