Abstract: A method of manufacturing a semiconductor package includes: forming a strip substrate including a plurality of unit substrates, each being provided with a first connection pad and a second connection pad on a first surface of the unit substrate and each unit substrate being electrically and physically isolated from each other with the intervention of saw lines, first ground connection pads formed on the respective unit substrates, each of the first ground connection pads being electrically coupled with the first connection pad over the respective unit substrates, second ground connection pads formed on the saw line on the first surface side of the unit substrates and electrically isolated from the unit substrates, and test wiring formed on the saw line, the test wiring being electrically isolated from the unit substrates and electrically coupled with the second ground connection pads; and attaching semiconductor chips onto the respective unit substrates.

Abstract: A method of manufacturing a semiconductor package includes: forming a strip substrate including a plurality of unit substrates, each being provided with a first connection pad and a second connection pad on a first surface of the unit substrate and each unit substrate being electrically and physically isolated from each other with the intervention of saw lines, first ground connection pads formed on the respective unit substrates, each of the first ground connection pads being electrically coupled with the first connection pad over the respective unit substrates, second ground connection pads formed on the saw line on the first surface side of the unit substrates and electrically isolated from the unit substrates, and test wiring formed on the saw line, the test wiring being electrically isolated from the unit substrates and electrically coupled with the second ground connection pads; and attaching semiconductor chips onto the respective unit substrates.

Abstract: A semiconductor package and a fabrication method thereof can enhance adhesion between a solder and a package body by employing an irregular metal pattern, and improve stability. The semiconductor package includes a semiconductor substrate; a plurality of chip pads separately formed on an upper surface of the semiconductor substrate; an irregular metal pattern electrically connected to the plurality of chip pads; and an external terminal electrically connected to the metal pattern. In addition, a method of fabricating the semiconductor package includes the steps of separately forming a plurality of chip pads on an upper surface of a semiconductor substrate; forming an irregular metal pattern electrically connected to the plurality of chip pads; and forming an external terminal electrically connected to the metal of chip pads; and forming an external terminal electrically connected to the metal pattern.