Abstract: Provided are a mask for an application of paste and a method of manufacturing a semiconductor light emitting device by using the same. The method includes preparing a light emitting structure including first and second conductive semiconductor layers and an active layer disposed therebetween, which has at least one electrode formed on a surface of the light emitting structure; disposing a mask having an open part exposing a portion of the surface of the light emitting structure therethrough and a recess part corresponding the electrode in a region thereof on a surface of the light emitting structure; and applying wavelength conversion material-containing paste to the surface of the light emitting structure through the open part.

Abstract: There are provided a semiconductor light emitting diode chip, a method of manufacturing thereof, and a method for quality control using the same. The semiconductor light emitting diode chip includes a substrate; a light emitting diode in one area of the substrate and at least one fuse signature circuit formed in the other area of substrate so as to be electrically insulated from the light emitting diode. The fuse signature circuit includes a circuit unit having unique electrical characteristic value corresponding to wafer based process information and a plurality of electrode pads connected to the circuit unit. The semiconductor light emitting diode chip may include chip information marking representing information.

Abstract: Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer.

Abstract: A method and apparatus for depositing a phosphor via a compression molding process, the method involving forming a plurality of light-emitting devices on a wafer, evaluating emission characteristics of the plurality of light-emitting devices, and re-arraying and aligning the plurality of light-emitting devices on a carrier substrate according to the emission characteristics; depositing the phosphor on the plurality of re-arrayed light-emitting devices via a compression molding process; and dicing the plurality of re-arrayed light-emitting devices on the carrier substrate.

Abstract: A method and apparatus for depositing a phosphor using transfer molding. The method includes: forming a plurality of light-emitting devices on a wafer and rearranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices; depositing the phosphor on the rearranged light-emitting devices using transfer molding; and separating the light-emitting devices on the carrier substrate.

Abstract: A method of applying a phosphor according to a light-emission characteristic of semiconductor light-emitting devices so as to increase a yield rate of manufacture with respect to a white light-emitting device chip, the method including the operations of testing light-emission characteristics of a plurality of light-emitting devices formed on a wafer; disposing a plurality of light-emitting devices having the same light-emission characteristics on a carrier substrate; applying a same phosphor to the plurality of light-emitting devices disposed on the carrier substrate; and separating the plurality of arrayed light-emitting devices. Thus, a white light-emitting device chip manufactured by using the method may emit almost the same white light.

Abstract: A capacity varying type rotary compressor and a refrigeration system having the same are provided. The capacity varying type rotary compressor includes a casing that contains a certain amount of oil and maintains a discharge pressure state; a motor installed in the casing that generates a driving force; one or more cylinder assembly fixed in the casing, having a compression space that compresses a refrigerant by a rolling piston that performs an orbit motion and a vane that performs a linear motion by contacting the rolling piston, and having a vane pressure chamber formed at a rear side of the vane that implements a normal driving as the vane contacts the rolling piston or a saving driving as the vane is separated from the rolling piston; and a mode switching device that selectively supplies a suction pressure or a discharge pressure to the vane pressure chamber of the cylinder assembly according to a driving mode.

Abstract: A method for manufacturing a light emitting device includes forming a plurality of light emitting elements on a light emitting element substrate. an identification portion is formed on each of the light emitting elements to allow a pertinent light emitting element to be distinguishable from other light emitting elements. The light emitting elements are separated to form a plurality of light emitting devices. The identification portion may have an external appearance allowing each of the light emitting elements to be distinguishable from the other light emitting elements.

Abstract: Phosphor films, methods of forming the phosphor films, and methods of coating a phosphor layer on light-emitting chips are disclosed. The phosphor film includes: a base film; a phosphor layer that is formed on the base film and comprises an incompletely cured resin material and phosphor particles mixed with the incompletely cured resin material; and a cover film that is formed on the phosphor layer and protects the phosphor layer.

