Abstract: An image sensing device includes a plurality of pixels, each pixel configured to respond to incident light to produce photocharges corresponding to the incident light and include a first sub-pixel and a second sub-pixel surrounding the first sub-pixel. The first sub-pixel is one of a color sub-pixel configured to selectively sense first color light within the incident light and a white sub-pixel configured to sense the incident light at different colors; and the second sub-pixel is the other of the color sub-pixel and the white sub-pixel.

Abstract: A semiconductor manufacturing device, according to the present invention, comprises a load port unit, a substrate transfer unit, and a processing unit sequentially arranged along a transfer path of a semiconductor substrate, wherein the load port unit has a load door relatively movable with respect to the substrate transfer unit while being accommodated in the substrate transfer unit, and an air introduction path for connecting the inside and the outside of the substrate transfer unit under the load door; and the substrate transfer unit has a substrate processing module for communicating with the load port unit and the processing unit while limiting a processing space of the semiconductor substrate, and an air supply module positioned on the substrate processing module so as to supply dry, purified air to the substrate processing module.