Patents by Inventor Seong-Jae Heo

Seong-Jae Heo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulation method for ball grid array semiconductor package
    Patent number: 6484394
    Abstract: An encapsulation method for a ball grid array (BGA) semiconductor package, includes: adhering one sided adhesive tape to an upper portion of the semiconductor package after performing a wire bonding; carrying out a molding by using a mold having a groove of a certain size inside; and removing the one side adhesive tape after completing the molding, whereby a flash is prevented from occurring during the BGA encapsulation process.
    Type: Grant
    Filed: January 10, 2000
    Date of Patent: November 26, 2002
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Seong-Jae Heo, Chi-Jung Song
  • Encapsulation method for ball grid array semiconductor package
    Publication number: 20020148112
    Abstract: An encapsulation method for a ball grid array (BGA) semiconductor package, includes: adhering one sided adhesive tape to an upper portion of the semiconductor package after performing a wire bonding; carrying out a molding by using a mold having a groove of a certain size inside; and removing the one side adhesive tape after completing the molding, whereby a flash is prevented from occurring during the BGA encapsulation process.
    Type: Application
    Filed: June 17, 2002
    Publication date: October 17, 2002
    Applicant: LG Semicon Co., Ltd.
    Inventors: Seong-Jae Heo, Chi-Jung Song