Patents by Inventor Seong Jae Lee

Seong Jae Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240412951
    Abstract: An apparatus for treating a substrate includes a process chamber having an inner space, a support unit supporting a substrate in the inner space, a processing gas supply unit for supplying a processing gas to the inner space, and a plasma source that excites the processing gas in a plasma state in the inner space. The processing gas supply unit includes a heater that heats the processing gas.
    Type: Application
    Filed: August 20, 2024
    Publication date: December 12, 2024
    Applicant: SEMES CO., LTD.
    Inventors: DONG-HUN KIM, WAN JAE PARK, SEONG GIL LEE, JI-HWAN LEE, YOUNGJE UM, DONG SUB OH, MYOUNGSUB NOH
  • Patent number: 12166101
    Abstract: A method of manufacturing a high-electron-mobility transistor device is provided. The method includes sequentially forming a transition layer and a semiconductor layer on a substrate, etching a portion of a surface of the semiconductor layer to form a barrier layer region having a certain depth and forming a barrier layer in the barrier layer region, forming a source electrode and a drain electrode on a 2-dimensional electron gas (2-DEG) layer upward exposed at a surface of the semiconductor layer, in defining the 2-DEG layer formed along an interface between the semiconductor layer and the barrier layer, forming a passivation layer on the semiconductor layer, the barrier layer, the source electrode, and the drain electrode and etching a portion of the passivation layer to upward expose the source electrode, the drain electrode, and the barrier layer, and forming a gate electrode on the upward exposed barrier layer.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: December 10, 2024
    Assignee: ELECTRONICS AND TELECOMMINICATIONS RESEARCH INSTITUTE
    Inventors: Soo Cheol Kang, Hyun Wook Jung, Seong IL Kim, Hae Cheon Kim, Youn Sub Noh, Ho Kyun Ahn, Sang Heung Lee, Jong Won Lim, Sung Jae Chang, Il Gyu Choi
  • Patent number: 12156902
    Abstract: The present invention relates to a method of treating bone, joint, muscle, and connective tissue related inflammatory disease comprising administering to a subject in need thereof a composition comprising an isolated peptide of SEQ ID NO: 1.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: December 3, 2024
    Assignee: GemVax & KAEL Co., Ltd.
    Inventors: Sang Jae Kim, Kyung Hee Kim, Kyu-Yong Lee, Seong-Ho Koh, Hyun-Hee Park, Sung Jin Huh, Woo Jin Lee, Bum Joon Kim
  • Patent number: 12146710
    Abstract: A substrate treating apparatus and a substrate treating system including the same are disclosed, in which the number of heat treatment chambers such as anneal chambers may be varied. The substrate treating apparatus includes a first chamber heat-treating a substrate; and a second chamber treating the substrate in another way different from heat-treatment, wherein the number of the first chambers is varied depending on the number of the second chambers that need heat treatment for the substrate.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: November 19, 2024
    Assignee: SEMES Co., Ltd.
    Inventors: Young Je Um, Joun Taek Koo, Wan Jae Park, Dong Hun Kim, Seong Gil Lee, Ji Hwan Lee, Dong Sub Oh, Myoung Sub Noh, Du Ri Kim
  • Patent number: 12142492
    Abstract: A method for processing a substrate includes providing the substrate, a film being formed on the substrate, performing pretreatment to surface-treat the film formed on the substrate using a treatment gas in a plasma state, and performing, after the pretreatment, liquid treatment to remove the film from the substrate by supplying a treatment liquid onto the substrate.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: November 12, 2024
    Assignee: SEMES CO., LTD.
    Inventors: Ji-Hwan Lee, Seong Gil Lee, Dong Sub Oh, Myoungsub Noh, Dong-Hun Kim, Wan Jae Park
  • Publication number: 20240371986
    Abstract: Embodiments of the present disclosure relate to a quantum device including moderate fluorinated graphene and a method for fabricating the same. According to an exemplary embodiment of the present disclosure, there is provided a quantum device including moderate fluorinated graphene, the quantum device including a substrate, a first insulating layer located on the substrate, a graphene layer located on the first insulating layer, and a second insulating layer located on the graphene layer and covering a third region excluding a first region and second region on both sides of the graphene layer, in which the first region and second region of the graphene layer are formed of moderate fluorinated graphene, and a metal layer is formed on the first region and the second region, and the metal layer makes contact at some locations on the moderate fluorinated graphene.