Abstract: A capacity variable type twin rotary compressor may include a casing, a motor, a first cylinder having a first compression space, a second cylinder fixed to one side of the first cylinder and having a second compression space, first and second intakes respectively formed in the first and second cylinders and each connected to a gas intake pipe, first and second vane slits respectively formed in the first and second intakes first and second rolling pistons eccentrically coupled to the motor and respectively housed in the first and second compression spaces, first and second vanes slidingly received in the first and second vane slits, respectively, an expansion groove formed at the second vane slit separate from the inner space of the casing, and refrigerant switching valves that allow refrigerant of intake and discharge pressures to be supplied into the second compression space and the expansion groove, such that the second vane contacts the second rolling piston to perform a power driving or separates therefr

Abstract: A capacity varying type rotary compressor and a refrigeration system having the same are provided. The capacity varying type rotary compressor includes a casing that contains a certain amount of oil and maintains a discharge pressure state; a motor installed in the casing that generates a driving force; one or more cylinder assembly fixed in the casing, having a compression space that compresses a refrigerant by a rolling piston that performs an orbit motion and a vane that performs a linear motion by contacting the rolling piston, and having a vane pressure chamber formed at a rear side of the vane that implements a normal driving as the vane contacts the rolling piston or a saving driving as the vane is separated from the rolling piston; and a mode switching device that selectively supplies a suction pressure or a discharge pressure to the vane pressure chamber of the cylinder assembly according to a driving mode.

Abstract: A capacity varying type rotary compressor and a refrigeration system having the same are provided. The capacity varying type rotary compressor includes a casing that contains a certain amount of oil and maintains a discharge pressure state; a motor installed in the casing that generates a driving force; one or more cylinder assembly fixed in the casing, having a compression space that compresses a refrigerant by a rolling piston that performs an orbit motion and a vane that performs a linear motion by contacting the rolling piston, and having a vane pressure chamber formed at a rear side of the vane that implements a normal driving as the vane contacts the rolling piston or a saving driving as the vane is separated from the rolling piston; and a mode switching device that selectively supplies a suction pressure or a discharge pressure to the vane pressure chamber of the cylinder assembly according to a driving mode.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract: A capacity varying type rotary compressor and a refrigeration system having the same. The capacity varying type rotary compressor comprises a casing containing a certain amount of oil and maintaining a discharge pressure state; a motor installed in the casing and generating a driving force; one or more cylinder assembly fixed in the casing, having a compression space for compressing a refrigerant by a rolling piston that performs an orbit motion and a vane that performs a linear motion by contacting the rolling piston, and having a vane pressure chamber formed at a rear side of the vane, for implementing a normal driving as the vane contacts the rolling piston or implementing a saving driving as the vane is separated from the rolling piston; and a mode switching unit for selectively supplying suction pressure or a discharge pressure to the vane pressure chamber of the cylinder assembly according to a driving mode.

Abstract: Disclosed are a capacity variable type twin rotary compressor and a driving method thereof and an air conditioner using the same and a driving method thereof. A vane (124) can quickly and stably maintain contact with a rolling piston (124) even when the vane (124) starts or a compressor switches its driving such that noises resulted from the vane (124) when varying capacity are prevented to thereby greatly reduce noises of a compressor. By alternately driving compression units (110, 120) and allowing capacity to vary according to more than two steps, it is possible to meet various demands for assembly products such as the air conditioner and the enhancing energy efficiency by reducing unnecessary waste of power.

Abstract: An underfill system for filling gaps between semiconductor chips and substrates is provided. The underfill system comprises a blower for blowing air, an air duct coupled to the blower, the air duct comprising a main duct coupled to the blower and a plurality of sub-ducts each having an outlet being connected to the main duct and an inlet to be located along one side of the semiconductor chip. A filling material from a dispenser fills the gaps by suction due to the pressure difference between the main duct and the sub-duct. Thus, the present invention shortens the filling time of the underfill process and prevents voids or air bubbles of the filling material from forming within the gap.

Abstract: An underfill system for filling gaps between semiconductor chips and substrates is provided. The underfill system comprises a blower for blowing air, an air duct coupled to the blower, the air duct comprising a main duct coupled to the blower and a plurality of sub-ducts each having an outlet being connected to the main duct and an inlet to be located along one side of the semiconductor chip. A filling material from a dispenser fills the gaps by suction due to the pressure difference between the main duct and the sub-duct. Thus, the present invention shortens the filling time of the underfill process and prevents voids or air bubbles of the filling material from forming within the gap.