Abstract: A curable composition is provided. The curable composition can eliminate or minimize the generation of bubbles inside the cured product after the initiation reaction of the curable monomer, prevent expansion of a material when used to encapsulate a device, and provide a uniform cured product to solve the problem of separation between the upper and lower substrates bonded together, thereby improving device encapsulation performance.

Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes taking in a substrate to a treating space to mount on a support unit; upwardly moving the support unit after mounting the substrate on the support unit; determining whether the support unit moves normally after the upwardly moving the support unit; and treating the substrate by generating a plasma in the treating space, and wherein at the determining whether the support unit moves normally, before the plasma is generated at the treating space at the treating the substrate, whether a pulse distance matching a predetermined distance data according to a pulse value of a driving unit which pulse-moves a moving body which moves the support unit in a top/down direction, matches a movement distance of the moving body is determined, and an interlock is generated if the pulse distance and the movement distance is different.