Patents by Inventor Seong Min Chin

Seong Min Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240075905
    Abstract: The present invention relates to a coating composition which is for a wiper blade and is for forming a coating layer for lowering the coefficient of friction of a wiper blade rubber base on glass, the coating composition including a lubricant additive and a solvent, wherein the lubricant additive is functionalized graphene capable of self-adhesion to the wiper blade rubber base.
    Type: Application
    Filed: March 30, 2021
    Publication date: March 7, 2024
    Applicant: BESTGRAPHENE CO., LTD
    Inventors: Myeong Gi KIM, Seong Min CHIN, Sung Min HONG, Ji Taek OH, Jung Hoon KIM
  • Patent number: 11004611
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: May 11, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yu Ra Shin, Myeong Gi Kim, Eung Soo Kim, Hak Kwan Kim, Jang Yeol Lee, Seong Min Chin
  • Patent number: 10892092
    Abstract: A conductive powder for an internal electrode includes a metal particle; and a graphene layer or an oxidized graphene layer disposed on at least a portion of a surface of the metal particle.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: January 12, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myeong Gi Kim, Yu Ra Shin, Jang Yeol Lee, Seong Min Chin, Hak Kwan Kim
  • Publication number: 20200357576
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 12, 2020
    Inventors: Yu Ra SHIN, Myeong Gi KIM, Eung Soo KIM, Hak Kwan KIM, Jang Yeol LEE, Seong Min CHIN
  • Patent number: 10763044
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: September 1, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yu Ra Shin, Myeong Gi Kim, Eung Soo Kim, Hak Kwan Kim, Jang Yeol Lee, Seong Min Chin
  • Publication number: 20190341192
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Application
    Filed: July 19, 2019
    Publication date: November 7, 2019
    Inventors: Yu Ra SHIN, Myeong Gi KIM, Eung Soo KIM, Hak Kwan KIM, Jang Yeol LEE, Seong Min CHIN
  • Patent number: 10403436
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: September 3, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yu Ra Shin, Myeong Gi Kim, Eung Soo Kim, Hak Kwan Kim, Jang Yeol Lee, Seong Min Chin
  • Patent number: 10290423
    Abstract: A conductive powder for an internal electrode includes a metal particle; and a graphene layer or an oxidized graphene layer disposed on at least a portion of a surface of the metal particle.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: May 14, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myeong Gi Kim, Yu Ra Shin, Jang Yeol Lee, Seong Min Chin, Hak Kwan Kim
  • Patent number: 10176926
    Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to face each other with at least one among the plurality of dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part. The inductor and the capacitor are coupled to each other by an adhesive containing a first epoxy resin including a urethane modified epoxy (UME) resin, a second epoxy resin including a bisphenol A type resin, and a latent curing agent.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: January 8, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Min Chin, Je Ik Moon, Ye Eun Jung
  • Publication number: 20180174756
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Application
    Filed: August 11, 2017
    Publication date: June 21, 2018
    Inventors: Yu Ra SHIN, Myeong Gi KIM, Eung Soo KIM, Hak Kwan KIM, Jang Yeol LEE, Seong Min CHIN
  • Publication number: 20180144863
    Abstract: A conductive powder for an internal electrode includes a metal particle; and a graphene layer or an oxidized graphene layer disposed on at least a portion of a surface of the metal particle.