    Type: Application
    Filed: May 3, 2024
    Publication date: November 7, 2024
    Inventors: Young Jae PARK, Seong Jun KIM, Hoon Kyu SHIN, Gil Ho LEE, Chae Gun LEE, Seung Hyun SHIN
  • Patent number: 12131978
    Abstract: The present invention improves a heat dissipation property of a semiconductor device by transferring hexagonal boron nitride (hBN) with a two-dimensional nanostructure to the semiconductor device. A semiconductor device of the present invention includes a substrate having a first surface and a second surface, a semiconductor layer formed on the first surface of the substrate, an hBN layer formed on at least one surface of the first surface and the second surface of the substrate, and a heat sink positioned on the second surface of the substrate. A radiation rate of heat generated during driving of an element is increased to decrease a reduction in lifetime of a semiconductor device due to a temperature increase. The semiconductor device has a structure and configuration which are very effective in improving a rapid temperature increase due to heat generated by high-power semiconductor devices.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: October 29, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Il Gyu Choi, Seong Il Kim, Hae Cheon Kim, Youn Sub Noh, Ho Kyun Ahn, Sang Heung Lee, Jong Won Lim, Sung Jae Chang, Hyun Wook Jung
  • Publication number: 20240341189
    Abstract: Disclosed are a polycyclic compound with a specific fused ring structure and an organic light emitting device including a light emitting layer that employs the polycyclic compound. The use of the polycyclic compound ensures significantly long lifetime and improved luminous efficiency of the device.
    Type: Application
    Filed: March 27, 2024
    Publication date: October 10, 2024
    Inventors: Ji-hwan Kim, Kyung-Hwa Park, Hyeon-jun Jo, Seong-eun Woo, Soo-kyung Kang, Da-Yeon Lee, Hui-Jae Choi, Ji-hyun Lee, Sung-hoon Joo
  • Patent number: 12110897
    Abstract: A fan motor for a vacuum cleaner includes a motor mount defining a cooling flow path inlet, an impeller, an impeller cover defining an air inlet, an air discharge opening defined at the motor mount and configured to discharge air to an outer space of the motor mount, and a cooling flow path outlet defined vertically above the motor mount. The cooling flow path inlet is configured to introduce air from the outer space of the motor mount into an inner space of the motor mount to cool the motor part, and the cooling flow path outlet is configured to discharge air from the inner space of the motor mount toward a space that is defined between the impeller and the air discharge opening based on the space between the impeller and the air discharge opening having a lower pressure than the inner space of the motor mount.
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: October 8, 2024
    Assignee: LG Electronics Inc.
    Inventors: Jeong Ho Lee, Seong-Jae Kim, Seung Jo Baek, Young Gyu Jung, Hak Kyu Choi, Seong-Ho Cho
  • Publication number: 20240320981
    Abstract: An embodiment provides an apparatus for determining a vehicle boarding possible area for a driving image using a artificial neural network, including: an image segmentation module that obtains a driving image for a driving direction of a vehicle from a camera module and segments the driving image into a plurality of image strips; a pre-trained boarding availability classification artificial neural network module that uses the image strip as input information and boarding availability information for the image strip as output information; a feature extraction module that extracts an activation map including feature information on the image strip from the boarding availability classification artificial neural network module; and an area information generation module that generates boarding possible area information for the image strip based on the feature information included in the activation map.
