Patents by Inventor Seong-Ku Kim

Seong-Ku Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11163412
    Abstract: A touch sensor may include a substrate and may include electrode units, first demultiplexers, second demultiplexers, and driving pads all located on the substrate. The electrode units each may include a plurality of electrode groups, the electrode groups each including a plurality of touch electrodes. The first demultiplexers each may include a plurality of sub-demultiplexers and each may be electrically connected to a corresponding one of the electrode units. Each of the sub-demultiplexers of a first demultiplexer may be electrically connected to a corresponding one of the electrode groups of a corresponding electrode unit. The second demultiplexers may be connected between the first demultiplexers and the driving pads.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: November 2, 2021
    Inventors: Hwa Jeong Kim, Jae Sic Lee, Na Yun Kwak, Dong Hwan Kim, Seung Woo Sung, Min Kyu Woo, Min Ku Lee, Seong Jun Lee, Sang Jin Pak, Sang Hyun Jun
  • Patent number: 8789266
    Abstract: An apparatus for manufacturing electronic parts is provided. The apparatus includes a head unit installed on a main body and configured to move up and down, a nozzle unit installed on the head unit and configured to move up and down, and a positioning unit sequentially displacing the head unit and the nozzle unit to a position where the electronic parts are on standby to suction the electronic parts using the nozzle unit. Thus, when the head unit is used to suction the electronic parts on standby at a standby position of the electronic parts, the head unit and the nozzle unit installed on the head unit are sequentially lowered, so that it is possible to relieve an impact occurring when the electronic parts are suctioned to the ends of nozzles.
    Type: Grant
    Filed: July 22, 2010
    Date of Patent: July 29, 2014
    Assignee: Samsung Techwin Co., Ltd.
    Inventor: Seong-Ku Kim
  • Patent number: 8359735
    Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: January 29, 2013
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Jong-Eok Ban, Seong-Ku Kim
  • Publication number: 20110030200
    Abstract: An apparatus for manufacturing electronic parts is provided. The apparatus includes a head unit installed on a main body and configured to move up and down, a nozzle unit installed on the head unit and configured to move up and down, and a positioning unit sequentially displacing the head unit and the nozzle unit to a position where the electronic parts are on standby to suction the electronic parts using the nozzle unit. Thus, when the head unit is used to suction the electronic parts on standby at a standby position of the electronic parts, the head unit and the nozzle unit installed on the head unit are sequentially lowered, so that it is possible to relieve an impact occurring when the electronic parts are suctioned to the ends of nozzles.
    Type: Application
    Filed: July 22, 2010
    Publication date: February 10, 2011
    Applicant: SAMSUNG TECHWIN CO., LTD.
    Inventor: Seong-Ku KIM
  • Publication number: 20100263203
    Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.
    Type: Application
    Filed: April 16, 2010
    Publication date: October 21, 2010
    Applicant: SAMSUNG TECHWIN CO., LTD.
    Inventors: Jong-Eok BAN, Seong-Ku KIM
  • Patent number: 7810635
    Abstract: A substrate transfer apparatus and a method of driving the same includes a first guide block and a second guide block, and a single ball screw shaft connected to the first and second guide blocks moves the guide blocks in an axial direction thereof. A first drive unit rotates the ball screw shaft to concurrently move the pair of guide blocks, and a second drive unit connected to the second guide block separately moves the second guide block with respect to the first guide block.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: October 12, 2010
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Seong-Ku Kim, Jong-Eok Ban
  • Publication number: 20080159833
    Abstract: Provided are a printed circuit board (PCB) transferring apparatus for a chip mounter, and a PCB transferring method using the PCB transferring apparatus. The PCB transferring apparatus includes: a base; first and second work lanes configured on the base to be parallel with each other for transferring and supporting PCBs; and a transferring unit configured in between the first and second work lanes for transferring wider PCBs.
    Type: Application
    Filed: June 21, 2007
    Publication date: July 3, 2008
    Applicant: Samsung Techwin Co., Ltd.
    Inventors: Je-pil Lee, Seong-ku Kim
  • Publication number: 20080092680
    Abstract: A substrate transfer apparatus and a method of driving the same includes a first guide block and a second guide block, and a single ball screw shaft connected to the first and second guide blocks moves the guide blocks in an axial direction thereof. A first drive unit rotates the ball screw shaft to concurrently move the pair of guide blocks, and a second drive unit connected to the second guide block separately moves the second guide block with respect to the first guide block.
    Type: Application
    Filed: October 16, 2007
    Publication date: April 24, 2008
    Applicant: Samsung Techwin Co., Ltd.
    Inventors: Seong-Ku Kim, Jong-Eok Ban