Abstract: A semiconductor manufacturing device, according to the present invention, comprises a load port unit, a substrate transfer unit, and a processing unit sequentially arranged along a transfer path of a semiconductor substrate, wherein the load port unit has a load door relatively movable with respect to the substrate transfer unit while being accommodated in the substrate transfer unit, and an air introduction path for connecting the inside and the outside of the substrate transfer unit under the load door; and the substrate transfer unit has a substrate processing module for communicating with the load port unit and the processing unit while limiting a processing space of the semiconductor substrate, and an air supply module positioned on the substrate processing module so as to supply dry, purified air to the substrate processing module.