Patents by Inventor Seong Kwang Brandon Kim

Seong Kwang Brandon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip ball grid array package and method of manufacture
    Patent number: 7851899
    Abstract: A BGA package is disclosed including a base IC structure having a base substrate, with an opening running length-wise there through. A first semiconductor chip is mounted face-down on the base substrate so the bond pads thereof are accessible through the opening. The package also includes a secondary IC structure including a secondary substrate, having an opening running there through, and a second semiconductor chip. The second chip is mounted face-down on the secondary substrate so that the bond pads thereof are accessible through the opening in the secondary substrate. An encapsulant fills the opening in the secondary substrate and forms a substantially planar surface over the underside of the secondary substrate. The substantially planar surface is mounted to the first chip of the base IC structure through an adhesive. Wires connect a conductive portion of the secondary IC structure to a conductive portion of the base IC structure.
    Type: Grant
    Filed: April 2, 2004
    Date of Patent: December 14, 2010
    Assignees: UTAC - United Test and Assembly Test Center Ltd., Infineon Technologies
    Inventors: Fung Leng Chen, Seong Kwang Brandon Kim, Wee Lim Cha, Yi-Sheng Anthony Sun, Wolfgang Hetzel, Jochen Thomas
  • Cavity chip package
    Patent number: 7339278
    Abstract: A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: March 4, 2008
    Assignee: United Test and Assembly Center Ltd.
    Inventors: Henry Iksan, Seong Kwang Brandon Kim, Susanto Tanary, Hien Boon Tan, Yi Sheng Anthony Sun
  • CAVITY CHIP PACKAGE
    Publication number: 20070069371
    Abstract: A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.
    Type: Application
    Filed: September 28, 2006
    Publication date: March 29, 2007
    Applicant: UNITED TEST AND ASSEMBLY CENTER LTD.
    Inventors: Henry IKSAN, Seong Kwang Brandon KIM, Susanto TANARY, Hien Boon TAN, Yi Sheng Anthony SUN