Abstract: An apparatus for manufacturing electronic parts is provided. The apparatus includes a head unit installed on a main body and configured to move up and down, a nozzle unit installed on the head unit and configured to move up and down, and a positioning unit sequentially displacing the head unit and the nozzle unit to a position where the electronic parts are on standby to suction the electronic parts using the nozzle unit. Thus, when the head unit is used to suction the electronic parts on standby at a standby position of the electronic parts, the head unit and the nozzle unit installed on the head unit are sequentially lowered, so that it is possible to relieve an impact occurring when the electronic parts are suctioned to the ends of nozzles.

Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.

Abstract: An apparatus for manufacturing electronic parts is provided. The apparatus includes a head unit installed on a main body and configured to move up and down, a nozzle unit installed on the head unit and configured to move up and down, and a positioning unit sequentially displacing the head unit and the nozzle unit to a position where the electronic parts are on standby to suction the electronic parts using the nozzle unit. Thus, when the head unit is used to suction the electronic parts on standby at a standby position of the electronic parts, the head unit and the nozzle unit installed on the head unit are sequentially lowered, so that it is possible to relieve an impact occurring when the electronic parts are suctioned to the ends of nozzles.

Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.

Abstract: A substrate transfer apparatus and a method of driving the same includes a first guide block and a second guide block, and a single ball screw shaft connected to the first and second guide blocks moves the guide blocks in an axial direction thereof. A first drive unit rotates the ball screw shaft to concurrently move the pair of guide blocks, and a second drive unit connected to the second guide block separately moves the second guide block with respect to the first guide block.

Abstract: Provided are a printed circuit board (PCB) transferring apparatus for a chip mounter, and a PCB transferring method using the PCB transferring apparatus. The PCB transferring apparatus includes: a base; first and second work lanes configured on the base to be parallel with each other for transferring and supporting PCBs; and a transferring unit configured in between the first and second work lanes for transferring wider PCBs.

Abstract: A substrate transfer apparatus and a method of driving the same includes a first guide block and a second guide block, and a single ball screw shaft connected to the first and second guide blocks moves the guide blocks in an axial direction thereof. A first drive unit rotates the ball screw shaft to concurrently move the pair of guide blocks, and a second drive unit connected to the second guide block separately moves the second guide block with respect to the first guide block.