    Type: Application
    Filed: March 2, 2017
    Publication date: May 24, 2018
    Inventors: Myeong Gi KIM, Yu Ra SHIN, Jang Yeol LEE, Seong Min CHIN, Hak Kwan KIM
  • Patent number: 9852836
    Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a core substrate having a conductive pattern on the surface and a magnetic layer for covering the core substrate not to expose the conductive pattern, wherein the magnetic layer is made of a metal-polymer composite and has a multilayer structure.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: December 26, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Moon Soo Park, Seong Min Chin, Hwan Soo Lee, Hye Yeon Cha
  • Patent number: 9583251
    Abstract: There is provided a chip electronic component including: a magnetic body containing magnetic metal powder particles and a thermosetting resin; an internal coil part embedded in the magnetic body; and a surface protection layer with which a surface of the magnetic body is coated. The surface protection layer may prevent a plating spreading phenomenon occurring on a surface of the chip electronic component at the time of forming external electrodes.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: February 28, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Ik Moon, Sung Soo Kim, Tae Young Kim, Ye Eun Jeong, Jong Hun Kim, Seong Min Chin
  • Publication number: 20160343509
    Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to face each other with at least one among the plurality of dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part. The inductor and the capacitor are coupled to each other by an adhesive containing a first epoxy resin including a urethane modified epoxy (UME) resin, a second epoxy resin including a bisphenol A type resin, and a latent curing agent.
    Type: Application
    Filed: April 20, 2016
    Publication date: November 24, 2016
    Inventors: Seong Min CHIN, Je Ik MOON, Ye Eun JUNG
  • Publication number: 20160104578
    Abstract: The present invention relates to a multi-layer ceramic capacitor which includes a ceramic main body formed by stacking internal electrodes and dielectric layers alternately and an external electrode formed by stacking a coating layer and a plating layer on both ends of the ceramic main body sequentially, wherein the coating layer includes conductive metal powder and a(Si, B)-b(Li, K)-c(Ba, Ca)-d(Mn, V, Zn)-e(Ti, Sn, Zr, Al) component of glass frit (herein, 20?a?60, 10?b?35, 2?c?30, 2?d?20 and 0.5?e?30 mol %, a+b+c+d=100 mol %).
    Type: Application
    Filed: October 8, 2015
    Publication date: April 14, 2016
    Inventors: Bum Suk KANG, Su Jin LEE, Hew Young KIM, Hee Sang KANG, Woo Sup KIM, Seong Min CHIN
  • Publication number: 20160086714
    Abstract: There is provided a chip electronic component including: a magnetic body containing magnetic metal powder particles and a thermosetting resin; an internal coil part embedded in the magnetic body; and a surface protection layer with which a surface of the magnetic body is coated. The surface protection layer may prevent a plating spreading phenomenon occurring on a surface of the chip electronic component at the time of forming external electrodes.
    Type: Application
    Filed: April 14, 2015
    Publication date: March 24, 2016
    Inventors: Je Ik MOON, Sung Soo KIM, Tae Young KIM, Ye Eun JEONG, Jong Hun KIM, Seong Min CHIN
  • Publication number: 20140266543
    Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a core substrate having a conductive pattern on the surface and a magnetic layer for covering the core substrate not to expose the conductive pattern, wherein the magnetic layer is made of a metal-polymer composite and has a multilayer structure.
    Type: Application
    Filed: October 15, 2013
    Publication date: September 18, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Moon Soo PARK, Seong Min CHIN, Hwan Soo LEE, Hye Yeon CHA
  • Publication number: 20130000965
    Abstract: Disclosed herein are a dielectric composition of a multilayered circuit board including two types of inorganic fillers of 10 to 60 parts by weight with respect to an epoxy resin of 100 parts by weight, a multilayered printed circuit board including a dielectric layer manufactured of the dielectric composition, and a method for preparing the multilayered printed circuit board. According to the present invention, by mixing two types of inorganic fillers such as SiO2 and CaCO3 in manufacturing the dielectric layer of the multilayered circuit board, a high adhesive strength to a plating layer can be achieved without using a fluoride-based solution including 3NH4HF2 as an oxidant while etching the dielectric layer and furthermore, an environmentally hazardous substance can be prevented from being discharged.
    Type: Application
    Filed: May 11, 2012
    Publication date: January 3, 2013
    Inventors: Dong Joo SHIN, Seong Min Chin, Moon Soo Park, Sung Taek Lim, Sung Hyun Kim, Choon Keun Lee