    Type: Application
    Filed: September 8, 2021
    Publication date: September 26, 2024
    Inventors: Seung Jae LEE, Aidyn ZHAKATAYEV, Seong Gyun JEONG
  • Publication number: 20240312563
    Abstract: The present invention relates to a method for preparing a multi-analytical prediction model for cancer diagnosis and a method of providing information for cancer diagnosis using the same. The method of preparing a multi-analytical prediction model for cancer diagnosis according to one embodiment of the present invention and the method of providing information for cancer diagnosis using the prediction model have advantages in that it is possible to diagnose cancer with high accuracy and sensitivity and to diagnose cancer at an early stage.
    Type: Application
    Filed: August 17, 2022
    Publication date: September 19, 2024
    Applicant: IMB Dx, Inc.
    Inventors: Seong Mun JEONG, Wook Jae LEE, Su Yeon KIM, Hwang Phill KIM, Sung Tae MOON, Tae You KIM
  • Publication number: 20240299970
    Abstract: A slot die coater that includes a lower die block having a manifold, an upper die block, and a shim plate interposed between the lower die block and the upper die block to form a slot. The manifold configured to accommodate a coating solution, wherein the coating solution is delivered and coated on a substrate through an exit port in communication with the slot. The shim plate includes a plate-shaped member having an open portion which is cut in at least an area to determine a coating width of a coating layer coated on the substrate, and a structure protruding from the plate-shaped member and inserted into the manifold.
    Type: Application
    Filed: November 4, 2022
    Publication date: September 12, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Young-Joon Jo, Seong-Jae You, Taek-Soo Lee, Min-Hyuck Choi, Shin-Wook Jeon, Sang-Hoon Choy
  • Patent number: 12084909
    Abstract: A slim double-skin structure according to one aspect of the present invention may comprise: a window frame, an outer window sash frame provided on an outdoor side and coupled to the window frame, an outer glass provided on the outer window sash frame, an inner window sash frame provided on an indoor side and coupled to the window frame, an inner glass provided on the inner window sash frame, an awning film provided in a hollow layer formed between the outer glass and the inner glass to serve as a shading, and a case-type glass fixing frame which is provided in the outer window sash frame so as to be located in the hollow layer and fixes the outer glass to the outer window sash frame concurrently with building-in and guiding the awning film.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: September 10, 2024
    Assignees: Dong-A University Research Foundation For Industry-Academy Cooperation, GM CORP., Mirae Environmental Plan
    Inventors: Keon Ho Lee, Jurng Jae Yee, Seong Hoon Kee, Dong Keon Kim
  • Patent number: 12088104
    Abstract: An energy management system and a method of operation thereof are provided. The energy management system includes a receiver that receives power amount information indicating an amount of power generated by a first new and renewable energy power plant, an amount of power stored in a first energy storage device for the first new and renewable energy power plant, an amount of power generated by a second new and renewable energy power plant, and an amount of power stored in a second energy storage device for the second new and renewable energy power plant and a controller that determines an operation mode for each of the first energy storage device and the second energy storage device based on the received power amount information.
    Type: Grant
    Filed: February 15, 2024
    Date of Patent: September 10, 2024
    Assignee: EN TECHNOLOGIES INC.
    Inventors: Hyun Jae Kang, Seung Sig Nam, Tay Seek Lee, Seong Ho Yun, Hee Se Hong
  • Publication number: 20240286502
    Abstract: An embodiment integrated charging and discharging apparatus includes an outlet configured to be inserted into and engaged with an inlet of a vehicle and a gender configured to be inserted into a distal end of the outlet in a removable manner and configured to switch a charging state to a discharging state or the discharging state to the charging state.
