Patents by Inventor Seong-i Lee

Seong-i Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mounter for mounting components
    Patent number: 6944943
    Abstract: A surface mounter includes: a component supply unit in which a plurality of components to be mounted are placed; a head unit which mounts a component on a circuit board by lifting the component from the component supply unit with suction; and a transfer unit including a carry-in portion with a single distribution lane, a mounting portion with dual working lanes, and a carry-out portion with a single carry-out lane, wherein a circuit board is transferred along the distribution lane and distributed to the mounting portion, components are mounted on the circuit board stopped at a position of the mounting portion, and the circuit board with the components mounted thereon is transferred out of the transfer unit along the carry-out lane. In the surface mounter, a number of circuit boards can be distributed to dual working lanes via a single distribution lane, not via common dual carry-in lanes, at higher working speed, so that working efficiency is improved. In addition, the surface mounter occupies less space.
    Type: Grant
    Filed: June 12, 2003
    Date of Patent: September 20, 2005
    Assignee: Samsung Techwin Co., Ltd
    Inventors: Tae-yeon Cho, Seong-i Lee
  • Surface mounter and method of mounting components using the same
    Publication number: 20030230838
    Abstract: A surface mounter includes: a component supply unit in which a plurality of components to be mounted are placed; a head unit which mounts a component on a circuit board by lifting the component from the component supply unit with suction; and a transfer unit including a carry-in portion with a single distribution lane, a mounting portion with dual working lanes, and a carry-out portion with a single carry-out lane, wherein a circuit board is transferred along the distribution lane and distributed to the mounting portion, components are mounted on the circuit board stopped at a position of the mounting portion, and the circuit board with the components mounted thereon is transferred out of the transfer unit along the carry-out lane. In the surface mounter, a number of circuit boards can be distributed to dual working lanes via a single distribution lane, not via common dual carry-in lanes, at higher working speed, so that working efficiency is improved. In addition, the surface mounter occupies less space.
    Type: Application
    Filed: June 12, 2003
    Publication date: December 18, 2003
    Inventors: Tae-yeon Cho, Seong-i Lee