Abstract: A front end module includes a base filter configured to operate as a bandpass filter passing a pass band of an input radio frequency signal; a switch connected to the base filter, and a first notch filter and a second notch filter selectively connected to the base filter through the switch, wherein a stop band of the first notch filter and a stop band of the second notch filter overlap the pass band of the base filter in a band equal to or higher than a center frequency of the pass band of the base filter.

Abstract: A front end module includes: a first antenna terminal; a second antenna terminal; a switch including a plurality of first side terminals on a first side and a plurality of second side terminals on a side opposite to the first side, each of the first side terminals being connected to one of the first antenna terminal and the second antenna terminal; a first filter connected to the first antenna terminal; a second filter connected to the first antenna terminal; a third filter connected to one of the second side terminals; and a fourth filter connected to one of the second side terminals. The third filter and the fourth filter are connected to one of the first antenna terminal and the second antenna terminal.

Abstract: A frontend module includes a first filter having a passband of a first frequency band, a second filter having a passband of a second frequency band, the second frequency band being higher than the first frequency band, a third filter having a passband of a third frequency band, the third frequency band being higher than the second frequency band, and a sub-filter, connected to the second filter, configured to provide attenuation characteristics for the first frequency band, wherein the second filter comprises a plurality of parallel LC resonance circuits arranged between a ground and different nodes, from among a plurality of nodes between a first terminal and a second terminal, wherein an inductor is connected to a portion of the plurality of parallel LC resonance circuits.

Abstract: An acoustic resonator filter package includes an acoustic resonator including a piezoelectric layer, a first electrode disposed on a first surface of the piezoelectric layer, and a second electrode disposed on a second surface of the piezoelectric layer; a first substrate having an upper surface on which the acoustic resonator is disposed, the first substrate comprising a first coupling member surrounding the acoustic resonator; a filter spaced apart from the acoustic resonator in an upward direction; a second substrate having a lower surface on which the filter is disposed, the second substrate including a second coupling member disposed above the first coupling member; and a connection member connecting the first coupling member and the second coupling member to each other, the connection member being made of a material different from a material of which the first coupling member and the second coupling member are made.

Abstract: A frontend module includes an antenna terminal, and a duplexer including a first filter connected to the antenna terminal and a first terminal, configured to perform cellular communications within a 3.3 GHz to 4.2 GHz band, and a second filter connected to the antenna terminal and a second terminal, configured to perform Wi-Fi communications within a 5.15 GHz to 5.950 GHz band, wherein each of the first filter and the second filter includes an LC filter, and a portion of an operating time period of the first filter overlaps a portion of an operating time period of the second filter.

Abstract: A front end module includes: a first filter and a second filter, the first filter and the second filter being configured to respectively support cellular communications in different frequency bands among a first frequency band and a second frequency band of a sub-6 GHz band; a third filter configured to support Wi-Fi communications in a third frequency band of a 5 GHz band, and having one end connected to an antenna terminal; and a switch configured to selectively connect one end of the first filter and one end of the second filter to the antenna terminal.

Abstract: A high pass filter includes: a first resonant circuit including an inductor and a capacitor in parallel between first and second terminals; a second resonant circuit including an inductor and a capacitor in series between a first end of the first resonant circuit and a ground; a third resonant circuit including an inductor and a capacitor in series between a second end of the first resonant circuit and the ground; a fourth resonant circuit disposed between the first end of the first resonant circuit and the first terminal, and including a first acoustic resonator; and a fifth resonant circuit disposed between the second end of the first resonant circuit and the second terminal, and including a second acoustic resonator. Attenuation regions respectively formed by the first, second, and third resonant circuits are arranged in lower frequency regions than attenuation regions respectively formed by the fourth and fifth resonant circuits.

Abstract: A band pass filter includes: a first circuit unit including a first series LC resonant circuit disposed between a first terminal and a second terminal; a second circuit unit disposed between the first circuit unit and the second terminal, and including a first parallel LC resonant circuit; and a third circuit unit disposed between the first terminal and a ground, and including a second series LC resonant circuit, wherein a resonant frequency of the first circuit unit is in a pass band.

Abstract: A front end module includes a base filter configured to operate as a bandpass filter passing a pass band of an input radio frequency signal; a switch connected to the base filter, and a first notch filter and a second notch filter selectively connected to the base filter through the switch, wherein a stop band of the first notch filter and a stop band of the second notch filter overlap the pass band of the base filter in a band equal to or higher than a center frequency of the pass band of the base filter.