    Type: Application
    Filed: July 18, 2023
    Publication date: August 29, 2024
    Inventors: Byung-Chul Sung, Woo-Won Jung, Seong-Jae Lee
  • Patent number: 12069824
    Abstract: A display apparatus including display panel, a rear case to cover a rear of the display panel and the rear case including a cable fixing hole to which a cable is fixed, a connector connected to the cable and fastened to the rear case so that the cable is connected to the rear case, a cable holder to surround a part of the cable and fixed to the cable fixing hole so that the cable is fixed to the rear case, and a clamp to fix the cable holder to the cable fixing hole, wherein the clamp includes a first hook to be fixed to the cable fixing hole, and a second hook having a different shape than a shape of the first hook and to be fixed to the cable fixing hole to have a greater fixing force than a fixing force of the first hook.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: August 20, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ki Hun Kim, Kyoung Hwan Kim, Seong Soo Kim, Won Kyu Park, Jin Park, Kyeong Jae Lee, Byeong Kyu Park
  • Publication number: 20240275168
    Abstract: An energy management system and a method of operation thereof are provided. The energy management system includes a receiver that receives power amount information indicating an amount of power generated by a first new and renewable energy power plant, an amount of power stored in a first energy storage device for the first new and renewable energy power plant, an amount of power generated by a second new and renewable energy power plant, and an amount of power stored in a second energy storage device for the second new and renewable energy power plant and a controller that determines an operation mode for each of the first energy storage device and the second energy storage device based on the received power amount information.
    Type: Application
    Filed: February 15, 2024
    Publication date: August 15, 2024
    Inventors: HYUN JAE KANG, SEUNG SIG NAM, TAY SEEK LEE, SEONG HO YUN, HEE SE HONG
  • Patent number: 12062365
    Abstract: An apparatus for training a dialogue summary model according to an embodiment includes a parameter transferer configured to transfer one or more learning parameter values of a pre-trained natural language processing model to a sequence-to-sequence-based dialogue summary model, and a model trainer configured to train the dialogue summary model by using the transferred learning parameter values as initial values for learning parameters of each of an encoder and a decoder in the dialogue summary model.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: August 13, 2024
    Assignee: SAMSUNG SDS CO., LTD.
    Inventors: Hyun Jae Lee, Hyun Jin Choi, Jae Woong Yun, Ju Dong Kim, Bong Kyu Hwang, Seong Ho Joe, Young June Gwon
  • Publication number: 20240266251
    Abstract: A direct cooling type semiconductor package unit includes a substrate made of a material capable of manufacturing a semiconductor device, and having a material layer for forming the semiconductor device stacked on one side of the substrate, and a flow channel through which a cooling fluid flows formed on the other side of the substrate to enable direct cooling of the semiconductor device using the cooling fluid; a packaging block disposed at a position spaced apart from the substrate for packaging the semiconductor device, and having an electrode electrically connected to the semiconductor device through wiring and placed thereon to be insulated; a heat sink unit disposed on a lower side of the packaging block and having a fluid movement region formed at a position corresponding to a flow channel of the substrate; and a thin film type structure disposed between the substrate and the heat sink unit for coupling between the substrate and the heat sink unit and being moldable to have pattern structures of variou
    Type: Application
    Filed: February 4, 2024
    Publication date: August 8, 2024
    Inventors: Jun Rae PARK, Min Soo KANG, Hae Cheon KIM, Hyoung Soon LEE, Sung Jae CHANG, Hyun Wook JUNG, Il Gyu CHOI, Seong Il KIM, Sang Heung LEE, Ho Kyun AHN, Jong Won LIM
  • Publication number: 20240266253
    Abstract: Provided is a direct cooling device for an integrated circuit configured to form a direct cooling portion with a flow channel through which cooling fluid may flow in a through via hole of a substrate constituting the integrated circuit, and to couple the substrate to a heat sink unit through a bonding portion formed integrally with the direct cooling portion, unlike the prior art in which only a ground circuit is possible through the through via hole, which derives the effect of increasing product reliability due to improved thermal management efficiency of the integrated circuit by directly cooling the semiconductor device as well as the ground circuit, and the effect of simplifying and miniaturizing the structure by implementing the cooling function using a circuit for grounding the semiconductor device even without forming an additional flow path structure for cooling the semiconductor device.
    Type: Application
    Filed: February 4, 2024
    Publication date: August 8, 2024
    Inventors: Min Soo KANG, Jun Rae PARK, Hae Cheon KIM, Hyoung Soon LEE, Sung Jae CHANG, Hyun Wook JUNG, Il Gyu CHOI, Seong Il KIM, Sang Heung LEE, Ho Kyun AHN, Jong Won LIM