Abstract: A band pass filter includes: a first circuit unit including a first series LC resonant circuit disposed between a first terminal and a second terminal; a second circuit unit disposed between the first circuit unit and the second terminal, and including a first parallel LC resonant circuit; and a third circuit unit disposed between the first terminal and a ground, and including a second series LC resonant circuit, wherein a resonant frequency of the first circuit unit is in a pass band.

Abstract: A radio frequency switch circuit is described including a radio frequency switch and a coupler. The radio frequency switch includes a first band switch circuit connected between a first signal port and a common port, and configured to switch a first band signal. The coupler includes a first coupling wiring, disposed adjacent to a signal wiring formed between the common port of the radio frequency switch and an antenna port, and configured to form a first coupling signal with the signal wiring. A resonant frequency of the first coupling wiring is based on an inductance of the first coupling wiring and a capacitance of the radio frequency switch.

Abstract: A high pass filter includes: a first resonant circuit including an inductor and a capacitor in parallel between first and second terminals; a second resonant circuit including an inductor and a capacitor in series between a first end of the first resonant circuit and a ground; a third resonant circuit including an inductor and a capacitor in series between a second end of the first resonant circuit and the ground; a fourth resonant circuit disposed between the first end of the first resonant circuit and the first terminal, and including a first acoustic resonator; and a fifth resonant circuit disposed between the second end of the first resonant circuit and the second terminal, and including a second acoustic resonator. Attenuation regions respectively formed by the first, second, and third resonant circuits are arranged in lower frequency regions than attenuation regions respectively formed by the fourth and fifth resonant circuits.

Abstract: A semiconductor package includes a ground electrode formed on an upper surface of a substrate, a first electronic component disposed on the upper surface of the substrate, a sealing member sealing the electronic component, and a shielding member surrounding the first electronic component and disposed in the sealing member.

Abstract: A variable inductance inductor includes an inductor unit having a coil pattern; and at least one inductance controlling unit configured to vary a contact area between the coil pattern and a moveable conductor unit to change a current path.

Abstract: A radio frequency switch apparatus includes switching circuits connected between respective signal terminals and an antenna terminal. Each of the switching circuits includes a series switching circuit and a shunt switching circuit configured to switch a signal band on and off. An inductor circuit includes an inductor device connected between at least one shunt switching circuit of the switching circuits and a ground. The inductor device suppresses noise and passes the signal band by being resonant with a capacitance present upon the shunt switching circuit being turned off.

Abstract: A bulk-acoustic wave filter device includes: a first substrate; a first filter disposed on the first substrate, within a cavity of the bulk-acoustic wave filter device; a second substrate coupled to the first substrate; a second filter disposed on the second substrate, within the cavity and facing the first filter; a first inductor layer disposed on the first substrate and around the first filter; a second inductor layer disposed on the second substrate and around the second filter, and bonded to the first inductor layer; and a sealing member sealing the cavity, together with the first and second inductor layers.

Abstract: A radio frequency switch circuit is described including a radio frequency switch and a coupler. The radio frequency switch includes a first band switch circuit connected between a first signal port and a common port, and configured to switch a first band signal. The coupler includes a first coupling wiring, disposed adjacent to a signal wiring formed between the common port of the radio frequency switch and an antenna port, and configured to form a first coupling signal with the signal wiring. A resonant frequency of the first coupling wiring is based on an inductance of the first coupling wiring and a capacitance of the radio frequency switch.

Abstract: A semiconductor package includes a ground electrode formed on an upper surface of a substrate, a first electronic component disposed on the upper surface of the substrate, a sealing member sealing the electronic component, and a shielding member surrounding the first electronic component and disposed in the sealing member.

Abstract: A radio frequency switch circuit is described including a radio frequency switch and a coupler. The radio frequency switch includes a first band switch circuit connected between a first signal port and a common port, and configured to switch a first band signal. The coupler includes a first coupling wiring, disposed adjacent to a signal wiring formed between the common port of the radio frequency switch and an antenna port, and configured to form a first coupling signal with the signal wiring. A resonant frequency of the first coupling wiring is based on an inductance of the first coupling wiring and a capacitance of the radio frequency switch.

Abstract: A hybrid inductor includes a board, a first inductor provided in the board and including conductive patterns disposed at different heights, and a second inductor mounted on the board and an end of the second inductor being connected to the conductive patterns. Since mutual inductance is generated, inductance higher than a capacity value of a single inductor may be obtained.